Technical Blogs

Increased demands on reliability result in the implementation of more stringent requirements

One of the major functions of electroplated coatings is to increase the corrosion resistance of the substrate, such as the primary copper in circuit boards and connectors, or other layers onto which the coating is applied. In electronic applications, these coatings are also required to impart speci­fied electrical conductivity and wear resistance. Furthermore, the coating must enable attachment to other surfaces via soldering, physical insertion, etc.

5G and Creep Corrosion - Does it Matter? The short answer is, yes. But, as always, it's never that simple or devastating. First off, what is Creep Corrosion? It’s the growth of copper sulfide crystals on a PCB surface that can create an electrical short.

The inherent nature of almost all immersion silver formulas did little to control the chemical reaction resulting in an aggressive attack of the copper. The consequence was field failures due to creep corrosion, champagne voids in soldering, and complete opens due to etching through of traces. To completely eliminate these issues requires a wholesale change of the formulation.

Technic’s Black Knight - Graphite Direct Metallization Process
 

Introduction

With 5G rollouts around the globe, ENIG continues to hold on to first place in PCB final finishes. You would think with data published on how electroless nickel increases insertion loss, ENIG use would be declining. But there are a few reasons why the prophesized demise of ENIG has been premature.

Interconnect Defects in PCBs: Causes, Detection, and Impact on Reliability

Interconnect Defects

Making thin electroless nickel deposits work. When the thickness of any protective coating is reduced, two issues, porosity and chemical resistance, must be addressed. By looking at the whole picture, 1 micron of electroless nickel can provide the protection & low insertion loss required for 5G success today and into the future.

Meeting the Demands of HDI and Ultra HDI
 

Introduction
Graphite-based direct metallization has advanced to the point where current and future PCB designs depend on efficient, cost-effective, and reliable metallization solutions. This is especially true for HDI and Ultra HDI designs, which require multiple processing steps for each layer:
•    Via formation

The Advantages of Boric Acid-free Nickel Plating

Nickel plating has a vast amount of applications in the electroplating industry. Nickel is needed in electroforming, PCB plating,and nearly all electronic components, either as an intermediate layer or as a final finish.