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Process Results (5) Request More Information
Am immersion gold deposit to produce a pure gold finish over a nickel substrate. Deposits are fine grain, with extremely low porosity.
- Fine grain low porosity deposit
- High tolerance for metallic contamination of copper, nickel and lead
- Sufficient thickness to maintain solderability
Oromerse SO is a cyanide free pure gold immersion deposit. Process plates up to 20 micro inches over nickel and electroless nickel.
- Non-cyanide immersion gold deposit
- Plates up to 20 micro inches over nickel and electroless nickel
Techni IM Gold AT6000
Self limiting immersion gold bath for optimum solderability.