Technic to Power Next-Generation Packaging at SEMICON Taiwan 2026
 

Technic will showcase its latest semiconductor process technologies at SEMICON Taiwan 2026, one of the world's leading events for semiconductor manufacturing and advanced packaging. Taking place September 2–4, 2026, at the Taipei Nangang Exhibition Center (TaiNEX) Halls 1 and 2 in Taipei, the exhibition brings together the global semiconductor supply chain to explore the innovations driving the next generation of microelectronics.

At Booth N0031, Technic's Semiconductor Division will present its latest innovations for advanced packaging and semiconductor manufacturing. Featured technologies include Elevate® copper electrodeposition chemistries engineered for redistribution layer (RDL), copper pillar, microbump, and through-silicon via (TSV) applications, along with TechniStrip®, TechniEtch®, and TechniClean™ process chemistries designed to improve reliability, maximize yields, and enhance manufacturing performance. The booth will also feature a physical RTA display that demonstrates Technic's advanced analytical and process-control capabilities for semiconductor manufacturing.

In addition to its main exhibit, Technic will participate in the France Pavilion this year, reflecting the growing collaboration between France and Taiwan across the semiconductor industry. Visitors interested in SEC-related products can visit Technic France's booth (R7324) in the France Pavilion, TaiNEX 2, 4F, for a more comprehensive introduction to these solutions.

With decades of expertise in metallization, process chemistry, and analytical control, Technic partners with leading semiconductor manufacturers, foundries, OSATs, and equipment suppliers worldwide. Its proven technologies support the industry's evolving demands for artificial intelligence (AI), high-performance computing, heterogeneous integration, and next-generation packaging by delivering the performance, reliability, and precision required for today's most advanced devices.

SEMICON Taiwan 2026 is expected to bring together more than 1,300 exhibitors, 4,300 booths, and over 100,000 industry professionals from around the world, providing a global platform for collaboration and showcasing the latest innovations shaping the future of semiconductor manufacturing.

Technic invites attendees to visit Booth N0031 to explore its advanced packaging solutions and RTA technology, and to stop by Technic France's Booth R7324 in the France Pavilion for a deeper look at its SEC-related product portfolio.
 

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