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Process Results (3) Request More Information
Elevate Cu 1500
MSA based copper process specially formulated for producing copper deposits with excellent via fill and leveling capability. The process can be used to fill vias of various sizes with void free copper deposits that will meet the requirements of most advanced packaging applications.
Excellent via fill capability. Only two organic components to control. All organic and inorganic components are fully analyzable with Technic’s Elevate Analyzer.
Elevate Cu 3000
Electrolytic copper plating process formulated to plate various types of semiconductor advanced packaging structures. It can successfully plate RDL patterns, copper pillars and most other types of features required for Fan-In, Fan-Out, 2.5D and 3D applications.
Versatile process that can plate various types of features. Excellent WID and WIW. Very stable additive package. All inorganic and organic components are easily analyzed using Technic’s Elevate Analyzer.
Elevate Cu 6388
Electrolytic copper plating process specifically formulated for general purpose semiconductor applications. The electrodeposits produced by the Elevate Cu 6388 process are fine grained equiaxed, high purity, ductile copper deposits from an easy to use two additive system. Not for use for applications that require a flat top feature.
Stable additives with low consumption. Wide current density range of 2.5 – 10 ASD. Compatible with a variety of plating tool platforms. All inorganic and organic components are easily analyzed using Technic’s Elevate Analyzer.
