New Tin-Silver Alloy Electroplating Process
Cranston, RI, USA – Technic has announced the release of Technistan Ag, a new, patent pending, high speed tin-silver alloy electroplating process for use in electronic connector and component applications. Technistan Ag is designed to produce a 95% tin / 5% silver bright electrodeposit at current densities of up to 300 amps per square foot (300 ASF) / 30 amps per square decimeter (30 ASD). End users seeking more economical alternatives to traditional precious metal contact finishes like gold and palladium-nickel are in the beginning stages of conversion to low-cost finishes like silver. Tin/silver provides a compatible mating surface for these low-cost finishes. Until today there has been no viable high speed method for electronics manufacturers to implement electroplated tin-silver onto connectors or components.
Technistan Ag is also capable of producing other tin-silver alloy compositions, depending on application. Other than connectors, tin/silver deposits have also demonstrated improvements in a variety of end-use applications including whisker-resistant semiconductor components, lighting, and other energy applications.