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Process Results (4) Request More Information
TechniEtch AT 2000
PCB specific: Pre-clean.
TechniEtch AT 2000 is an ammonia-free, fine topography persulfate micro etch designed for use in pretreatment cycles for printed circuit boards and other copper surfaces.
Techni CU 85
PCB specific: Pre-Clean
Techni CU 85 is a heavy-duty ammonia free peroxysulfate micro etch specifically designed to deoxidize and/or activate copper surfaces prior to electroplating.
Techni ME 200
PCB specific: Liquid Micro etch, one component.
Techni ME 200 is a Liquid micro etch capable of uniform, copper removal. It can be used like any powder Micro etch used in the Printed Circuits Boards fabrication. It is 100% liquid and extremely stable even under low control.
PCB specific: Horizontal or vertical process for preparation of copper prior to resist application or prior to plating copper, tin or nickel.
TechniEtch 1118 is a proprietary ammonia-free, persulfate micro etch designed to provide improved topography over standard persulfate and peroxide chemistry at the same etch depth. This topography will improve resist, Solder Mask or plating adhesion.