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Process Results (6) Request More Information
Techni GE 70
PCB specific: Glass Frost or Glass etch for Desmear process.
Techni GE 70 is an acidic, dry crystalline powder which is used to frost and etch glass fibers found exposed after the multilayer etch back cycle.
Techni MN 63A
PCB specific: Potassium Permanganate desmear.
Techni MN 63 A (solid) epoxy etch compound that is used to clear multilayer printed circuit boards of drilling residue prior to metallization. It will promote good adhesion of direct metallization, graphite and electroless copper coating to the epoxy.
Techni MN 63L
PCB specific: Sodium Permanganate desmear.
Techni MN 63 L(Liquid) epoxy etch compound that is used to clear multilayer printed circuit boards of drilling residue prior to metallization. It will promote good adhesion of direct metallization, graphite and electroless copper coating to the epoxy.
Techni MN 66
PCB specific: Permanganate Desmear neutralizer.
Techni MN 66 is a post-etch back neutralizer solution designed to neutralize and clean permanganate residue out of the holes of printed circuit boards.
Techni SW 33
PCB specific: Solvent base sweller for permanganate desmear.
Techni SW 33 is a superior 1 component hole conditioner that facilitates rapid, uniform smear removal or etch back when used with Technic Desmear chemistry.