Boron-Free Nickel Plating for Semiconductor Applications
Cranston, RI, USA – Technic is pleased to announce the commercial release of Elevate Ni 5950, after several successful production installations. The process has been run successfully in a variety of applications including pattern plating, metal stack plating, and as a hard mask for difficult to etch substrates such as SiC.
Unlike the current standard boric acid nickel processes, Elevate Ni 5950 utilizes all liquid components, making it easier to replenish and more compatible with semiconductor fabrication processes.
Nickel electroplating chemistries with boric acid have been utilized for decades in the electronic and industrial plating industries. The replacement of boric acid could only be successful if the nickel deposit was uncompromised. Elevate Ni 5950 has been shown to not only produce deposits that are comparable to standard nickel plating processes, but in many cases, the deposit attributes have shown superior results.
Anthony Gallegos, Global Product Manager, Semiconductor Technology
Technic continues to be a leader in the development of specialty chemicals for the semiconductor industry that are free of toxic components and safer for the environment. Technic sulfite gold chemistries are free of toxic additives like thallium and arsenic and our NMP free photoresist strippers, are just a few examples of products currently being used around the world in mass production enabling safer and more sustainable production.