Connectors

Connectors


Technic supplies precious metal and tin / tin alloy electroplating processes for all types of connector plating applications. Innovative technologies aimed at reducing or replacing gold usage coupled with enhanced environmental compatibility, are a primary focus in new product development.


Nickel Electroplating



High Speed Nickel Sulfamate FFP
The Technic High Speed Nickel Sulfamate FFP process is designed for high speed, high current density applications to produce a low stress, semi-bright, ductile nickel deposit from either a sulfamate or sulfate electrolyte.

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Techni Nickel HSG
Techni Nickel HSG is an environmentally friendly process designed for high speed, high current density plating in a variety of electronic plating applications. Techni Nickel HSG produces a low stress, semi-bright, ductile nickel deposit from a chemistry which is completely free of amines and is, therefore, suitable for green technology applications.

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Techni Nickel TS
Techni Nickel TS is a patented process designed for high speed, high current density applications to produce a low stress, semi-bright, ductile nickel deposit which provides protection from discoloration of over-plated tin deposits which are subsequently subjected to IR reflow or other types of extreme thermal exposure.

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Palladium & Palladium Alloy Electroplating



Pallaspeed 990

Technic's Pallaspeed 990 has proven to be a highly effective process, producing a high ductility/low-stress bright deposit with no microcracking in thicknesses up to 4 µm. The process features a neutral pH with no ammonia smell and offers a wide current density range with a stable electrolyte.

The Pallaspeed 990 key characteristic is that the process incorporates a minimal amount of hydrogen during plating, which eliminates cracking of the deposit. Pallaspeed 990 is a fully analyzable process with simple UV/VIS procedures for additive control. The process is stable with a greater than 5 metal turnover (MTO) bath life.

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Pallaspeed Palladium Nickel NFA
The Pallaspeed Pd/Ni NFA process is specifically designed to eliminate free ammonia, improving both worker and environmental safety through the elimination of harmful fumes. The process is also chloride free, eliminating possible corrosion of stainless steel equipment. The pH of Pallaspeed Pd/Ni NFA is more stable than conventional Pd/Ni processes, reducing the need for frequent ammonia additions. The Pallaspeed Pd/Ni NFA process produces industry leading, micro-crack free deposits at thicknesses up to 2.5 microns with excellent adhesion. The deposits pass both the bleach and sulfurous acid porosity tests commonly used in the electronics industry.

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Technic Palladium Nickel VHS
Technic Palladium Nickel VHS produces Pd-Ni alloy deposits that exhibit exceptional ductility and porosity from a conventional palladosamine chloride. Alloys containing 70 – 90% palladium can be achieved.

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Technic Palladium Nickel AF / Technic Palladium Nickel AF-LS
Technic Palladium Nickel AF produces Pd-Ni alloy deposits from an electrolyte that is completely free of ammonia and as a result provides a safer working environment, free of ammonia fumes. Technic Palladium Nickel AF operates at an acidic pH. Therefore, adhesion directly onto nickel surfaces is greatly enhanced. The process is designed to operate in medium speed (e.g. reel-to-reel) applications, up to a maximum current density of 200 ASF (20 ASD). For barrel and conventional rack plating applications, Technic Palladium Nickel AF-LS is recommended.

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Technic Palladium AF

Technic Palladium AF is recommended for pure Palladium applications requiring an ammonia-free electrolyte.

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Gold & Silver Electroplating



Techni-Gold 300 / Techni-Gold 400
Techni Gold 300 is a mildly acidic nickel brightened gold plating solution recommended for use in barrel, rack, high speed and selective plating applications. The solution is operable over wide ranges of gold concentration, pH, and temperature, and has a high complexing ability for dragged in base metals. Techni-Gold 400 is used for applications requiring cobalt-hardened gold.

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Techni-Gold 1020C (HS) / Techni Gold 1020N (HS)
Techni Gold 1020C (HS) is a mildly acidic cobalt brightened gold plating solution recommended for use in high speed and selective plating applications. The solution operates at relatively low gold metal concentrations while producing deposits with low porosity.. Techni Gold 1020N (HS) is used for applications requiring nickel-hardened gold.

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Techni Silver 1025 / Techni Silver 1050
Techni Silver 1025 is a selenium brightened pure silver plating process that produces semi-bright to mirror bright ductile silver deposits with excellent wear resistance, in rack and barrel and certain other applications. Techni Silver 1025 can be used to plate connectors, contacts, switches, and a variety of electronic components where high purity silver deposits are required. Techni Silver 1050 is recommended for high speed applications. Deposits from Techni Silver 1050 meet the requirements of ASTM B700-97 (supersedes QQ-S-365D).

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Techni Silver EHS 3R
Techni Silver EHS 3R is a high speed silver plating solution designed to deposit pure silver in electronic plating applications from a phosphate electrolyte. The bath is designed to operate at very low concentrations of free cyanide with inert anodes. Techni Silver EHS 3R can produce deposits from matte to full bright.

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Techni Silver 1006
Techni Silver 1006 is an antimony brightened pure silver plating process that produces mirror bright ductile silver deposits with excellent wear resistance.

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Tin & Tin Alloy Alloy Electroplating


Technistan JM 7000
Sulfate tin process for use in in rack, barrel and high speed RTR equipment. Whisker resistant deposit (JEDEC tests). Excellent deposit uniformity at all usable current densities. Excellent solderability. Great throwing power, even with high tin formulations. Sulfate formulation eliminates potential problems with lead co-deposition.

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Techni NF JM 8000
MSA tin process for use in rack, barrel and high speed RTR equipment. Whisker resistant deposit (JEDEC tests). Excellent deposit uniformity at all usable current densities. Excellent solderability. Great throwing power, even with high tin formulations. Single component Additive simplifies bath maintenance. Capable of plating at extremely high current densities.

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Technistan Ag
Technistan Ag is a patent-pending high speed plating process that deposits a semi-bright to full bright tin-silver alloy in the range of 90-99% tin. Technistan Ag deposits have an extremely stable alloy composition across a wide range of plating process variables. Even parts with complex geometry will have a consistent alloy in all areas of the part. This is very important, as the melting temperature of the alloy can range from 221° C at the tin-silver eutectic – 96.5% Sn/3.5% Ag to over 300° C for the silver rich 90/10 deposit. Therefore, the alloy will determine the suitability of the tin silver deposit for specific applications, such as high temperature solder for automotive engine/exhaust system connectors and sensors.

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Techni BT2
The Techni BT2 bright tin process is a low cost bright tin process based on sulfuric acid. It is designed for rack and barrel plating applications. The bright tin deposits have excellent solderability characteristics and are whisker resistant as defined by JEDEC JESD201A standards

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Techni NF JM 6000 / Techni NF JM 6000-LS
Techni NF JM 6000 is designed specifically for high and medium speed electrodeposition of matte tin, 90/10 and 60/40 tin/lead alloys for electronic plating applications, such as connectors and components from an MSA electrolyte. The deposit has a uniform appearance over a wide current density range and is readily reflowed or soldered. Pure tin deposits from Techni NF JM 6000 are whisker-resistant and satisfy all requirements of JEDEC JESD201A. For barrel and conventional rack plating applications, Techni JM 6000-LS is recommended.

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Techni NF JB 3000 NS
Techni NF JB 3000 NS is a patented process which produces mirror bright pure tin deposits from an MSA electrolyte. The Techni NF JB 3000 NS process is designed for use in high-to-mid speed electronic plating applications such as continuous strip and reel-to-reel connector applications, including controlled depth plating. The process is operated at slightly elevated temperatures, which improves the cathode efficiency while still maintaining deposit brightness. Tin deposits from Techni NF JB 3000 NS are whisker-resistant and satisfy all requirements of JEDEC JESD201A.

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Techni NF JB 3400
Techni NF JB 3400 is a unique process which produces mirror bright 90/10 or 60/40 tin/lead alloy deposits from an MSA electrolyte. The Techni NF JB 3400 process is designed for use in electronic plating applications such as continuous strip and reel-to-reel connector plating, including control depth applications. The process can be operated at elevated temperatures, which improves the cathode efficiency while still maintaining deposit brightness.

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Post-Treatment


Tarniban 60
Tarniban 60 is a post-treatment process which effectively protects silver deposits from oxidation/tarnishing especially when subjected to high thermal exposure environments. Tarniban 60 forms a thin, transparent film on the silver/gold surface which provides resistance to corrosion. The protective film has no detrimental effect on the electrical properties of the treated silver.

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Tarniban KS II
Tarniban KS II is a post-treatment process which effectively protects silver surfaces from oxidation/tarnishing. It may be used as an immersion only process or applied anodically for increased protection. When used as directed, Tarniban KS II forms a thin, colorless, transparent film on the silver surface which provides resistance to corrosion. The protective film has no detrimental effect on the electrical properties of the treated silver.. Furthermore, Tarniban KS II has no adverse effects on solderability or electrical properties. Tarniban KS II can also be used to minimize porosity of gold deposits as measured by the nitric acid vapor porosity test.

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Tarniban CBG
Tarniban CBG is a post-treatment process which effectively protects gold plated surfaces from corrosion and oxidation. When used as directed, Tarniban CBG forms a thin, colorless, transparent film on the plated surface which provides resistance to corrosion, especially during nitric acid vapor porosity testing. Tarniban CBG acts as a porosity “sealant” which enables lower gold thickness to be utilized. Tarniban CBG has no detrimental effect on the electrical properties of the substrate. The product is to be used as supplied, with no further dilution.

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Technic PST Neutralizer
An alkaline post-treatment process that effectively neutralizes acid films from tin and tin alloy plating process residues.

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Tarniban C48
Tarniban C48 forms a thin, benign, transparent film on tin and tin alloy deposits and effectively protects them during exposure to high temperature / high humidity environments. Tarniban C48 minimizes deposit discoloration during storage and provides improvements in solderability performance during steam age pre-conditioning. Tarniban C48 also minimizes corrosion-induced tin whisker growth caused by high temperature/humidity exposure. Can also be used as a rinse-aid. For optimal results, Tarniban C48 should be used in full immersion mode in combination with Technic PST.

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Tarniban C50
Tarniban C50 offers similar benefits as the Tarniban C48 with added protection from extreme dry heat exposure (e.g., reflow).

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