Semiconductor Fabrication and Packaging


Fabrication and Packaging Materials

Technic’s semiconductor fabrication and packaging chemistries, marketed under the name Elevate®, are well respected for innovation and high quality. Elevate® processes offer high performing electroplating chemistries for copper, nickel, tin and precious metals. In addition Technic supplies photoresist strippers for liquid and dryfilm resist as well as metal etchants and cleaners for a variety of substrates.

Technic products provide a number of specific attributes that can allow semiconductor manufacturers to remove many process limitations and bring their technology to a new level. Our semiconductor fabrication and packaging chemistries are widely used in several advanced packaging platforms including FOWLP (Fan Out Wafer Level Packaging), Fan In WLP, Flip Chip and 2.5/3D