Powering the Future of 5G with Technic ISIG

 

As high-frequency demands continue to evolve, the PCB industry faces increasing pressure to maintain signal integrity, reliability, and performance across the full 5G spectrum. In this video, we explore how Technic’s ISIG technology addresses these challenges with a nickel-free final finish designed for next-generation applications.

We present an advanced immersion silver and immersion gold process engineered to enhance conductivity, protect copper integrity, and deliver consistent performance in high-speed, high-reliability PCB designs.


Products Featured

  • Technic ISIG – Nickel-free Immersion Silver / Immersion Gold final finish

  • TechniPad IS 7070 – Immersion silver solution used in the ISIG process

  • Technic AT 6600 – Specialized immersion gold process designed for silver surfaces
     

Key Benefits of Nickel-Free Final Finishes

  • Optimized for high-frequency performance across the full 5G spectrum

  • Nickel-free formulation, eliminating risks associated with nickel-based finishes

  • Cost-effective alternative to ENIG with reduced gold usage

  • Enhanced signal integrity and reduced insertion loss

  • Excellent solderability and gold wire bonding compatibility

  • Superior corrosion resistance, including protection against creep corrosion

  • Maintains copper integrity and prevents oxidation during processing

  • Compatible with advanced PCB designs, including thin traces and high-frequency architectures

Watch Video