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PCB specific: Anti Tarnish for Copper.
Techni AT 66 contains a concentrated blend of copper oxide protection agents. It is added to the final rinse waters and will provide temporary tarnish protection for copper.
Upgrades, spare or replacement parts for all plating operations
DC rectifiers, PPR rectifiers, amp hour meters, heaters, filters, ultrasonics, spare parts, retrofits and upgrades.
Recovery of gold and silver
Gold reclaim system for in tank filter type.
Hoist systems for electroplating, electropolishing, chromating, cleaning, anodizing, phosphating and E-Coat.
Custom and turnkey design, vertical plating lines with complete automatic or semi-automatic operation.
Manual equipment and supplies for a variety of applications.
Complete manual plating lines are custom designed to meet customer specification.
Vertical high Speed plating Line for Flex and Rigid PCBs
Automatic PCB plater for Cu, Ni, Au. Full panel type and roll to roll. Reduce cost with improved distribution and reduced waste generation.
Roll to roll vertical processing system for flexible substrates.
Continuous roll to roll electroplating equipment designed to plate flexible and delicate substrates.
Analysis of organic & inorganic levels in acid copper plating solution
Patented instrument that utilizing a combination of AC & DC voltammetry for fast accurate measurement of copper, sulfuric and organic plating additives.
Insoluble anode system for acid copper plating.
Insoluble anode system that utilized a proprietary membrane to isolate the anode from the plating bath.
Insoluble Anode System
Technology to reduce additive consumption with insoluble anodes. The process utilizes a membrane to separate IrO mesh anodes from the plating solution. The system utilizes a special grade of CuO for maintaining copper level in the copper plating solution
All electroplating processes
Measurement of and replenishment of all electroplating solutions.
Rinse water recycling system
Rinse Water or wastewater reuse after purification and deionization.
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