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Process Results (2) Request More Information

TechniEtch TBR19

Ti, TiN, and TiW Etchant.

Characteristics:
  • Barrier-layer remover for WLP applications.
  • Provides great process window resulting in minimal to zero undercut while etching both metals.
Availability: North America, Asia Pacific, Europe
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TechniEtch TBR38

Selective Ti & TiN etchant.

Characteristics:
  • Reclaimable Hâ‚‚Oâ‚‚-based Ti etchant in advanced UBM and Cu pillar integration materials.
  • Ti and TiN barrier etchant with high Al and Cu compatibility.
  • High stability and loading capacity.
Availability: North America, Asia Pacific, Europe
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Equipment Results (2) Request More Information

RTA

Analysis of organic & inorganic levels in acid copper plating solution

Characteristics:

The RTA is an automated, on-line, real-time, and in-tank system for monitoring and controlling the levels of chemical constituents of plating baths.

Availability: Asia Pacific
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Test Cell

Wafer plating test cell

Characteristics:

Fully operational, tabletop wafer plating cell for process testing and analysis.

Availability: North America, Asia Pacific, Europe
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