Matt Black Solder Mask for Flexible, Fine Pitch, Direct Imaging
Cranston, RI, USA - Technic has announced the release of TechniFlex LCL1000F/423M, an extremely durable, direct imaging, fine pitch, matte black solder mask for flexible applications.
TechniFlex LCL 1000F/423M is ideally suited for demanding assembly conditions, including hot-bar soldering or multiple lead-free reflows. Extensive beta site testing of TechniFlex 423M has shown no cracking after multiple 180o bends, even when processing 12-micron polyimide substrate.
TechniFlex LCL 1000F/423M provides exceptionally fine resolution in a matte black product. With less than 10 microns of undercut, TechiFlex LCL1000F/423M consistently provides high resolution on 50-micron solder dams with excellent chemical resistance to ENIG, ENEPIG, Ag and Sn finishes. TechniFlex LCL 1000F/423M is available in two versions: U6 for direct imaging/manual exposure and U7 for either direct imaging/manual exposure or roll to roll coating operations.
Today’s cutting-edge flexible circuits require a strong yet flexible material that can withstand extremely high soldering temperatures and multiple bending cycles while still meeting very fine pitch requirements. Technic’s new TechniFlex LCL 1000F/423M makes processing these advanced flexible PCBs possible.
- Tom Horigome, Global Director of Imaging Products, Technic