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340C Brown
Special plating resist designed to be used under extreme etch conditions.
Very high resistance against the strongest acids and alkalis and long-term immersion in electroless and electrolytic plating solutions.
Exceptional etch resistance for longer immersion time.
Viscosity adjustable to meet all applications.
Fast drying.
Technic CU 135
PCB specific
TECHNIC CU 135 is an electrolytic acid copper process for use with insoluble anode systems like Technic ISA. It is designed to provide excellent distribution when plating through hole-printed circuit boards over a wide range of low current densities.
Technic High-Speed Nickel Sulfamate FFP
PCB Specific
Technic High-Speed Nickel Sulfamate FFP process is designed for high speed, high current density applications to produce a low stress, semi-bright, ductile nickel deposit. The bath can be used with soluble or insoluble anodes.
Technidev 440
PCB specific: Provide extended development for fully aqueous photoresists
Technidev 440 is a potassium carbonate solution designed to provide extended development for fully aqueous photoresists and Photo Imageable SolderMask
TechniEtch AT 2000
PCB specific: Pre-clean.
TechniEtch AT 2000 is an ammonia-free, fine topography persulfate micro etch designed for use in pretreatment cycles for printed circuit boards and other copper surfaces.
1006 Silver
Bright Silver plate
110/180 Series
Comprehensive range of alkali soluble resists for various customer requirements.
Excellent surface finish free of bubbles, dewets and particulates.
High definition (no "ghost" in image after etching).
Quick drying.
High etch resistance.
Easily removed in simple caustic solutions, such as NaOH (sodium hydroxide).
9025 Gold Stripper
Gold Stripper
9050 Palladium Stripper
Chemical stripper for removing deposits of palladium, palladium/nickel alloys and platinum.
No attack on base metals
Activator Cu
Ammonia-free activator and pickling additive for copper designed for use in the pretreatment cycles.
Stable and economical chemistr
Activon 10
Activant
Allumin 5200
Zincate for aluminum before nickel
Allumin 810 cementaz. Aluminum
Zincate for aluminum before alkaline copper
Alphalux
Alkaline zinc cyanide free process
High distribution thickness
Suitable for rack and barrel applications
Antifume 66 NF
Antifume
Antifume IG 36
Fumes dismissive agent for chrome solutions, compatible with all chromium plating baths, including catalysed and traditional baths with sulphate.
ASIG ESM 100 Autocatalytic Silver
PCB specific: The deposit is tarnish resistant and gives consistent solderability.
ESM 100 is an extremely stable, alkaline solution for Autocatalytic deposition of silver onto copper for 5G applications.
ASIG Techni IM Gold AT 6600
PCB specific. Immersion Gold for ASIG Process
Techni IM Gold AT 6600 is a cyanide-based process that produces thin, adherent, pure gold immersion deposits onto Autocatalytic Silver substrates. Deposits are uniform and fine-grained with low porosity.
Au-Electrum
Precious Metal Recovery for Gold
Auroguard NP-12
Pore sealant/lubricant
Aurotex 1002 N 14
Decorative gold
Aurotex 1002 N 18
Decorative gold
Aurotex 1002 NG
Decorative gold
Aurotex 1100 SR
Decorative gold
Aurotex 240
Decorative gold
Aurotex 290
Decorative gold
Aurotex 88 GS M
Decorative gold
Aurotex 94G
Decorative gold
Aurotex MC 418
Decorative gold
Betalux
Electrolytic alkaline zinc plating process for rack and barrel applications.
Betalux Barrel
Alkaline zinc without cyanide
Betalux Rack
Alkaline zinc without cyanide
Black Gun CL
Black Nickel
Black Tin Cobalt
Tin-cobalt plating
Brass 71 D
Decorative electrolytic brass plating process.
Brass 71 S
Brass high thickness plating
Ceramistan 1031
Near neutral pH satin tin process for plating on acid sensitive passive electronic components.
Ceramistan DM
Tin and Tin/Lead alloy plating process (up to 40% Lead) for small passive components.
Circudep DM AC 170
PCB specific: Accelerator for Direct metalization.
CIRCUDEP DM AC 170 is the final step in the Direct Metallization plating process. It is used after the CIRCUDEP DM CT 60 activator solution and produces the final conductive coating.
Circudep DM CC 124
PCB specific: Cleaner Conditioner for Direct Metallization.
CIRCUDEP DM CC 124 is a concentrated blend of surfactants and wetting agents designed to clean the copper foil surfaces of printed circuit boards. It contains conditioning agents which activate glass fibers and epoxy.
Circudep DM CT 60
PCB specific: Catalyst for direct metalization.
CIRCUDEP DM CT 60 is designed to help produce a conductive coating on non-conductive surfaces for Direct Metallization.
Circudep DM PD 55
PCB specific: Catalyst predip for Direct Metalization.
CIRCUDEP DM PD 55 is an acidic-salts solution designed to improve the efficiency of the Catalyst.
Circudep EC AC 77
PCB specific: Accelerator, electroless copper process.
CIRCUDEP EC AC 77 is a non-fluoride product that optimizes catalyst activity on non-conductive substrates, providing void-free electroless copper deposits.
CIRCUDEP EC CC 18
PCB specific: Cleaner Conditioner for Electroless Copper process.
CIRCUDEP EC CC 18 contains conditioning agents which activate glass fibers, epoxy and other non- conductive materials, allowing for a reliable absorption of the palladium catalyst in Electroless Copper processing.
Circudep EC CT 74
PCB specific: Catalyst for Electroless Copper.
CIRCUDEP EC CT 74 provides a highly charged colloid that promotes a uniform, highly adherent electroless copper deposit.
Circudep EC EC 92
PCB specific: Electroless Copper bath.
CIRCUDEP EC EC 92 is a medium-depth electroless copper system engineered to deposit a pure, fine-grained, equiaxed copper. CIRCUDEP EC EC 92 is engineered to work with today’s sophisticated non-conductive substrates.
Circudep EC PD 70
PCB specific: Catalyst predip for Electroless Copper.
CIRCUDEP EC PD 70 is a neutral solution that prepares non-conductive substrate materials for uniform absorption of the palladium catalyst.
Circudep G 3500
PCB specific: Cleaner conditioner for metallization of rigid and flex PCBs.
CIRCUDEP G 3500 is the next-generation Alkaline Cleaner Conditioner designed for Graphite systems.
Circudep G 4300
PCB specific.
CIRCUDEP G 4300 is a fine particle graphite-based direct metallization process specifically formulated for use in horizontal flood conveyor systems.
Circudep G 5070
PCB specific: Acid Post dip, for Graphite process.
CIRCUDEP G 5070 is the third step in the Graphite process. It is an acidic solution necessary to remove excess graphite and improves the conductivity of the coating.
Convergence Copper 2719
Bright acid copper plating process
Convergence Metallization
Metallization process technology for plating non-conductive substrates
Convergence Nickel EF BF
Produces a low stress, ductile nickel deposit from a matte nickel sulfamate solution that is free of all boron compounds.
- Completely free of all boron compounds
- Low stress, highly ductile deposits, capable of plating at a wide range of current densities from 5 - 400 ASF (0.5-40 ASD)
- All liquid products; no handling or additions of solids
Convergence Rhenium
Electrolytic Rhenium plating process for use in a variety of equipment types and end-use applications, particularly quantum computing, superconductor coatings, and other emerging energy fields.
Uniform deposit appearance, wide current density range, stable electrolyte.
Cote D'Or
Decorative hard gold
CUCN
Cyanide copper strike and full build
CUCN-Bright Copper Cyanide Process
Cyanide Copper Plate
Cyless Electrolytic AU Strip TC
Gold Stripper
DEC
De-complex agent
Décor Gold
Décor Gold is a bright acid hard gold that contains a metallic brightener. The process was formulated for decorative applications.
Hardness ranges between 130 and 200 knoop
Wide current density range for both rack and barrel applications
Durasil Silver
Bright Hard Silver
EAS
Gold strike
Elevate AuSn 8020
Eutectic gold-tin
Elevate Cu 1500
MSA based copper process specially formulated for producing copper deposits with excellent via fill and leveling capability. The process can be used to fill vias of various sizes with void free copper deposits that will meet the requirements of most advanced packaging applications.
Excellent via fill capability. Only two organic components to control. All organic and inorganic components are fully analyzable with Technic’s Elevate Analyzer.
Elevate Cu 3000
Electrolytic copper plating process formulated to plate various types of semiconductor advanced packaging structures. It can successfully plate RDL patterns, copper pillars and most other types of features required for Fan-In, Fan-Out, 2.5D and 3D applications.
Versatile process that can plate various types of features. Excellent WID and WIW. Very stable additive package. All inorganic and organic components are easily analyzed using Technic’s Elevate Analyzer.
Elevate Cu 6300 Cleaner
Precleaner for electrolytic copper plating
Elevate Cu 6388
Electrolytic copper plating process specifically formulated for general purpose semiconductor applications. The electrodeposits produced by the Elevate Cu 6388 process are fine grained equiaxed, high purity, ductile copper deposits from an easy to use two additive system. Not for use for applications that require a flat top feature.
Stable additives with low consumption. Wide current density range of 2.5 – 10 ASD. Compatible with a variety of plating tool platforms. All inorganic and organic components are easily analyzed using Technic’s Elevate Analyzer.
Elevate Gold 7934
High purity, soft gold plating
Elevate Gold 7990 NBV HT
Cyanide, Thallium and Arsenic-free Gold Plating
Electrolytic sulfite gold process for semiconductor applications that produces pure, soft gold deposits. Operates at an optimum acidic pH of 6.6, making it compatible with almost all photoresists. It produces a bright deposit without the use of harmful grain refiners like thallium and arsenic. Provides excellent coplanarity and step coverage. Can be used for plating several different applications (thicknesses ranging from 0.5 - 100 microns) without major modifications to the solution and can be used on a variety of tool sets.
Elevate Ni 5950
Boric Acid free Nickel Plating
Boric acid free process that produces nickel deposits with similar attributes as a standard nickel electroplating solution. The process can be used for UBM, metal stacking and other semiconductor technologies that utilize a nickel metal deposit.
Elevate Tin 5011
Tin Plating
Enviolet series
Copper Bath Purification System
Glance 189 L
Uniform nickel brightener
Glance 374/G
Leveling bright nickel
Glance 91 S/A
Leveling bright nickel
Glance CSF
Semi-bright nickel process that produces a highly leveled and ductile deposit exhibiting exceptional corrosion protection when used as the undercoat in a duplex nickel system.
Leveling equal to or better than that from Coumarin-based system
S.T.E.P. and ductility values meet all automotive OEM specifications
Easy conversion from other semi-bright nickel plating system
Glance Cu 160
Copper plating, no cyanide.
Cyanide free, alkaline Copper plating solution for all metals even for zamak.
Glance Cu 9002
Electrolytic alkaline copper process. Additives are lead free.
- Bright process
- Excellent stability
- Cyanide-based
Glance HB
Semi-bright nickel process permitting to deposit the first nickel layer in the double nickel plating application and suitable for electronic and electromechanical industries.
Glance Lux 1
Brightener for rack and barrel nickel bath.
Bright and leveling power
Excellent throwing power
Glance LUX 2
Boric acid-free nickel. Produces bright, ductile, level and white deposits. Ideal for fashion applications.
Unique, universal brightener for rack and barrel applications.
Glance N 23
Dark grey electrolytic nickel.
Suitable only for rack applications
Works at room temperature
Gold alloys
Specialty finish gold
Goldeneye Black Nickel
Goldeneye Black Nickel produces a dark nickel/zinc (Ni/Zn) alloy finish on top of an electroplated nickel deposit. The appearance of the Goldeneye Black Nickel deposit varies from dark grey to black depending on the operating parameters and equipment used.
Goldeneye Cobalt Tungsten
Goldeneye Cobalt Tungsten is a unique process specifically designed to deposit a 65/35 Co/W alloy in connector and electronic component applications where it can be applied as a barrier layer replacement for nickel or other nickel alloys such as nickel-tungsten.
Drop-in replacement for nickel or nickel-tungsten plating solutions in existing lines.
Nickel-free deposit with no nickel dermatitis issues - suitable for consumer applications.
Goldeneye Level Nickel HS
Goldeneye Level Nickel HS is an advanced electroplating process specifically designed to produce fully bright lustrous nickel deposits at high current densities, suitable for decorative applications.
Goldeneye Nickel BF
Goldeneye Nickel BF is a low stress/highly corrosion-resistant nickel plating process capable of operation over a wide range of current densities from a proprietary electrolyte. Noted for its superior thickness distribution, improved corrosion-resistance, and lower waste treatment costs, Goldeneye Nickel BF can be utilized in reel to reel, rack and barrel plating applications. Goldeneye Nickel BF uses a revolutionary new buffering agent (Goldeneye Ni Buffer BF) which is completely free of all boron compounds.
Improved corrosion resistance compared to sulfate or sulfamate plating processes. Superior thickness distribution. Improved low current density coverage. Increased solution conductivity. Reduced waste treatment costs. Operates over a wide current density range, reel to reel, rack and barrel. Produces a nickel deposit which meets the requirements of AMS-QQ-N-290B (Rev. 2009-07), Class 1, “SB”. Completely free of all boron compounds.
Goldeneye Nickel EF
Goldeneye Nickel EF is an advanced electroplating process specifically designed to produce fully bright lustrous nickel deposits over a wide range of current densities. The ability to produce ductile heavy deposits with very low stress makes this process especially suitable for electroforming applications.
Excellent ductility at high deposit thicknesses, especially suited for electroforming applications.
Goldeneye Nickel Phos
Boric acid-free electrolytic nickel-phosphorous alloy plating process.
- Produces NiP alloys with ≥10% phosphorous consistently. Can also be used for mid-phos applications where required.
- Possible EN replacement.
- Suitable for barrel, rack, and reel-to-reel applications.
Goldeneye Nickel Tungsten
Goldeneye Nickel Tungsten is designed to deposit a Ni/W alloy in applications requiring superior corrosion resistance, mechanical strength, high hardness, excellent wear, and other properties. It is suitable for reel to reel, rack or barrel plating equipment. Goldeneye Nickel Tungsten requires no special rectification and the process can be implemented in existing plating lines with minimal to no modifications.
High hardness with excellent wear and mechanical properties
Non-magnetic coating, suitable for high frequency applications (5G)
DC plating; no special rectification required
Goldeneye Nickel-Cobalt BF
Nickel-Cobalt alloy plating process for use in a variety of equipment types and end-use applications, particularly emerging energy applications.
Consistent deposit composition, wide current density range, stable electrolyte.
Goldeneye Nickel-Iron BF
Goldeneye Nickel Iron-BF is a unique process specifically designed to deposit an 80/20 Ni/Fe alloy in various applications, especially where a highly magnetic coating is desired.
Boric acid-free electrolyte. Highly magnetic coating. High level of solution stability and very stable alloy composition: 80/20 Ni/Fe.
Goldeneye Satin Nickel
Goldeneye Satin Nickel is a unique electroplating process which produces a smooth satin nickel deposit in applications requiring this finish.
Designed for use in rack or medium speed reel-to-reel plating equipment.
High Speed Nickel Sulfamate FFP BF
High speed nickel sulfamate plating process.
High speed Nickel plating process producing low stress, ductile nickel deposits. Also available in boric acid-free version FFP-BF.
Integral Pigments
Color pigments for use in TechniClear Cataphoretic Lacquers. Available in a wide range of colors.
Liquid concentration
Easy to use
Non hazardous
One-step process
Italchrome DL Q
Decorative hexavalent chrome plating process.
Very good cathode-efficiency (better than 50%)
High corrosion resistance
Italchrome HC
Process for heavy chromium deposition.
High wear resistance and high deposition rate
Excellent distribution and excellent throwing power
JM 6000
Matte tin or tin/lead plating process. MSA based electrolyte
Kemstrip 41
Electrolytic anodic striper for racks.
Kemstrip Au 92 P
Immersion stripper to remove gold deposits from copper, brass and nickel surfaces.
Kemstrip NI 87
Acid stripper to remove nickel from brass and copper.
Non-cyanide stripper process
Removes nickel deposits without etching the metal underneath
Kemstrip NI A-B
Immersion stripper used to remove nickel from iron, copper and brass.
Kemstrip Ni Z
Stripper to remove nickel from zinc die cast as base material.
Kemstrip SN 60
Acidic stripper removes tin and tin/lead deposits from brass and copper.
Leveltech
PCB specific: Immersion Tin, Whiskers free process.
Leveltech is an immersion tin deposition process with a metallic additive which helps promote solderability and inhibits whisker growth associated with pure tin deposits.
Mark 130
Chemical dip process for bronze color with reddish shades on copper and copper alloys.
Liquid process designed to produce antique bronzing color directly on copper and brass surfaces by simple chemical dip. The process is usually used in the following fields: decorated parts, interior-design, fashion, sacred-or-graveyard-art.
Mark 20 L
Blackening process by chemical dip
Suitable for copper
Easy to brush
Mark 25 S
Green copper color at room temperature.
Mark 30
Blackening process for stainless steel.
Powder product designed to blacken directly mild steel articles, producing an uniform and deep black color deposit that becomes integral part of base metal, it is flaking-free. Works at high temperature.
Mark 45
Blackening process for stainless steel.
Powder product designed to blacken directly stainless steel articles producing a free-flaking oxidation layer that will become integral part of the base metal. Works at high temperature.
Mark 500
Chemical dip process for bronze color on copper and copper alloys.
Liquid process designed to produce antique bronzing color directly on copper and brass surfaces by simple chemical immersion. The process is usually used in the following fields: decorative, interior-design, fashion, sacred-or-graveyard-art.
Mark 511
Chemical dip process for bronze color.
Stable color
Easy to brush
Mark 5333
Blackening process for iron, steel and cast iron.
Operates at room temperature
Produces black finish equal to obtain with the conventional black oxides processes
Good corrosion resistance
Mark 60
Blackening process with bluish shades for silver plated or parts.
Process with single component designed to produce antique black bluish color directly on silver-plated surfaces, or silver articles, by simple chemical dip. Easy to manage and brush.
Mark 833
Selenium-free blackening for brass.
Chemical dip process for blackening brass. Produces deposits of an intense black color.
Mark A 380
Blackening solution for aluminum.
Mark SS 73
Blackening process for stainless steel.
Metasu Lubrus C09 (I)
Clear Top Coat for deposits of Zn & Zn alloy passivated.
Friction coefficient range: 0.07 - 0.11. Applicable with both dip/spin and spray applications. High corrosion resistance. Safe product, chrome-free, water-based. Dry at 100°C for 10 minutes.
Metasu Lubrus C12A (I)
Clear Top Coat for deposits of Zn & Zn alloy passivated.
Friction coefficient range: 0.09 - 0.13. Applicable with both dip/spin and spray applications. High corrosion resistance. Safe product, chrome-free, water-based. Dry at 100°C for 10 minutes.
Metasu Lubrus C14A (I)
Clear Top Coat for deposits of Zn & Zn alloy passivated
Friction coefficient range: 0.12 - 0.18. Applicable with both dip/spin and spray applications. High corrosion resistance. Safe product, chrome-free, water-based. Dry at 100°C for 10 minutes.
Metasu Lubrus CE 1
Chrome-free clear top coat agent with high corrosion resistance.
Water-based clear top coat for automotive applications.
Consistent total friction coefficient.
Superior corrosion resistance.
Metasu Lubrus K09A (I)
Black Top Coat for deposits of Zn & Zn alloy passivated.
Friction coefficient range: 0.07 - 0.11. Applicable with both dip/spin and spray applications. High corrosion resistance. Safe product, chrome-free, water-based. Dry at 100°C for 10 minutes.
Metasu Lubrus K12A (I)
Black Top Coat for deposits of Zn & Zn alloy passivated.
Friction coefficient range: 0.09 - 0.13. Applicable with both dip/spin and spray applications. High corrosion resistance. Safe product, chrome-free, water-based. Dry at 100°C for 10 minutes.
Metasu Lubrus KE 1
Chrome-free black top coat agent with high corrosion resistance.
Water-based black top coat for automotive applications.
Consistent total friction coefficient.
Superior corrosion resistance.
Metasu YC-B17
Zinc flake process.
Chrome-free zinc flake process. High corrosion resistance. Process consists of two layers (two-step curing). It perfectly protects the cavities, without creating accumulation.
MX-5
Barrel plating
MX8-M
Nickel Plate
Orosene 80 RC
Hard Gold For Deep Tank Application
Industry standard in hard gold products. Excellent distribution with consistent high yields. Compatible with aqueous resists. High efficiency reduces plating time.
Orosene 80-RC
PCB specific.
Orosene 80-RC is a general-purpose cobalt-brightened acid gold plating solution yielding deposits meeting the requirements for Types I and II, Grade C, of ASTM B488-01 (superseding MIL-G-45204). The solution is compatible with both aqueous and semi-aqueous photoresists.
Orosene 990
Hard gold for rack and barrel application
Orosene 990 HS
Hard gold for high speed applications
Very high efficiency, high speed bright plating solution. The solution can be operated at low gold concentrations and at temperatures to 150 F, providing high plating rates with excellent deposit distribution.
Orosene 990 HS
PCB specific: Hard gold for high speed applications
Orosene 990 HS is a very high efficiency, high speed, mildly acidic cobalt-brightened gold plating solution recommended for use in barrel, rack, high speed and selective plating applications.
Orosene 999
Decorative hard gold
Orostrike C
Gold strike for base metals.
Orotemp 24
Pure gold
Orotherm HT
Hard gold
PAC
Coagulant agent
Pallamerse
PCB specific: Immersion Palladium, dense pore free deposit.
Pallamerse is an immersion palladium process that applies a dense, pore-free coating of palladium on base metals like copper, silver and nickel. Used as a Catalyst for EPIG.
Pallamerse
PCB specific: Immersion Palladium, dense pore free deposit.
Pallamerse is an immersion palladium process that applies a dense, pore-free coating of palladium on base metals like copper, silver and nickel. Used as a Catalyst for EPIG
Pallaspeed
Pure palladium plate
Pallaspeed 990
Palladium plating process
Pallaspeed DW
Bright palladium plate
Pallaspeed Palladium Nickel NFA
Palladium Nickel alloy plating process (70-90% Palladium) containing no free ammonia.
A chloride-free, alloy plating process containing no free ammonia. The deposit finish is semibright to full bright Deposit properties include good ductility and low porosity.
Pallaspeed S
PCB specific: Pure Palladium For Deep Tank Applications
PALLASPEED S is a neutral to slightly alkaline palladium plating process specifically designed for high-speed or selective plating of connectors, contacts, and other electronic components.
Pallaspeed VHS
High speed pure Palladium plating process based on Palladium ammonium chloride.
Pallaspeed VHS D
Palladium plating process suitable for all decorative purposes.
Neutral operating pH
PAM
Flocculent agent
Pd-AR
Precious Metal Recovery for Pd
Platinum AP
Electrolytic hard platinum
Platinum TP
Electrolytic Platinum plating process for use in a variety of equipment types and end-use applications, particularly emerging energy applications.
High deposition rate, uniform deposit appearance, wide current density range.
Post Dye Series
Coloring for cathodic electrophoretic coatings.
Protex 65
Chrome-free passivation for copper and copper alloys.
Chrome free, organic passivation suitable for all copper alloys. Resists 96 hours to test UNI EN 4611.
Protex 73
Antirust for steel
Protex 87
Protective oil
Protokote SPN
Thermal cure marking ink
VOC free single component with excellent adhesion on a wide variety of laminates and solder masks.
Remova 1700
Additive for Al alloy
Remova 2011
Pickling agent for Fe
Remova 205
Copper alloy pickling
Remova 2055
Additive for dipping
Remova 3021
Pickling agent for silver
Remova 303
Pickling agent for stainless steel
Remova 5122
Additive for cleaners
Remova 8068
Pickling for zamak
Remova 8070
Additive antifume
Remova 95
Neutralizing agent
Remova 97
Neutralization agent
Remova RA
Varnish stripper
Remova RH
Varnish stripper
Remova RY
Varnish stripper
Removel 155 IT
Liquid cleaner, strongly alkaline specific for electrolytic degreasing of ferrous material. Can be used in cathodic and anodic phase in both rack and barrel systems.
Contains complexing agent that increases the efficacy of the bath, extends bath life, and allows use even with hard water
Reduced gas fumes
Removel 555
Brass electrolytic cleaner
Removel SW 15
Alkaline liquid concentrated cleaner suitable for cleaning of iron, steel, cast iron, copper and copper alloys.
Removel T 11 L
Base concentrated alkaline phosphate-free cleaner suitable for cleaning of iron, steel, cast iron, copper and copper alloys.
Does not separate oily from sticky residues
Avoids the formation of complex salts with metals
Removel Techno 66
Cleaner for steel
Remover 111
Cleaner for brass and steel
Remover 122
Cleaner for brass
Remover 133 IT
Cleaner for steel
Remover 16 LQ
Liquid cleaner
Remover FDN 26
Liquid cleaner
Remover PB
Powder cleaner
Remover Techno 13
Powder cleaner
Remover Techno 14
Cleaner for steel
Remover Techno 33
Cleaner's additive
Remover Techno AL 32
Acid liquid soak cleaner for aluminum alloys, that permits to avoid the use of alkaline detergents that generally corrode and blacken the surface previously buffed.
Reduce production cost
Easy to handle
Remover Techno Solvit
Soak cleaner
RH 221 D
Rhodium plate
RH 221 E
Rhodium plate
Rhodium IT 2
Rhodium plating process for decorative purposes.
Ruthenium AK
Alkaline ruthenium plating
Ruthenium-U
Ruthenium plating process.
Shedar 30
Alkaline zinc/nickel electroplating process. Suitable for barrel and rack applications.
Excellent leveling and penetration
Excellent conversion coating properties (silver and black) after plating, that produce excellent corrosion resistance.
Silver Cyless II
Rack and barrel plate
Silver Cyless II W
Rack and barrel plate
Silver IT 2
Sliver semibright
Silversene
Bright silver
Silversene DW
Potassium cyanide based electrolytic silver plating process that produces mirror-bright ductile silver deposits.
Consistent high purity deposits
Excellent throwing power
Silversene ST
Silver high thickness
Silvertek L
Pure silver plating process with organic brightener for decorative applications.
Finish is tarnish-resistant as plated
Sirio 1000
Acid zinc electroplating process based on potassium chloride. Ideal for barrel and rack applications. Useable at high temperatures (up to 45°C).
Produces uniform deposits with excellent brightness
Excellent throwing power and good ductility
Process suitable on cast iron and hard steel
Sirio 600
Versatile boron-free potassium chloride zinc plating process. Ideal for barrel applications.
Better adhesion property in conversion treatment than conventional brightener
Good compatibility with trivalent conversion coating
Particularly excellent with trivalent back
Solder Strip JA
Single-step solder stripper
Starlux 50
Strong and very bright nickel brightener
Surfalat
Brass plating
Tarniban
Silver and copper
Tarniban 118 (TC)
Post treatment for tin
Tarniban 2000
Chrome-free organic passivation for copper alloys.
Chrome-free, metallic passivation suitable for all copper alloys. High protection against tarnish/oxidation.
Tarniban 51
Chrome-free antioxidant and anti-tarnish for silver, copper and copper alloys.
No detrimental effect to electrical properties or solderability
Resist 96 hours to test UNI EN 4611
Meets MIL specifications QQS-365A
Tarniban 59 (TC)
Post treatment for tin and nickel
Tarniban 60
Post treatment for silver
Tarniban C48
Post treatment process for tin and tin alloys
Specifically designed for use on tin and tin alloy deposits which are subjected to post-plate thermal exposure in high humidity/steam environments. For optimal results, Tarniban® C48 should be used in combination with Technic PST.
Tarniban C48 / C50
Anti-corrosion / anti-discoloration post-treatment process for tin deposits
Tarniban C50
Post treatment for tin, tin alloys
Tarniban CBG
Post treatment for Durasil® Silver
A non aqueous process which provides improved wear resistance and corrosion-resistant properties to Durasil® Silver deposits.
Tarniban E
Post treatment for silver
Tarniban E260
Post treatment process for tin and tin alloys
Tarniban KS II
PCB specific: Chrome free antioxidant and anti-tarnishing post treatment for silver surfaces.
Tarniban KS II is an organic thiol post-treatment process which effectively protects silver surfaces from oxidation/tarnishing. It may be used as an immersion only process.
Tarniban LED
Post treatment for LED Silver.
Tarniban TS
Anti-corrosion / anti-discoloration post-treatment process for silver
TEC 1001
Electrolytic cleaner
TEC-1010
Electro or Soak Cleaner for brass, steel, and copper
Tech OX P
Selenium-free liquid blackening for silver and white bronze plated surfaces.
Immersion blackening process.
Works at room temperature.
Possible to achieve different shades of blackened silver.
TECHNI 8085
Blackening for Electroless Nickel
Techni Acid Gold Strike
Gold strike on difficult to plate base metals
Low pH gold strike with excellent adhesion on tin-nickel, stainless steel, Kovar, titanium, passive nickel and other difficult to plate base metals.
Techni Acid Salt TAS-1
Powder acid activator for steel, brass, copper and passive nickel.
Techni Acid Salt TAS-3Z
Powder acid activator for zinc die cast, leaded brass, beryllium copper, aluminum, nickel, silver, tin, lead.
Techni ACT 100
Silver Stripper
Techni Act 909
Descale
Techni ACT 9600
Mild descaler
Techni Alkaline Zincate
Alkaline Zincate
Techni Aqua Shed-1
Rinse aid
Techni AT 66
PCB specific: Anti Tarnish for Copper.
Techni AT 66 contains a concentrated blend of copper oxide protection agents. It is added to the final rinse waters and will provide temporary tarnish protection for copper.
Techni Brown Gold
Decorative gold
Techni BT 1000
Bright tin for reel-to-reel applications
Techni BT2
Low speed bright Tin
Techni Buff Solv
Soak or ultrasonic for copper and brass
Techni Buffer IG
Product replaces boric acid in nickel bath (sulfate base, sulphammate and Goldeneye)
Techni Buffer NiF
Product replaces boric acid in all nickel baths (sulfate base, sulphammate and Goldeneye processes).
- Nickel-free product
- Liquid product, easy to handle in replenishment.
- Aids in reducing brighteners additive in replenishment.
Techni Chemical Deflash 38
Immersion Deflash
Techni Chemical Deflash LT
Immersion Deflash
Techni Chemical Deflash LT 88
Immersion Deflash
Techni Chrome 300
Decorative trivalent chromium electroplating system which produces a finish comparable in color to a hexavalent chromium deposit.
Exceptional throwing power with bright deposits at thicknesses up to 0.5 microns. Environmentally friendly - Contains no carcinogenic hexavalent chromium.
Techni Copper ACP
Alkaline Cyanide Copper Strike
Techni Copper C
Semi-bright cyanide copper strike
Semi bright strike process. Recommended for difficult to plate metals.
Techni Copper LUX
Acidic electrolytic copper plating process.
High thickness and excellent corrosion resistance
Can be used with cathode agitation or air insufflation as well
Techni Copper P
Alkaline Copper
Techni Cu 2300
Acid copper electroplating process designed for printed circuit board and reel-to-reel applications.
High purity and fine grained equiaxed deposits
Economical to use
Techni CU 85
Pre-Clean
Aggressive etchant for copper that has a long life and high copper capacity. Used to deoxidize/activate copper based parts prior to electroplating.
Techni CU 85
PCB specific: Pre-Clean
Techni CU 85 is a heavy-duty ammonia free peroxysulfate micro etch specifically designed to deoxidize and/or activate copper surfaces prior to electroplating.
Techni CU 9003
Bright alkaline copper plating process, suitable for rack and barrel operations.
Techni Cu No Dyes
Dye free acid copper plating bath, producing a bright deposit.
Very bright
Excellent throwing power
Techni CU Satin
Electroplating process that produces a smooth satin deposit.
Specifically engineered for plating uniform satin, even deposits from a stable electrolyte
Economical solution with only one additive to manage
Techni Cyless II
PCB specific
Techni Silver Cyless II is a cyanide-free, mildly alkaline silver-plating solution offering high chemical stability and outstanding deposit quality.
Techni Eco Antioxidant
Product to prevent Tin oxidation in all Tin plating processes. This product prevents the formation of sludge due to tetravalent tin, thus extending bath life.
Suitable for all acid Tin process (bright and matte). Cancerogenic and SVHC substances free. Full analyzable.
Techni Eco BT 2
Bright acid Tin process based on Tin sulphate and Sulfuric acid. The process is free from cancerogenic substances, suitable for barrel and rack applications.
Cancerogenic substances free. Bright and uniform deposit at all current densities. Easy to manage and inexpensive process.
Techni Electro Deflash #4
Electrolytic Deflash
Techni Electro Deflash #4 Conc
Electrolytic Deflash
Techni Electro Deflash PL (3X)
Electrolytic Deflash
Techni Electro-Deflash PL
Electrolytic Deflash
Techni EN 1500
Low phos (1-4% P) electroless nickel plating process
Techni EN 2600
Mid Phos (6-9%) EN Process
Techni EN 2600 SB
Mid phos (7-8% P) electroless nickel plating process
Techni EN 3500
High phos (10-12% P) electroless nickel plating process
Techni EN 3500 TF
High phosphorous electroless nickel process designed to deposit a uniform, nickel phosphorous composite alloy with ultra-fine PTFE particles.
Excellent release resistance and corrosion resistance
Meets MIL-C-26074E, AMS 2404 C and AMS specifications.
ELV, RoHS and WEEE compliant.
Techni EN 4100
Alkaline electroless nickel. Ideal for aluminum surfaces.
Exceptional stability
High tolerance to impurities
Techni EN 6500
Medium phosphorous electroless nickel, provides bright deposits.
Consistent rate plates
Meets MIL-26074B, AMS 24043 and AMS 2405 specifications
ELV, RoHS and WEEE compliant
Techni EN 6500 PT
Lead and cadmium-free mid-phos electroless nickel with very bright deposits.
- Free from cadmium and lead
- RoHS compliant
- Very stable process
- Produces very bright deposits
Techni EN 8200
RoHS Compliant Mid "phos" Electroless Nickel
Techni EN 8380
Mid phos (7-8% P) electroless nickel plating process
Techni EN 9155
High phosphorous content electroless nickel, provides semi-bright and non magnetic deposit.
Techni EN 9500
Electroless nickel for plastic
Techni EN Strip 1700
Electroless nickel stripper
Non cyanide alkaline stripper designed to remove electroless or electrolytic nickel from copper.
Techni EN Zincate
Cyanide free zincate process for the pretreatment of aluminum and aluminum alloys. Removes aluminum oxide and applies a thin immersion film of zinc on the surface that can be electroplated.
Techni GE 70
PCB specific: Glass Frost or Glass etch for Desmear process.
Techni GE 70 is an acidic, dry crystalline powder which is used to frost and etch glass fibers found exposed after the multilayer etch back cycle.
Techni Gold 1020C (EG)
Cobalt hardened gold process
Techni Gold 1020C (HH)
Cobalt hardened gold process
Techni Gold 1020C (HS)
Cobalt hardened gold process
Techni Gold 300
Nickel hardened gold plating process
High performance nickel hardened gold plating process for low speed, high speed, and selective applications. Very tolerant to metallic contamination.
Techni Gold 300R
Nickel hardened gold plating process
Techni Gold 303B
PCB specific: Electrolytic Hard Gold, Nickel hardener
Techni Gold 303B is a mildly acidic nickel-brightened gold plating solution recommended for use in rack applications.
Techni Gold 400
Cobalt hardened gold plating process
Techni Gold 400R
Cobalt hardened gold plating process
Techni Gold 434 HS
PCB specific: Pure gold plating process
Techni Gold 434 HS is a neutral pure gold plating process that produces matte to semi-bright, ultra-pure, ductile gold deposits that meet the requirements of Type III, Grade A of ASTM B488- 01 (Supersedes MIL-G-45204).
Techni Gold 434 HS
Pure gold plating process
434 Acid Pure Gold process is designed to produce a gold electrodeposit of 99.9+% purity for devices used in the semi-conductor, electronic, and PWB industries where high purity gold deposits are required to meet wire bonding requirements.
Techni Gold 800
Nickel hardened gold plating process.
Techni Gold 900
Cobalt hardened gold plating process
Techni Gold Barrel 850
Nickel hardened barrel gold plating process
Techni Gold Flash 850
Nickel hardened flash gold plating process
Techni Gold Flash 950
Cobalt hardened flash gold plating process
Techni Gold Strike SS
Gold alloy bath
Techni IM Gold AT 8000
PCB specific
Techni IM Gold AT8000 is a cyanide-free process that produces thin, adherent, pure gold immersion deposits onto electroless nickel substrates. Deposits are uniform and fine-grained with low porosity.
Techni Indium HS
Indium electroplating process
Techni JA Solder Strip
Single-step solder stripper
Techni M-16 Tin-Lead Stripper
Immersion belt stripper. Nitric acid based
Techni Matte Tin Sulfate 89TI
Matte Tin for rack and barrel
Techni ME 200
PCB specific: Liquid Micro etch, one component.
Techni ME 200 is a Liquid micro etch capable of uniform, copper removal. It can be used like any powder Micro etch used in the Printed Circuits Boards fabrication. It is 100% liquid and extremely stable even under low control.
Techni MN 63A
PCB specific: Potassium Permanganate desmear.
Techni MN 63 A (solid) epoxy etch compound that is used to clear multilayer printed circuit boards of drilling residue prior to metallization. It will promote good adhesion of direct metallization, graphite and electroless copper coating to the epoxy.
Techni MN 63L
PCB specific: Sodium Permanganate desmear.
Techni MN 63 L(Liquid) epoxy etch compound that is used to clear multilayer printed circuit boards of drilling residue prior to metallization. It will promote good adhesion of direct metallization, graphite and electroless copper coating to the epoxy.
Techni MN 66
PCB specific: Permanganate Desmear neutralizer.
Techni MN 66 is a post-etch back neutralizer solution designed to neutralize and clean permanganate residue out of the holes of printed circuit boards.
Techni MSI CuCN Bright Copper Cyanide
Alkaline Cyanide Copper Strike
Techni Neutralizer E-260
Post treatment process for tin and tin alloys
Techni NF 800 HS
TinLead Plating
Techni NF BT2
MSA-based bright tin and tin/lead plating process
Techni NF JB 3000
High speed bright tin plating process. MSA based electrolyte.
Techni NF JB 3400
High speed bright tin/lead plating process
Techni NF JB 3500
High speed bright tin/lead plating process
Techni NF JM 3000
High speed MSA based matte tin plating process. Fully compatible with Techni NF JB 3000 bright tin. Excellent solderability and resistance to reflow discoloration.
Techni NF JM 6000
High speed tin lead for reel to reel strip plating
Techni NF JM 6000 LS
MSA based process for matte tin and tin/lead plating
Techni NF JM 8000
MSA tin process that can be used in rack, barrel and high speed RTR equipment.
Techni NF TP-NT
Techni NF TP-NT process is a high speed matte pure tin electroplating process specifically formulated for the continuous strip and wire plating industry. Based on a methane sulfonic acid electrolyte containing a powerful antioxidant that minimizes oxidation of stannous tin. The current density range of the process is exceptionally wide, which allows the strip/wire line operator to maintain a low tin concentration in the plating bath without sacrificing line speed. Deposits have a lustrous matte to semi-bright finish, and are uniform in appearance at all usable current densities.
Techni Ni 19 L
Formaldehyde-free nickel brightener. Nickel brightener with mirror finishing for rack and barrel applications
Bright and white deposit. Ductile and levelled. Easy to manage.
Techni Nickel HT-2
PCB specific: Sulfate Nickel For High Aspect Ratio Deep tank Operation
Techni Nickel HT-2 is an advanced nickel electroplating process specifically engineered to significantly improve nickel thickness distribution vs standard sulfamate or sulfate solutions. Techni Nickel HT-2 increases nickel thickness inside blind vias and high aspect ratio through holes.
Techni Nickel S
Low stress, semi-bright, ductile nickel plating process
Sulfate or sulfamate, semi-bright, general purpose nickel underplate or final finish. Wide operational window and control parameters. Uses nickel bromide for anode corrosion.
Techni Nickel S-BF
Designed to produce a low stress, semi-bright, ductile nickel deposit for electronics applications in rack/barrel and SBE plating equipment. The process uses a revolutionary new buffering agent (Technic Nickel Buffer BF), which is completely free of all boron compounds.
- Completely free of all boron compounds
- Low stress, ductile deposits with good corrosion resistance
- All liquid products; no handling or additions of solids
- Can be used with either sulfate or sulfamate electrolyte
Techni Nickel TS
High speed nickel sulfamate plating process.
Techni NiPhos 611
Electrolytic nickel-phosphorous alloy plating process.
- Capable of depositing mid phosphorous containing nickel/phosphorous alloys (5-8% P).
- Ideal choice for high speed, mid phosphorous applications.
- Excellent solderability.
- Superior corrosion resistance.
Techni NPD P4
Decorative gold
TECHNI NPD P6
Decorative gold
Techni Pal PF
Cobalt and nickel-free palladium/iron alloy.
White deposit.
Cobalt and nickel free.
Suitable for applications requiring hypoallergenic solutions.
Techni PC 75 HS
Acid Copper
Techni Pre-dip 470 3X
Anti-immersion of Silver on Copper during high speed silver plating
Techni Red Rust 219
Process designed to obtain the "cor-ten" effect on iron and steel
Techni RS 611
PCB specific: Photo-resist Stripper.
Techni RS 611 is a highly concentrated, mildly alkaline aqueous solution formulated to strip aqueous dry film photo resist and alkaline soluble screen-printing inks.
Techni Silver 1006
Full bright silver
Techni Silver 1025
Full bright silver
Techni Silver 1028
Full bright silver
Techni Silver 1050
High speed
Techni Silver Cyless II
PCB specific: Cyanide free, Electrolytic silver.
Techni Silver Cyless II is a cyanide-free, mildly alkaline silver-plating solution offering high chemical stability and outstanding deposit quality.
Techni Silver Cyless II W
No cyanide bright silver.
Cyanide free, electrolytic silver plating process, bright deposit. Suitable for decorative or electronic applications.
Techni Silver Cyless II W Semi Bright
No cyanide semi-bright silver
Cyanide free, alkaline, electrolytic silver plating process, semi bright deposit.
Techni Silver E
Pure silver plating process with metallic brightener for decorative applications.
Techni Silver EHS-3R
High GAM / high brightness silver electroplating process for LED applications
Techni Silver HCD
Matte to bright silver plating process
Techni Silver LED
High GAM / high brightness silver electroplating process for LED applications
Techni Silver Stripper 3500
Anodic, high speed silver back-strip solution
Techni Silver® Cyless® 915
A cyanide-free, mildly alkaline semi-bright silver plating solution designed for rack, barrel and medium speed reel-to-reel plating applications.
- Electrolyte is cyanide-free.
- Produces a hard silver deposit.
- Suitable for use in rack, barrel and medium speed reel-to-reel plating applications
Techni Silver® Cyless® 915-HS
Cyanide-free silver process for medium-high speed electronics applications.
- Free of all cyanide compounds.
- High deposition rate.
- Effective operating costs.
Techni Solder Matte NF 820 HS
PCB specific
TECHNI SOLDER MATTE NF 820 HS is an electroplating process for the deposition of 63/37 tin/lead alloy or 100% pure Tin in rack plating applications. TECHNI SOLDER MATTE NF 820 HS provides a white-grey matte deposit from a methane sulfonic acid-based system.
Techni Solder NF W
High speed matte/satin pure tin for wire applications.
- Organic MSA-based process
- Non-foaming electrolyte
- Deposits exhibit excellent solderability with low organic co-deposition
- Easily analyzed bath components
- Single component grain refiner
- Exceptionally wide current density range
Techni Strip Cu 20
Stripper for copper deposits
Techni Strip SM New
Liquid chlorinated solvent-free descaling stripper.
It does not contain toxic substances such as DMF, phenols, ketones, etc. Non-flammable. Not aggressive for the majority of surfaces.
Techni SW 33
PCB specific: Solvent base sweller for permanganate desmear.
Techni SW 33 is a superior 1 component hole conditioner that facilitates rapid, uniform smear removal or etch back when used with Technic Desmear chemistry.
Techni SW 43
PCB specific: Sweller for Permanganate desmear.
Techni SW 43 is an alkali chemistry hole conditioner that facilitates rapid, uniform smear removal or etch back when used with Technic Desmear chemistry.
Techni Tarnex
Corrosion and tarnish protection
Techni TS 430
PCB specific: Tin and Tin-lead stripper.
Techni TS- 430 Tin Stripper is a nitric acid-based solution for stripping tin or tin/lead from printed circuit boards.
Techni TSC 1500
Cleaner suitable for all metals
Techni White
White bronze
Techni White EGB
Tri-alloy (Cu, Sn, Zn)Plating
Techni White Rhodium
Electrolytic Rhodium Plating Process
Techni White Rhodium-Ruthenium
Electrolytic Rhodium-Ruthenium Plating Processes
Techni White V
White bronze
Techni X-Cell 318
PCB specific: Pattern Plate Pre-clean
Techni X-Cell 318 is a liquid acid cleaner formulated for the removal of oxides, fingerprints, light oils, and other soils from copper or copper alloys.
TechniBrite 3111
Barrel & Rack bright tin plating
Technibrite HT 1000
Technibrite HT 1000 is Technic’s most advanced bright tin process for rack and barrel applications. The process eliminates tin metal growth problems by operating at higher cathode efficiencies and warmer temperatures. With its exceptional low current density bright range, complex geometry parts are uniformly bright in all areas.
TechniBrite RWB 1000
Low-speed pure tin plating process that produces reduced organic “white bright” deposits. It has been shown to be successful at plating very uniform part to part and area to area in barrel applications. The deposit it generates is a standout in the industry.
Reduced hydrogen generation during plating eliminates striations and pits. Can be used on very rough, uneven surfaces unlike full bright tin, which tends to require smooth, etched surface.
Technic Acid Gold Strike
Gold strike on difficult to plate base metals
Low pH gold strike with excellent adhesion on tin-nickel, stainless steel, Kovar, titanium, passive nickel and other difficult to plate base metals.
Technic Antique Gold
Specialty finish gold
Technic Aqua Shed-1
Drying enhancement
Technic CU 128
PCB specific
Technic CU 128 is an electrolytic acid copper process specially designed for plating flexible and thin rigid printed circuit boards. It is designed to work in high impingement, high speed, very high current density plating equipment, like Technic’s MP200 & MP100.
Technic Cu 2800
PCB specific: Medium to high technology DC Copper
TECHNIC CU 2800 is an electrolytic acid copper process specially designed to provide excellent distribution when plating through hole-printed circuit boards over a wide range of Low current densities.
Technic Electocleaner 100
Electrolytic cleaner
Technic Electocleaner 210G
Electrolytic cleaner
Technic EN 5600 IMP
Lead and cadmium-free medium phosphorus electroless nickel.
PCB specific: Electroless Nickel, mid Phos, RoHS compliant electroless nickel.
Technic EN AT 5600 IMP is an advanced, electroless nickel that produces a deposit with 6 – 9% w/w phosphorus.
It is specifically formulated for use with TechniPad ENIG and TechniPad ENEPIG processes for printed circuit boards and meets IPC4552 A and B.
Technic EN 5810
PCB specific: High Phos Electroless Nickel, Low Thickness for 5G.
Technic EN 5810 is an advanced, electroless nickel process that produces a deposit with 10 – 13% w/w phosphorus. It is specifically formulated for use with TechniPad ENIG and TechniPad ENEPIG processes for printed circuit boards and meets IPC4552 A and B.
Technic Envirostrip AG
Electrolytic anodic-current process to remove silver deposits from metallic under-layer as copper, brass and nickel.
No etching of the substrates
Silver is readily recovered
Technic High-Speed Nickel Sulfamate FFP
PCB specific
Technic High-Speed Nickel Sulfamate FFP process is designed for high-speed, high current density applications to produce a low-stress, semi-bright, ductile nickel deposit. The bath can be used with soluble or insoluble anodes.
Technic ISA Copper Oxide
PCB specifics: Copper Oxide for use with insoluble anodes
Ultra-high purity Copper Oxide to be used to replenish Copper in Copper Electrolytic plating, when used with ISA systems (Insoluble Anodes).
Technic JB Nickel
Nickel sulfate plating
Technic Microetch 85
Descale
Technic Non-Cyanide Silver Stripper
Silver Stripper
Technic Orostrike C
PCB specific: Acid Gold Strike
Technic Orostrike C is an acid gold strike bath that insures excellent adhesion on most basis metals, particularly over electroplated nickel.
Technic Palladium Nickel 900 TC
Pd/Ni alloy, semi-bright to bright , 70-90% Palladium
Technic Palladium Nickel AF-LS
Ammonia-free Palladium Nickel alloy barrel plating process (65-90% Palladium)
Technic Palladium Nickel VHS
Pd/Ni alloy, semi-bright to bright , 70-90% Palladium
Technic Predip 470
Anti-immersion predip chemistry prior to silver plating
Technic PST Neutralizer
Neutralizer-rinse aid
Technic Rhodium
Rhodium plate
Technic TEC 1016
Electrolytic cleaner
Technic Trushade
Specialty finish gold
Technic TSC 1508-L
Soak cleaner for ferrous and non-ferrous metals
Technic TSC-1501
Soak cleaner ferrous and non-ferrous metals
TechniCatalyst AT 4608
PCB specific: Organo-metalic Palladium Catalyst for activation of Cu surface for ENIG and ENEPIG process.
TechniCatalyst AT4608 is a chloride-free, organo-metallic activator specifically designed to produce an immersion palladium deposit for the complete and uniform initiation of electroless nickel such as Techni EN AT 5600 IMP or EN 5810 on Copper.
TechniClean 207AP
PCB specific: Acid cleaner, spay or soak.
TechniClean 207AP is a liquid low-foam acid cleaner formulated for the removal of oxides, fingerprints, light oils, and other soils from copper or copper alloys.
TechniClean CA25
PER Remover
TechniClean IK73
TechniClean IK73 is a post etch residue removal product that has been specifically targeted for the selective removal of highly-inert chemical residues created during the patterning of high-k dielectric metal oxides based on hafnium, zirconium and tantalum. Compatible with a wide range of metals and dielectrics normally present during high-k patterning, TechniClean IK73 functions at room temperature, is very easily rinsed and is suitable for immersion, batch-spray and single-wafer chemical applications.
Compatible with aluminum, copper dielectric materials
Designed for room temperature operation, water rinsable
Suitable for immersion, batch-spray and single wafer application
Techniclean OH
Electrolytic microetching cleaner for copper alloy.
TechniClean SF
Techniclean SF is a non-foaming, silicate free alkaline electrolytic-cleaner.
TechniClean TH 1020
PCB specific: Acid cleaner for ENIG & ENEPIG
TechniClean TH 1020 is an acidic NPTH cleaner designed to stop electroless nickel from depositing in non-plated through holes. It renders catalyst residues left behind by electroless copper processes inactive, stopping electroless nickel from depositing.
TechniClear 1100
Clear, acrylic - urethane cataphoretic lacquer that offers lower than normal temperatures for curing. This 25% solid pre-emulsified lacquer exhibits excellent adhesion to all metals and does not yellow when used on silver.
- Non-flammable.
- Can be used with integral pigments or post dyes.
- Low solvent levels.
- Improved scratch resistance.
- Low running costs.
- A hardness of 5 H is possible using the correct curing on nickel electroplate, which makes it very abrasion resistant when compared to other systems.
TechniClear 1100 Black
Black, acrylic - urethane cataphoretic lacquer that offers lower than normal temperatures for curing. This 25% solid pre-emulsified lacquer produces a uniform black finish, with all the properties of TechniClear 1100.
- Good solvent resistance.
- Easy to control.
- Improved scratch resistance.
- Low running costs.
- Has excellent adhesion to all metals and does not yellow when used on silver.
- A hardness of 5 H is possible using the correct curing on nickel electroplate, which makes it very abrasion resistant when compared to other systems.
TechniClear 1190
Acrylic - urethane pre-emulsified cataphoretic lacquer that offers lower than normal temperatures for curing. Enhanced version of TechniClear 1100.
- Formulated to give increased performance when used on copper and copper alloys.
- Can be used with integral pigments or post dyes.
- Has excellent adhesion to all metals.
- Does not yellow when used on silver.
- A hardness of 5 H is possible using the correct curing on nickel electroplate, which makes it very abrasion resistant when compared to other systems.
TechniClear 1200
25% solid pre-emulsified cataphoretic lacquer. This product offers an improvement in deposit hardness, compared to the previous products.
- Improved lacquer film hardness.
- Very good adhesion on multiple substrates.
TechniClear 1350
High-solid cataphoretic lacquer for decorative and industrial applications. Enhanced properties such as solvent resistance, hardness and formic acid durability.
- Improved lacquer film hardness.
- Higher resistance to solvent and formic acid attack.
- Enhanced scratch and wear resistance.
- Thicker lacquer deposits possible.
TechniClear 1400 Super C
High-solid cataphoretic lacquer used for decorative and industrial applications.
- Formulated for superior solvent resistance.
- Excellent adhesion to all metals.
- Good perspiration resistance.
TechniClear Eco Strip
Liquid Stripper for cataphoretic lacquers.
Contains no amines, no chlorinated solvents or strong alkaline materials. Chemical mixture that requires no dilution.
TechniClear IP 901 Gold
TechniClear IP 901 Gold is a rich gold pigment for use in TechniClear Cataphoretic Lacquers.
Electrophoretic coating (E-coat)
TechniClear Matting Agent
TechniClear Matting Agent is used on cataphoretic lacquer (TechniClear 1100) to obtain a matte/satin finish.
Electrophoretic coating (E-coat)
TechniClear PD 101 Copper
TechniClear PD 101 Copper is a copper colour post dye for use with TechniClear Cataphoretic Lacquers.
Electrophoretic coating (E-coat)
TechniClear PD 201 Blue
TechniClear PD 201 Blue is a blue color post dye for use with TechniClear Cataphoretic Lacquers
Electrophoretic coating (E-coat)
TechniClear PD 202 Blue
TechniClear PD 202 Blue is a pale blue color post dye for use with TechniClear Cataphoretic Lacquers.
Electrophoretic coating (E-coat)
TechniClear PD 301 Red
TechniClear PD 301 Red is a red color post dye for use with TechniClear Cataphoretic Lacquers
Electrophoretic coating (E-coat)
TechniClear PD 401 Black
TechniClear PD 401 Black is a grey color post dye for use with TechniClear Cataphoretic Lacquers.
Electrophoretic coating (E-coat)
TechniClear PD 402 Black
TechniClear PD 402 Black is a grey colour post dye for use with TechniClear Cataphoretic Lacquers.
Electrophoretic coating (E-coat)
TechniClear PD 501 Bronze
TechniClear PD 501 Bronze is a bronze color post dye for use with TechniClear Cataphoretic Lacquers.
Electrophoretic coating (E-coat)
TechniClear PD 504 Stainless Steel
TechniClear PD 504 Stainless Steel is a stainless steel colour post dye for use with TechniClear Cataphoretic Lacquers.
Electrophoretic coating (E-coat)
TechniClear PD 505 Bronze
TechniClear PD 505 Bronze is a bronze color post dye for use with TechniClear Cataphoretic Lacquers.
Electrophoretic coating (E-coat)
TechniClear PD 506 Bronze
TechniClear PD 506 Bronze is a bronze color post dye for use with TechniClear Cataphoretic Lacquers.
Electrophoretic coating (E-coat)
TechniClear PD 601 Green
TechniClear PD 601 Green is a green color post dye for use with TechniClear Cataphoretic Lacquers.
Electrophoretic coating (E-coat)
TechniClear PD 701 Purple
TechniClear PD 701 Purple is a purple color post dye for use with TechniClear Cataphoretic Lacquers.
Electrophoretic coating (E-coat)
TechniClear PD 801 Brass
TechniClear PD 801 Brass is a brass color post dye for use with TechniClear Cataphoretic Lacquers
Electrophoretic coating (E-coat)
TechniClear PD 803 Yellow
TechniClear PD 803 Yellow is a yellow color post dye for use with TechniClear Cataphoretic Lacquers.
Electrophoretic coating (E-coat)
TechniClear PD 901 Gold
TechniClear PD 901 Gold is a gold color post dye for use with TechniClear Cataphoretic Lacquers.
Electrophoretic coating (E-coat)
TechniClear PD 904 Gold
TechniClear PD 904 Gold is a gold color post dye for use with TechniClear Cataphoretic Lacquers.
Electrophoretic coating (E-coat)
TechniClear PD 905 Orange
TechniClear PD 905 Gold is a gold color post dye for use with TechniClear Cataphoretic Lacquers.
Electrophoretic coating (E-coat)
TechniEtch 1118
PCB specific: Horizontal or vertical process for preparation of copper prior to resist application or prior to plating copper, tin or nickel.
TechniEtch 1118 is a proprietary ammonia-free, persulfate micro etch designed to provide improved topography over standard persulfate and peroxide chemistry at the same etch depth. This topography will improve resist, Solder Mask or plating adhesion.
TechniEtch AC35
Gold (Au) and copper (Cu) etchant offering minimal metal undercutting while performing an effective etching of each or both metals.
Etchant offering minimal metal undercutting while performing an effective etching of each or both metals.
TechniEtch ACI2
Gold Etchant
TechniEtch CN10
Copper Seed Layer Etchant
TechniEtch Cu Deburr
Copper deburr/etch process
TechniEtch TBR19
Ti, TiN, and TiW Etchant
TechniFlex LCL 1000F/001G
Amber photoimagable flexible solder mask
TechniFlex LCL 1000F/110G
Green photoimagable flexible solder mask
TechniFlex LCL 1000F/150G
Green LDI/DI Liquid Photoimagable solder mask SM/Coverlay Film For Flexible Circuits
TechniFlex LCL 1000F/281S
Blue photoimagable solder mask.
TechniFlex LCL 1000F/410G
Black photoimagable flexible solder mask
TechniFlex LCL 1000F/410M
Black photoimagable flexible solder mask
TechniFlex LCL 1000F/421M Code 06
Black photoimageable flexible solder mask
TechniFlex LCL 1000F/421M U6
Black direct image flexible solder mask
TechniFlex LCL 1000F/421M U8
Next generation black direct image high heat resistance flexible solder mask
Extremely high heat resistance
Low exposure energy
Stackable, tack free surface after drying
TechniFlex LCL 1000F/423M U7
Matte black solder mask for flexible applications using direct imaging. For direct imaging/manual exposure for high multiple layer cut sheet flexible circuit panel and roll to roll applications.
TechniFlex LCL 1000F/452M
Black direct image soldermask
TechniFlex LCL 1000F/900G
White photoimagable solder mask
TechniFlex LCL1000F/421M U8 w CAT1000F/000G E15M
Next generation black flexible solder mask
High heat and flux resistances
TechniMask ISR 1000
Liquid Photoimagable Solder Mask
TechniMask UV SR2
UV Curable Solder Mask
Technipad 7611
PCB specific: Electroless Palladium, Pure Palladium deposit.
TechniPad 7611 is a stable, autocatalytic, electroless palladium plating solution. It is designed to deposit a pure palladium deposit on electroless nickel to improve solderability and provide a surface for both aluminum and gold wire bonding.
Technipad AU 6100
PCB specific: Immersion Gold, controlled deposition, Cyanide base chemistry. For ENIG and ENEPIG.
TechniPad Au 6100 is a cyanide-based immersion gold plating process designed to provide a controlled deposition of thin pure gold deposits onto electroless nickel and electroless palladium.
Technipad AU 6100
PCB specific.
TechniPad Au 6100 is a cyanide-based immersion gold plating process designed to provide a controlled deposition of thin pure gold deposits onto electroless nickel and electroless palladium.
Technipad IS 7070
PCB specific: Stable, non-cyanide, immersion silver for deposition onto copper and copper alloys. The deposit is tarnish resistant and gives consistent solderability. Nitrate free.
TechniPad IS 7070 is an extremely stable, nitrate free, slightly alkaline solution for immersion deposition of silver onto copper and copper-based alloys.
Techniphos 615
Boric acid-free electrolytic nickel-phosphorous alloy plating process.
- Capable of depositing high phosphorous containing nickel/phosphorous alloys (≥10% P).
- Non-magnetic deposit, suitable for high frequency/5G applications.
- Improves corrosion resistance significantly compared to pure nickel barrier layers.
- Can be utilized in reel-to-reel or barrel plating applications.
TechniPolish 3212
Remove the substrate defect
TechniPress Resist 101
Press solder mask
Techniseal Ag
Chrome-free nanoscale anti-corrosion/discoloration coating for high-temperature applications.
Cathodic electrolytic passivation system that provides a transparent nano-scale, protective coating on silver to improve corrosion resistance and minimize appearance degradation. Techniseal Ag protects silver from tarnishing during exposure to heat and/or sulfur corrosion testing.
Technistan Ag
MSA based semi-bright to full bright tin-silver alloy (1-7% silver)
Technistan EP
Lead-free, High Speed Electrolytic Matte Tin.
Technistan EP is a high speed, pure tin whisker resistant plating process based on Technic’s proprietary and patented mixed acid technology. Industry standard for Pb-free plating for more than 10 years.
Technistan JB 3000
High speed bright tin plating process. Sulfate based electrolyte.
Technistan JM 6000 LS
Sulfate based matte tin. Sulfate based electrolyte.
Technistan JM 7000
Sulfate tin process that can be used in rack, barrel and high speed RTR equipment.
Technistan TP
High speed matte tin sulfate process designed for use on lines with in-line tin reflow furnaces.
Technistan TP-5000
High speed matte tin sulfate process designed for use on lines with in-line tin reflow furnaces.
High speed matte pure tin plating process based on sulfuric acid electrolyte. Offers significant cost advantages vs MSA systems.
Technistan TP-W
High speed matte/satin pure tin for wire applications.
- Based on sulfuric acid technology
- Offers significant cost advantages to MSA systems
- RoHS compliant
- Single-component grain refiner
TechniStrip AU
Gold Stripper
Cyanide based gold stripper prepared from dry mix. Removes gold from most base metals.
TechniStrip CU XP
Strips copper deposits from stainless steel substrate - Hydrogen peroxide, fluoride and boron free
An acidic electrolyte specifically formulated to strip copper deposits from stainless steel substrate. It does not contain any hydrogen peroxide, fluoride or boron. The stripper produces very little sludge and is designed for use in immersion stripping op.
TechniStrip EL
Electrolytic process for stripping copper, nickel and tin from titanium or stainless steel plating racks.
TechniStrip EL-AF
Electrolytic process for stripping copper, nickel and tin from titanium or stainless steel plating racks.
TechniStrip ELBS
Electrolytic belt stripper. MSA based.
TechniStrip ELBS - II
Electrolytic Tin Stripper
TechniStrip MLO-07
Stripper for Metal Lift-Off
TechniStrip NF52
Stripper for Dryfilm Resist
TechniStrip NF90
TMAH Free Stripper
Offers similar performance to TechniStrip NF52. High resin dissolution and excellent metal compatibility.
TechniStrip NI555
Stripper for Advanced AZ EM Resist
TechniStrip NISN
Tin Stripper
TechniStrip P1331
Stripper for Liquid Resist
Solution that has a wide range of applications. It is ideal for use in backend applications like TSV, Cu pillar, bumping, etc. Offers complete dissolution of thick film resist with excellent metal compatibility. Water based stripper.
TechniStrip Silver Special
Sodium cyanide based stripper formulated to chemically remove silver deposits.
TechniStrip® Micro D2
TechniStrip® Micro D2 is a versatile photoresist stripper formulated to address resin lift-off and dissolution of negative and positive tone resist. TechniStrip Micro D2 is an environmentally friendly alternative for NMP, DMSO and DMSO/Amine based photoresist strippers.
Non-hazardous replacement for NMP with lower running cost and improved performance over NMP and DMSO based resist strippers
Technotan PC
Prevention of copper surfactant oxidization
Tin Cobalt
Tin -cobalt plating
Top Coat 11
Sealer for conversion
Top Coat 14
Sealer agent for zinc and zinc alloy.
Suitable for use in automotive applications
Excellent control of friction coefficient
Top Coat IG 21
Sealer agent in water phase for zinc and zinc alloy.
For use after trivalent or hexavalent chromic passivation
No residual rainbow stains after drying
TRUSHADE 24 K
Decorative gold
TRUSHADE S 7
Decorative gold
UVER 2
Alkali soluble UV curing etch resist, suitable for use with many alkaline and acidic etchants.
Excellent surface finish free of bubbles, dewets and particulates.
High definition (no "ghost" in image after etching).
Simple UV drying.
Good etch resistance.
Easily removed in simple caustic solutions, such as NaOH (sodium hydroxide).
V-10, 20, 30 series
Oil separator for plating pre-treatment
Vega 3000
Acid chloride zinc plating process. Suitable for rack and barrel applications.
Non-foaming surfactant system perfectly suited for high agitation/high current density plating
Additives offer a very high cloudy point to provide excellent tolerance to high bath temperature
Vega 5 RS
Cyanide zinc process
Vega W 28
Acid zinc process
Vega ZF 210
Alkaline electrolytic process for deposition of zinc-iron alloy (0.3-0.6% Fe). Suitable for barrel and rack applications.
Deposit compared with conventional Zn offer higher corrosion resistance
Deposit can be passivated with yellow-iridescent and black passivation
Wonder 11A/B
Trivalent chrome black conversion for zinc/nickel alloy deposits.
Excellent weather resistance
High corrosion resistance
Wonder 22 AL B
Trivalent chrome blue conversion for zinc and nickel deposits.
Wonder CF 150
Iridescent passivation for alkaline and acid Zinc process.
Passivation cobalt free for alkaline and acid zinc deposits, with iridescent finish.
Wonder CF-B 10
Black cobalt-free passivation with very bright deposits for acid and alkaline zinc.
- RoHS compliant.
- Superior corrosion protection.
- Easy to manage.
- Safer handling.
- Safer, cheaper waste management.
- Reduced replenishing.
Wonder CFY 1
Clear/blue passivation for alkaline and acid zinc, hexavalent chromium and cobalt-free.
- Very high corrosion resistance.
- Meets SVHC of Reach restriction.
- Can be used to obtain iridescent appearance.
- Safer handling.
- Safer, cheaper waste management.
- Reduced replenishing.
Wonder Clear 74
Transparent passivation for Zinc/Nickel process.
Passivation cobalt free for Zinc/Nickel deposits, with transparent finish. Suitable on rack and barrel applications.
Wonder CYN 22
Clear/blue cobalt-free passivation for alkaline zinc nickel.
- Can be used to obtain iridescent appearance.
- Optimal conversion treatment for zinc and high nickel plating, (Nickel co-deposition rate: 12 – 18%).
- Safer handling.
- Stable corrosion performance, including damaged areas.
- Reduced replenishing.
Wonder SB 18
Trivalent chromium blue conversion coating for alkaline or acid zinc with or without cyanide.
Suitable for both alkaline and acid zinc
Contains cobalt metal
Adapted to RoHS regulation and does not contain Pb, Cd, Hg, Cr6+, PBB and PBDE
Wonder TR 36
Trivalent blue chrome conversion coating for acid and alkaline zinc.
Low corrosion resistance. Produces dip blue deposits. Good tolerance to iron contamination. Cobalt free.
Wonder Z 7
Trivalent black chrome conversion coating for zinc deposits.
Suitable for alkaline and acid zinc
Good scratching
Wonder Z BL 30
Blue cobalt-free passivation for acid and alkaline zinc.
- Cobalt-free product.
- Suitable for both acid and alkaline zinc.
- RoHS compliant.
Wonder Z BSR
Trivalent chrome based chromate conversion coating of blue, silver (white), and rainbow (iridescent) colors on alkaline and acid zinc.
Wonder ZA-ZB
Trivalent black chrome conversion coating for alkaline zinc.
Produces a black dip color
Long life solution with good performance
