ShareTechnic announces the release of the Techni Indium HS pure Indium plating process. This process is designed for use in the selective plating of press fit pin connectors in order to prevent the formation of harmful metallic whiskers.
Technic has performed extensive in-house and field testing of the Techni Indium HS process which has shown the electrolyte is very robust, with deposits that are exceptionally whisker resistant. The current density range of the process is extremely wide – 50 ASF to 250 ASF – with relatively low metal concentrations in the electrolyte. Unlike competitive processes, there is no need for an Indium strike when plating over nickel, which will minimize cost.
For more information on Techni Indium HS, please contact your local Technic representative or complete our online contact form.
