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TechniClean IK73

Post etch residue remover that selectively removes highly-inert chemical residues created during the patterning of high-k dielectric metal oxides (based on hafnium, zirconium and tantalum).

Characteristics:
  • Fast and selective removal of post etch residues, created by plasma etching of high-k dielectric materials.
  • Compatible with aluminum, copper dielectric materials.
  • Designed for room temperature operations, water rinseable.
  • Suitable for immersion, batch-spray and single-wafer application.
Availability: North America, Asia Pacific, Europe
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