Technic Electroplating Chemistry, Plating Equipment, Metal Powder, Silver Powder, Analytical Controls, semiconductor chemistry, printed circuit chemistry, industrial plating products, decorative plating chemistry, connector plating chemistry
Technic's Lynne Michaelson, Ph.D.
Presents Paper at 13th Annual IWLPC Conference
Technic’s Dr. Lynne Michaelson presented her work with Advanced Gold Electroplating for Semiconductor Devices at the 13th Annual International Wafer-Level Packaging Conference and Exhibition held October 18-19 in San Jose, California. In this, the first installment of our new video series Technic Talk, Lynne sat down with Ron Mello to discuss her findings and tell us about some of the work that has gone into her research. In this, the first of two segments, Lynne discusses Technic's role in meeting the challenges of today's semiconductor manufacturing.
Find the right Technic product for your application
Our Technology Support Hub is designed to make our products easy to use and allows users to research the best process solutions for their specific application needs. Technic's TSH features interactive calculators, technical process guides, information and training videos, as well as support information for our proprietary product offerings.
Technic Releases CU128 - New Versatile Acid Copper for High-Speed PCB Plating
Technic is pleased to announce the release of Technic CU128, a newly developed acid copper plating process for both flexible and rigid PCB applications. CU128 has proven to be especially versatile in high-speed plating operations where it is capable of achieving current densities above 10 ASD (100ASF). CU 128 is specifically formulated to double current productivity without having to invest in new equipment. The CU128 deposit is extremely ductile, passing over 1000 bends and providing over 25% elongation. Technic’s CU128 can be used Learn more
With over 100 installations worldwide, Technic's SBE has revolutionized the small parts plating landscape.
Technic's Spouted Bed Electrode (SBE) is a patented method of electroplating small components such as electronic connectors, pins, chip capacitors and chip resistors. The SBE plating system replaces a 4" x 6" inch barrel with the patented SBE chamber. The load size is from 50 to 500mls and uses significantly less conductive media. The SBE plating chamber's unique design provides for a rapid circulation of the parts over the cathode current feeder without the use Learn more
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