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Process Results (17) Request More Information

JM 6000

Matte tin or tin/lead plating process. MSA based electrolyte

Characteristics: Medium grained, high speed, matte tin whisker resistant plating process based on MSA. Satisfies all requirements of JEDEC JESD 201. Can be formulated as a tin/lead process.
Availability: Asia Pacific
Aggiungi Elimina

Techni BT2

Low speed bright Tin

Characteristics: Sulfate based electrolytic tin plating process, bright deposit. Suitable for rack and barrel applications
Availability: Europe
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Techni Matte Tin Sulfate 89TI

Matte Tin for rack and barrel

Characteristics: Low operating cost. Good product for most technology types. Optimum distribution in the range of 15 - 20 ASF.
Availability: North America, Europe
Aggiungi Elimina

Techni NF BT2

MSA-based bright tin and tin/lead plating process

Characteristics: Operates over a wide CD range for increased output and flexibility in production. Produces brilliant deposits with good ductility. Exhibits good throwing power and distribution characteristics.
Availability: North America
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Techni NF JB 3000

High speed bright tin plating process. MSA based electrolyte.

Characteristics: Bright, whisker resistant pure tin based on MSA. Satisfies all requirements of JEDEC JESD 201.
Availability: North America, Asia Pacific, Europe
Aggiungi Elimina

Techni NF JB 3400

High speed bright tin/lead plating process

Characteristics: Mirror bright 90/10 or 60/40 tin/lead alloy deposits from MSA electrolyte.
Availability: North America
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Techni NF JB 3500

High speed bright tin/lead plating process

Characteristics: Mirror bright 90/10 or 60/40 tin/lead alloy deposits from MSA electrolyte.
Availability: North America, Asia Pacific, Europe
Aggiungi Elimina

Techni NF JM 3000

High speed MSA based matte tin plating process. Fully compatible with Techni NF JB 3000 bright tin. Excellent solderability and resistance to reflow discoloration.

Characteristics: High speed matte tin plating process based on MSA. Fully compatible with Techni NF JB 3000 bright tin.
Availability: North America, Europe
Aggiungi Elimina

Techni NF JM 6000

High speed tin lead for reel to reel strip plating

Characteristics: Medium grained, high speed, MSA based, matte whisker resistant tin plating process. Satisfies all requirements of JEDEC JESD 201. Available as a tin/lead process.
Availability: North America, Asia Pacific, Europe
Aggiungi Elimina

Techni NF JM 6000 LS

MSA based process for matte tin and tin/lead plating

Characteristics: General purpose rack and barrel matte tin and tin/lead plating process. Operates over a wide current density range with uniform deposit appearance.
Availability: North America, Asia Pacific
Aggiungi Elimina

Techni NF JM 8000

MSA tin process that can be used in rack, barrel and high speed RTR equipment.

Characteristics: Specifically designed for ultra-high, high, and medium speed, MSA based matte tin deposition with outstanding whisker resistance (JEDEC compliant). Excellent on-line reflow performance. Superior deposit uniformity and throwing power.
Availability: North America, Asia Pacific, Europe
Aggiungi Elimina

Technibrite HT 1000

Technibrite HT 1000 is Technic’s most advanced bright tin process for rack and barrel applications. The process eliminates tin metal growth problems by operating at higher cathode efficiencies and warmer temperatures. With its exceptional low current density bright range, complex geometry parts are uniformly bright in all areas.

Characteristics: Wide temperature operating range: 20 - 35°C (68 - 95°F). Exceptional low current density bright range. Deposit is whisker mitigated per JEDEC 208 test protocol.
Availability: North America, Asia Pacific, Europe
Aggiungi Elimina

Technistan Ag

MSA based semi-bright to full bright tin-silver alloy (1-7% silver)

Characteristics: A high speed tin-silver alloy plating process for use in applications such as high temperature solder in automotive applications.
Availability: North America, Asia Pacific, Europe
Aggiungi Elimina

Technistan JB 3000

High speed bright tin plating process. Sulfate based electrolyte.

Characteristics: Bright, whisker resistant pure tin, mixed acid/sulfate based. Satisfies all requirements of JEDEC JESD 201.
Availability: North America, Asia Pacific
Aggiungi Elimina

Technistan JM 6000 LS

Sulfate based matte tin. Sulfate based electrolyte.

Characteristics: Matte whisker resistant deposit. Recommended for rack/barrel applications (up to 4 ASD).
Availability: North America
Aggiungi Elimina

Technistan JM 7000

Sulfate tin process that can be used in rack, barrel and high speed RTR equipment.

Characteristics: Whisker resistant deposit (JEDEC tests). Excellent deposit uniformity at all usable current densities. Excellent solderability. Great throwing power, even with high tin formulations. Sulfate formulation eliminates potential problems with lead co-depos
Availability: North America, Asia Pacific, Europe
Aggiungi Elimina

Technistan TP

High speed matte tin sulfate process designed for use on lines with in-line tin reflow furnaces.

Characteristics: High speed matte pure tin plating process based on sulfuric acid electrolyte. Offers significant cost advantages vs MSA systems.
Availability: North America, Asia Pacific
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Equipment Results (6) Request More Information

Ancillary Plating Equipment

Upgrades, spare or replacement parts for all plating operations

Characteristics:

DC rectifiers, PPR rectifiers, amp hour meters, heaters, filters, ultrasonics, spare parts, retrofits and upgrades.

Availability: North America
Aggiungi Elimina

CDPP-2000

Controlled Depth Pin Processing

Characteristics:

Continuous, fully enclosed, controlled depth processor for pin plating. Fully automatic cartridge loading and unloading with fast and easy part changeovers.

Availability: North America, Asia Pacific, Europe
Aggiungi Elimina

Gold Saver - Resin Recovery System

Recovery of gold and silver

Characteristics:

Gold reclaim system for in tank filter type.

Availability: North America, Europe
Aggiungi Elimina

Manual Plating Lines and Auxiliary Equipment

Manual equipment and supplies for a variety of applications.

Characteristics:

Complete manual plating lines are custom designed to meet customer specification.

Availability: North America, Europe
Aggiungi Elimina

Reel to Reel

Fully automatic reel to reel processing systems for overall plating, controlled depth, selective stripe, and selective spot.

Characteristics:

Custom designed continuous, reel-to-reel plating systems deliver precisely deposited gold, silver, copper, nickel, tin, tin/lead, palladium and palladium nickel over any ferrous or non ferrous metal.

Availability: North America, Asia Pacific, Europe
Aggiungi Elimina

SBE

Spouted Bed Electrode (SBE®)

Characteristics:

Technic's patented method of electroplating small components such as electronic connectors, discs, pins and SMT chip capacitors and chip resistors.

Availability: North America, Asia Pacific, Europe
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  • Applications
    • Semiconductor
      • Fabrication & Packaging Chemistry
        • Copper
        • Nickel & Tin
        • Precious Metals
        • Photoresist Strippers
        • Metal Etchants
        • Cleaners
      • Analytical Control (RTA)
      • Equipment: Research & Development
        • Semcon 1000
        • Semcon Fountain
        • Semcon 2000
        • Semcon 2500
        • Semcon Wafer Racks
      • High Purity Chemistry
    • Components, Lead Frames, Connectors
      • ECLC Chemistry
        • Connectors
          • - Precious Metals
          • - Non-precious Metals
          • - Post-Treatment
        • Lead Frames/LED Substrate Applications
        • Active & Passive Components
      • ECLC Equipment
    • Printed Circuit Boards
      • Chemistry
        • Photoresist Developers, Strippers
        • Preclean and Microetch Products
        • Desmear Chemistry
        • Metallization
        • Copper and Tin Plating
        • Final Finish - Electroplating
        • Final Finishes - Immersion
        • - ENIG
        • - ENEPIG
        • - EPIG
        • - ASIG
      • Imaging Products
        • Photoimageable Materials
          • - TechniFlex LCL
        • IRP Thermosetting Inks
        • Conductive Silver Paste
        • LED Inks
        • Peelable Masks
      • Process Control - EBA
      • Equipment
    • Industrial
      • Pretreatment
        • Cleaners
        • Activators
        • Etchants
      • Electrolytic Plating
        • Nickel
        • Tin
        • Silver
        • Copper
        • Zinc (EU Only)
      • Electroless Plating
      • Immersion
      • Post Treatment
        • Anti-corrosion/discoloration coating
        • Anti Tarnish
        • Passivation
        • Coatings
        • Strippers
      • Industrial Equipment
      • Anodizing Equipment
    • Solar
      • Energy Technologies
        • Hydrogen Technology
      • Engineered Powder & Flake
    • Technic ECO Products
    • Decorative
      • Pretreatment
        • Soak Cleaners
        • Electrolytic Cleaners
        • Pickling Solutions
      • Plating Chemistry
        • Gold/Gold Alloy
        • Silver
        • Tin/Tin Alloy
        • White Bronze
        • Nickel/Nickel Alloy
        • Copper
        • Palladium/Palladium Alloy
        • Brass
      • Coatings & Coloring
        • Cataphoretic Lacquers
        • Color Treatments
      • Post Treatment
      • Glass Etching
      • Equipment
    • Medical
      • Chemistry
      • Equipment
    • Application Support
      • Application Guides
      • Application Notes
  • Chemistry
  • Equipment
    • Automated Systems
      • Hoist Systems
        • Cantilever/Sidearm
        • Rail/Rim Runner
        • Overhead Hoist
        • Hoist Automation
        • Hoist Retrofits
      • Batch Systems
        • Barrels
        • Vibratory
        • SBE Technology
          • - How it works
          • - Configurations
          • - Automation
      • Loose Parts Processing Systems
        • Single Piece (MP500)
        • Single Parts (MP300)
        • Selective Pin (CDP2000)
        • Cut Strip (Leadframes)
        • Panels (MP100)
      • Continuous
        • Reel to Reel
        • Roll-to-Roll (MP200)
      • Turnkey
    • Manual Lines
      • Wet Benches/Modules
      • Tank Lines
    • Laboratory and R&D
      • Mini Lines
      • High Speed Reel to Reel Test Cells
      • Wafer Plating Test Cells
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      • Custom Anodizing Equipment
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      • Anodizing Resources
        • What Anodizing System if right for me.
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        • Demonstration Videos
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          • Advanced Engineered Systems
      • Amp Hour Meters, Timers & Chemical Feeders
      • Anodes, Baskets, Bags & Hooks
      • Filtration
      • Precious Metal Recovery
      • Rectifiers
      • Tanks & Auxiliary Equipment
      • Ultrasonic and Aqueous Cleaners & Dryers
      • Selective Plating
    • Process
      • Anodizing
      • Electropolishing
  • Engineered Powders
    • Products
    • Global Offices & Distributors
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        • Tape Application Jig
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    • Contact Us
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      • FAQ
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    • Global Facilities
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