Precious Metal Plating for Advanced Semiconductor Applications
Technic is a global leader in supplying precious metal electroplating solutions for semiconductor applications. With decades of experience and a commitment to innovation, we offer a comprehensive range of high-performance gold plating solutions tailored to meet the evolving demands of advanced semiconductor packaging, wafer-level plating, gold bumping, and microelectronics.
Technic’s non-cyanide gold plating processes are widely used in the semiconductor industry. Our sulfite gold processes are not only cyanide-free, but also free of harmful additives, such as thallium and arsenic, making them safer for both users and the environment, without compromising performance.
For applications requiring traditional gold chemistry, Technic offers cyanide-based gold plating processes optimized for advanced gold bumping and high-reliability microelectronic interconnects.

Sulfite gold
Technic's industry-leading Elevate® Gold 7990 NBV HT is a cyanide-free, electrolytic sulfite gold process designed specifically for semiconductor applications.

Cyanide-based gold
Technic provides cyanide-based gold processes for advanced gold bumping and other technologies.

Other precious metals
Technic provides other precious metals processes for advanced semiconductor packaging applications.