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Process Results (1) Request More Information

TechniEtch AC100F

Selective Au & Cu etchant.

Characteristics:
  • Highly effective & selective iodine based Au/Cu etchant.
  • PFAS-free formula.
  • Contains particular additives that greatly enhance stability.
  • Metal loading capability compared to conventional iodine-based solutions.
Availability: Asia Pacific, Europe
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Equipment Results (2) Request More Information

RTA

Analysis of organic & inorganic levels in acid copper plating solution

Characteristics:

The RTA is an automated, on-line, real-time, and in-tank system for monitoring and controlling the levels of chemical constituents of plating baths.

Availability: Asia Pacific
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Test Cell

Wafer plating test cell

Characteristics:

Fully operational, tabletop wafer plating cell for process testing and analysis.

Availability: North America, Asia Pacific, Europe
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