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Process Results (5) Request More Information
Elevate Cu 3000
Electrolytic copper plating process formulated to plate various types of semiconductor advanced packaging structures. It can successfully plate RDL patterns, copper pillars and most other types of features required for Fan-In, Fan-Out, 2.5D and 3D applications.
Versatile process that can plate various types of features. Excellent WID and WIW. Very stable additive package. All inorganic and organic components are easily analyzed using Technic’s Elevate Analyzer.
Techni NF JB 3000
High speed bright tin plating process. MSA based electrolyte.
Techni NF JM 3000
High speed MSA based matte tin plating process. Fully compatible with Techni NF JB 3000 bright tin. Excellent solderability and resistance to reflow discoloration.
Technistan JB 3000
High speed bright tin plating process. Sulfate based electrolyte.
Vega 3000
Acid chloride zinc plating process. Suitable for rack and barrel applications.
Non-foaming surfactant system perfectly suited for high agitation/high current density plating
Additives offer a very high cloudy point to provide excellent tolerance to high bath temperature
