Technic Electroplating Chemistry, Plating Equipment, Metal Powder, Silver Powder, Analytical Controls, semiconductor chemistry, printed circuit chemistry, industrial plating products, decorative plating chemistry, connector plating chemistry

Technic's Lynne Michaelson, Ph.D.
Presents Paper at 13th Annual IWLPC Conference

Technic’s Dr. Lynne Michaelson presented her work with Advanced Gold Electroplating for Semiconductor Devices at the 13th Annual International Wafer-Level Packaging Conference and Exhibition held October 18-19 in San Jose, California. In this, the first installment of our new video series Technic Talk, Lynne sat down with Ron Mello to discuss her findings and tell us about some of the work that has gone into her research. In this, the first of two segments, Lynne discusses Technic's role in meeting the challenges of today's semiconductor manufacturing.
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Technic launches SDS (Safety Data Sheet) portal access for customers

Technic is pleased to announce the implementation of a new, self–serve SDS portal. Customers can now access the most current Safety Data Sheets on their purchased products. The new portal enables customers to comply proactively with environmental regulatory obligations while improving the efficiency in obtaining proper SDS documentation.

Technic customers may download documents at any time, without having to call or wait for an e-mailed response. Our secure and automated SDS portal offers customers the convenience of 24-7 account access. Learn more

Techni Print Eco-Reclaim Agent makes support cleaner disposal easy, safe and clean

Technic has announced the release of Techni Print Eco-Reclaim Agent, a powdered additive to process saturated Techni Print Cleaning Solution for easy and safe disposal.

Techni Print’s Eco Reclaim Agent has the unique ability to reclaim almost all of the support material from a saturated Techni Print solution. With this unique additive, a fully saturated Techni Print cleaner can be separated into a solid mass of support material and a Learn more