Technic Electroplating Chemistry, Plating Equipment, Metal Powder, Silver Powder, Analytical Controls, semiconductor chemistry, printed circuit chemistry, industrial plating products, decorative plating chemistry, connector plating chemistry

Techni NF JM 8000 and Technistan JM 7000 - Advanced Tin Processes for Reel to Reel Connector Plating

Technic’s matte tin plating technology, released in 2014, has proven to represent a break-through in Pb-free whisker-resistant finishes for electronic connector plating applications.

Techni NF JM 8000 and Technistan JM 7000 are uniquely characterized by a tin morphology whereby the tin deposit thickness is made up of tightly packed single tin crystals. This critical characteristic helps minimize grain boundaries, resulting in improved solderability and improved resistance to corrosion induced tin whiskers. Testing of deposits show exceptionally slow whisker growth under 3000 cycles in Thermal Cycle testing (-55°C to 85°C) and 4000 hour Ambient and Learn more

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Technic Taiwan Expands to New Facility

Technic Taiwan has announced the purchase of a facility in the Hsin-Chu Industrial Zone of Taiwan. The 1,020 square meter building is currently undergoing extensive renovations and is expected to be fully operational by the summer of 2015. Located within close proximity to the world’s leading manufacturing and research facilities for Semiconductor technology, Technic’s newest facility will house a fully equipped analytical laboratory, advanced semiconductor and solar applications plating tools in support of ongoing research Learn more

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