Begin your search by selecting the Application, Process and Category or by specifying keyword(s)
Process Results (6) Request More Information
Circudep DM CC 124
PCB specific: Cleaner Conditioner for Direct Metallization.
CIRCUDEP DM CC 124 is a concentrated blend of surfactants and wetting agents designed to clean the copper foil surfaces of printed circuit boards. It contains conditioning agents which activate glass fibers and epoxy.
CIRCUDEP EC CC 18
PCB specific: Cleaner Conditioner for Electroless Copper process.
CIRCUDEP EC CC 18 contains conditioning agents which activate glass fibers, epoxy and other non- conductive materials, allowing for a reliable absorption of the palladium catalyst in Electroless Copper processing.
Circudep G 3500
PCB specific: Cleaner conditioner for metallization of rigid and flex PCBs.
CIRCUDEP G 3500 is the next-generation Alkaline Cleaner Conditioner designed for Graphite systems.
Techni X-Cell 318
PCB specific: Pattern Plate Pre-clean
Techni X-Cell 318 is a liquid acid cleaner formulated for the removal of oxides, fingerprints, light oils, and other soils from copper or copper alloys.
PCB specific: Acid cleaner, spay or soak.
TechniClean 207AP is a liquid low-foam acid cleaner formulated for the removal of oxides, fingerprints, light oils, and other soils from copper or copper alloys.
TechniClean TH 1020
PCB specific: Acid cleaner for ENIG & ENEPIG
TechniClean TH 1020 is an acidic NPTH cleaner designed to stop electroless nickel from depositing in non-plated through holes. It renders catalyst residues left behind by electroless copper processes inactive, stopping electroless nickel from depositing.