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Process Results (468) Request More Information

1006 Silver

Bright Silver plate
Characteristics: Mirror-bright ductile decorative deposit with excellent wear resistance.
Availability: North America, Asia Pacific
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40 Acid Gold Strike

Gold strike on difficult to plate base metals
Characteristics: Low pH gold strike with excellent adhesion on tin-nickel, stainless steel, Kovar, titanium, passive nickel and other difficult to plate base metals.
Availability: Asia Pacific
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9025 Gold Stripper

Gold Stripper

Characteristics:

High speed gold stripping formulation for removal of gold from nickel, nickel alloy, kovar, or nickel protected copper base metal.

Availability: North America
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9050 Palladium Stripper

Chemical stripper for removing deposits of palladium, palladium/nickel alloys and platinum.

Characteristics:
  • Operates at room temperature
  • No attack on base metals
Availability: North America, Europe
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94 Gold Strike

Gold strike on difficult to plate base metals
Characteristics: Low pH gold strike with excellent adhesion on tin-nickel, stainless steel, Kovar, titanium, passive nickel and other difficult to plate base metals.
Availability: Asia Pacific
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Activator Cu

Ammonia-free activator and pickling additive for copper designed for use in the pretreatment cycles.

Characteristics:
  • Consistent etch rates
  • Stable and economical chemistry 
Availability: Europe
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Activator Ni 1

Activator

Characteristics:

Activator for EN and Nickel

Availability: Europe
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Activon 10

Activant

Characteristics:

Electrolytic activant for Nickel before chromium.

Availability: Europe
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Allumin 5200

Zincate for aluminum before nickel

Characteristics:

Al Zincate process for direct nickel plating.

Availability: Europe
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Allumin 810 cementaz. Aluminum

Zincate for aluminum before alkaline copper

Characteristics:

AL Zincate process for copper plating prep.

Availability: Europe
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Alphalux

Alkaline zinc cyanide free process

Characteristics:
  • Very bright deposit
  • High distribution thickness
  • Suitable for rack and barrel applications
Availability: Europe
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Amtofimo Cromo D 44

Antifuming chrome hexavalent

Characteristics:

Antifuming agent for hexavalent chrome solutions.

Availability: Europe
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Antifume 66 NF

Antifume

Characteristics:

Fumes dismissive agent for hexavalent decorative and technique chrome solution

Availability: Europe
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Argentomerse NC

Stable, non-cyanide, immersion silver for deposition onto copper and copper alloys.  The deposit is tarnish resistant and gives consistent solderability.

Characteristics:
  • Nitrate free immersion silver formula for dip applications
  • Flat solderable surface
  • Excellent tarnish resistance
  • RoHS and WEEE compliant
Availability: North America, Asia Pacific, Europe
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Au-Electrum

Precious Metal Recovery for Gold
Characteristics: Recovers the gold from the dragout tank of ENIG/Gold plating.
Availability: Asia Pacific
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Auroguard NP-12

Pore sealant/lubricant
Characteristics: A non aqueous coating which reduces porosity and improves the wear resistance of gold plated surfaces in electronic component and connector applications.
Availability: North America
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Aurotex 1002 N 14

Decorative gold

Characteristics:

Electrolytic gold plating process producing 2N14 color deposits.

Availability: Europe
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Aurotex 1002 N 18

Decorative gold

Characteristics:

Acid gold plating solution tolerating relatively high quantities of metal impurities and producing hard 18K deposits.

Availability: Europe
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Aurotex 1002 NG

Decorative gold

Characteristics:

Electrolytic, acid gold plating bath producing 23, 8 K deposits of "pale gold" color.

Availability: Europe
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Aurotex 1100 SR

Decorative gold

Characteristics:

Acid gold plating process operating at low gold content. Suitable either for barrel or rack applications.

Availability: Europe
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Aurotex 240

Decorative gold

Characteristics:

Decorative gold plating solution at neutral pH.

Availability: Europe
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Aurotex 290

Decorative gold

Characteristics:

Decorative gold plating solution with high tolerance to nickel impurities.

Availability: Europe
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Aurotex 88 GS M

Decorative gold

Characteristics:

Acid gold plating process suitable to plate directly on stainless steel surfaces.

Availability: Europe
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Aurotex 94G

Decorative gold

Characteristics:

Acid gold plating process suitable to plate directly on stainless steel surfaces, particularly for brush application.

Availability: Europe
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Aurotex Au/Fe

Decorative gold
Characteristics: Gold /Iron alloy
Availability: Europe
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Aurotex MC 418

Decorative gold

Characteristics:

Decorative gold plating matching the brass color.

Availability: Europe
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Betalux

Electrolytic alkaline zinc plating process for rack and barrel applications.

 

Characteristics:
  • Bright deposit at low and medium current density, with excellent throwing power
  • Good brightness and chromate compatibility 
  • Consumption amounts are lower than conventional products as this is a highly concentrated type
  • Applicable up to 35°C and easy to handle
Availability: Europe
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Betalux Barrel

Alkaline zinc without cyanide

Characteristics:

Alkaline Cyanide free zinc process for barrel application. Produce mirror deposit with good throwing power.

Availability: Europe
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Betalux Rack

Alkaline zinc without cyanide

Characteristics:

Alkaline Cyanide free zinc process for rack application. Produce mirror deposit with good throwing power.

Availability: Europe
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Black Gun CL

Black Nickel

Characteristics:

Nickel tin alloy to produce black durable color.

Availability: Europe
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Black Tin Cobalt

Tin-cobalt plating

Characteristics:

Tin/Cobalt black gunmetal color

Availability: Europe
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Brass 71 D

Decorative electrolytic brass plating process.

Characteristics:
  • Deposit alloy is 70% copper and 30% zinc
  • Produces uniform deposits on all types of metals 
  • Suitable for rack and barrel applications
Availability: Europe
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Brass 71 S

Brass high thickness plating

Characteristics:

Heavy duty, electrolytic brass plating process.

Availability: Europe
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Ceramistan 1031

Near neutral pH satin tin process for plating on acid sensitive passive electronic components.
Characteristics: Satin deposits with excellent solderability and exceptionally low co-deposited organics (no outgassing). Process designed to minimize coupling of parts plated in barrels.
Availability: North America, Asia Pacific, Europe
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Ceramistan DM

Tin and Tin/Lead alloy plating process (up to 40% Lead) for small passive components.

Characteristics:

Matte tin and tin/lead process that minimizes coupling of small parts in both barrels and SBE equipment.  Deposit has excellent solderability.  Solution has much lower lead concentrations than competitive processes.

Availability: North America, Asia Pacific, Europe
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Circudep 3500

Cleaner conditioner for metallization of rigid and flex PCBs.

Characteristics:
  • Great conditioning performance on wide variety of substrates
  • Mildly alkali cleaner with high powered conditioning agent
  • Low temperature operation eliminating high power consumption
  • Eliminate oxidation and oils from copper surfaces

 

Availability: Asia Pacific, Europe
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Circudep 4000

A highly stable and economical graphite based direct metallization system for use with horizontal flood conveyorized process equipment.

Characteristics:
  • Proprietary colloidal graphite with small particle size; ideal for blind and high aspect vias on flex and rigid PCBs
  • High process yields resulting in low cost manufacturing
  • Shorter process cycle resulting in lower machinery and chemical costs
  • Leading edge process performance
  • Elimination of formaldehyde and copper
Availability: Asia Pacific, Europe
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Circumer 1800

Conductive Polymer
Characteristics: Conductive Polymer based direct metallization process specifically formulated for use in horizontal flood conveyor systems.
Availability: Asia Pacific
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Cote D'Or

Decorative hard gold

Characteristics:

Green-yellow bright hard gold for heavy decorative deposits.

Availability: North America, Asia Pacific, Europe
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CUCN

Cyanide copper strike and full build
Characteristics: Bright cyanide copper especially design for difficult to plate substrates such as leaded brass.
Availability: North America, Asia Pacific
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CUCN-Bright Copper Cyanide Process

Cyanide Copper Plate
Characteristics: To provide a protective coat of copper over the base protect prior to subsequent plating.
Availability: North America
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Cyless Electrolytic AU Strip TC

Gold Stripper

Characteristics:

Non Cyanide based electrolytic gold stripper. Removes gold from most base metals.

Availability: Asia Pacific
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DEC

De-complex agent
Characteristics: Removes the metal from wastewater containing the complexing agent, eg. NaEDTA
Availability: Asia Pacific
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Décor Gold

Décor Gold is a bright acid hard gold that contains a metallic brightener.  The process was formulated for decorative applications.  

Characteristics:
  • Bright decorative hard gold deposit
  • Hardness ranges between 130 and 200 knoop
  • Wide current density range for both rack and barrel applications
Availability: North America, Asia Pacific
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Durasil Post Treatment

Post treatment for Durasil® Silver

Characteristics:

A non aqueous process which provides improved wear resistance and corrosion-resistant properties to Durasil® Silver deposits.

Availability: North America, Asia Pacific
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Durasil Silver

Bright Hard Silver

Characteristics:

A proprietary silver alloy plating process designed to replace gold in reel to reel electronic component and connector applications. Provides excellent conductivity, superior corrosion resistance and improved wear resistance compared to conventional silver

Availability: North America, Asia Pacific, Europe
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EAS

Gold strike
Characteristics: Gold strike for stainless steel.
Availability: North America, Asia Pacific
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Elevate AuSn 8020

Eutectic gold-tin

Characteristics:

Deposits a eutectic gold-tin alloy with a melting point between 280° C and 320° C.

Availability: North America, Asia Pacific, Europe
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Elevate Cu 6300 Cleaner

Precleaner for electrolytic copper plating
Characteristics: Liquid acid cleaner formulated for the removal of oxides, fingerprints, and light resist residues from copper seed layer surfaces prior to electrolytic copper plating.
Availability: North America, Asia Pacific
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Elevate Cu 6320

Copper Plating

Characteristics:

Electrolytic acid copper process specifically engineered to provide excellent throwing power and distribution. This process maintains superior performance over a wide range of current densities.

Availability: North America, Asia Pacific, Europe
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Elevate Cu 6340

Copper Plating

Characteristics:

Copper plating process capable of depositing copper at 40-60 ASF with virtually no internal stress in the deposit.

Availability: North America, Asia Pacific, Europe
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Elevate Cu 6370

Copper Plating

Characteristics:

High speed copper plating bath that is capable of plating at a nominal rate of 4 microns per minute. Excellent WIW and WID coplanarity can be achieved on a variety of feature types such as copper pillar and RDL.

Availability: North America, Asia Pacific, Europe
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Elevate Gold 7934

High purity, soft gold plating

Characteristics:

A cyanide based gold plating process that produces a deposit that exhibits excellent functional performance such as wire bonding and solderability from a very stable and simple to operate solution.

Availability: North America, Asia Pacific, Europe
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Elevate Gold 7990 NBV

Gold Plating

Characteristics:

Electrolytic sulfite gold process for semiconductor applications that produces pure, soft gold deposits. Operates at an optimum acidic pH of 6.6, making it compatible with almost all photoresists.  It produces a bright deposit without the use of harmful grain refiners like thallium and arsenic. Provides excellent coplanarity and step coverage.  Can be used for plating several different applications (thicknesses ranging from 0.5 - 100 microns) without major modifications to the solution and can be used on a variety of tool sets.  

Availability: North America, Asia Pacific, Europe
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Elevate Ni 5910

Nickel Plating

Characteristics:

Sulfamate process that is designed to produce a low stress, semi-bright, ductile nickel deposit for semiconductor applications. The bath can be used with soluble and insoluble anodes.

Availability: North America, Asia Pacific, Europe
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Elevate Ni 5930

Nickel Plating

Characteristics:

A high throwing power nickel process specifically engineered for semiconductor plating applications.

Availability: North America, Asia Pacific
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Elevate Ni 5950

Boric Acid free Nickel Plating

Characteristics:

Boric acid free process that produces nickel deposits with similar attributes as a standard nickel electroplating solution. The process can be used for UBM, metal stacking and other semiconductor technologies that utilize a nickel metal deposit.

Availability: North America, Asia Pacific, Europe
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Elevate Platinum 7810

Platinum Plating

Characteristics:

Platinum plating solution that can be used in a variety of semiconductor applications

Availability: North America, Asia Pacific, Europe
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Elevate Tin 5011

Tin Plating

Characteristics:

Elevate Tin 5011 is a high speed electroplating process specifically designed for bump plating of pure tin in wafer plating applications especially as a solder cap for copper pillars.

Availability: North America, Asia Pacific, Europe
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Enviolet series

Copper Bath Purification System
Characteristics: Replace the carbon treatment, plating bath with high stability by controlled the organic build-up
Availability: Asia Pacific
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Glance 189 L

Uniform nickel brightener

Characteristics:

Unique, universal brightener for rack and barrel applications.

Availability: Europe
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Glance 374/G

Leveling bright nickel

Characteristics:

Brightener for nickel usable in combination with other additives

Availability: Europe
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Glance 91 S/A

Leveling bright nickel

Characteristics:

Electrolytic bright nickel process with good throwing power and excellent leveling power. Suitable for rack applications.

Availability: Europe
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Glance CSF

Semi-bright nickel process that produces a highly leveled and ductile deposit exhibiting exceptional corrosion protection when used as the undercoat in a duplex nickel system.

Characteristics:
  • Coumarin-free formulation can cut as the undercoat in a duplex nickel system
  • Leveling equal to or better than that from Coumarin-based system
  • S.T.E.P. and ductility values meet all automotive OEM specifications
  • Easy conversion from other semi-bright nickel plating system
Availability: Europe
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Glance CU 160

Copper plating, no cyanide.

Characteristics:

Cyanide free, alkaline Copper plating solution for all metals even for zamak.

Availability: Europe
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Glance CU 9002

Electrolytic alkaline copper process containing cyanide.

Characteristics:
  • Produces bright deposits on iron, steel and zinc-die-casting
  • Lead free process with excellent  stability
  • Suitable for both rack and barrel applications
Availability: Europe
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Glance HB

Semi-bright nickel process permitting to deposit the first nickel layer in the double nickel plating application and suitable for electronic and electromechanical industries.

Characteristics:
  • Deposit is ductile and very easy to nickel plate
  • Excellent corrosion resistance 
  • Adhesion of bright nickel over the Glance HB deposit is guaranteed
Availability: Europe
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Glance Lux 1

Brightener for rack and barrel nickel bath.

Characteristics:
  • White deposit
  • Bright and leveling power
  • Excellent throwing power
Availability: Europe
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Glance LUX 2

Nickel brightener for fashion field

Characteristics:

Unique, universal brightener for rack and barrel applications.

Availability: Europe
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Glance N 23

Dark grey electrolytic nickel.

Characteristics:
  • Contains zinc metal
  • Suitable only for rack applications
  • Works at room temperature
Availability: Europe
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Glance NI SP3

Ni/P

Characteristics:

Electrolytic P nickel plating

Availability: Europe
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Gold alloys

Specialty finish gold
Characteristics: Pink, green and Ni standard alloy additives.
Availability: North America, Asia Pacific
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Goldeneye Black Nickel

Goldeneye Black Nickel produces a dark nickel/zinc (Ni/Zn) alloy finish on top of an electroplated nickel deposit.  The appearance of the Goldeneye Black Nickel deposit varies from dark grey to black depending on the operating parameters and equipment used.

Characteristics:
  • Produces a uniform dark Ni/Zn alloy finish on Goldeneye Nickel deposits.
  • Can be used in barrel, rack or medium speed reel-to-reel plating equipment.
  • Deposit appearance is dependent on the specific alloy plated and varies from dark grey at moderately high current densities to dark black  at low current densities.
Availability: North America, Asia Pacific, Europe
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Goldeneye Cobalt Tungsten

Goldeneye Cobalt Tungsten is a unique process specifically designed to deposit a 65/35 Co/W alloy in connector and electronic component applications where it can be applied as a barrier layer replacement for nickel or other nickel alloys such as nickel-tungsten.

Characteristics:
  • Highly corrosion resistant.
  • Drop-in replacement for nickel or nickel-tungsten plating solutions in existing lines.
  • Nickel-free deposit with no nickel dermatitis issues - suitable for consumer applications.
Availability: North America, Asia Pacific, Europe
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Goldeneye Level Nickel HS

Goldeneye Level Nickel HS is an advanced electroplating process specifically designed to produce fully bright lustrous nickel deposits at high current densities, suitable for decorative applications.

Characteristics:
  • Produces level, fully bright nickel deposits at high current densities. 
     
  • High hardness and good corrosion resistance.
     
  • Wide operating window.
     
  • All components are analyzable.
Availability: North America, Asia Pacific, Europe
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Goldeneye Nickel

Goldeneye Nickel is a low stress/highly corrosion-resistant nickel plating process capable of operation over a wide range of current densities from a proprietary electrolyte.  Noted for its superior thickness distribution, improved corrosion-resistance, and lower waste treatment costs, Goldeneye Nickel can be utilized in reel to reel, rack and barrel applications.

Characteristics:
  • Improved corrosion resistance compared to sulfate or sulfamate plating processes.
     
  • Superior thickness distribution with improved low current density coverage.
     
  • Reduced waste treatment costs.
Availability: North America, Asia Pacific, Europe
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Goldeneye Nickel / Goldeneye Nickel III

Electrolytic nickel plating process.

Characteristics:

Goldeneye Nickel is a low stress/highly corrosion-resistant nickel plating process capable of operation over a wide range of current densities from a proprietary electrolyte. Noted for its superior thickness distribution, improved corrosion-resistance, and lower waste treatment costs, Goldeneye Nickel can be utilized in reel to reel, rack and barrel plating applications

Availability: North America, Asia Pacific, Europe
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Goldeneye Nickel EF

Goldeneye Nickel EF is an advanced electroplating process specifically designed to produce fully bright lustrous nickel deposits over a wide range of current densities.  The ability to produce ductile heavy deposits with very low stress makes this process especially suitable for electroforming applications.  

Characteristics:
  • Produces bright nickel deposits over a wide range of current densities. 
  • Excellent ductility at high deposit thicknesses, especially suited for electroforming applications.
Availability: North America, Asia Pacific, Europe
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Goldeneye Nickel Iron

Goldeneye Nickel Iron is a unique process specifically designed to deposit an 80/20 Ni/Fe alloy in various applications, especially where a highly magnetic coating is desired.   Goldeneye Nickel Iron is suitable for rack or medium speed reel to reel plating equipment. 

Characteristics:
  • Highly magnetic coating
  • High level of solution stability and very stable alloy composition:  80/20 ± 5% Ni/Fe.
  • Complexor inhibits oxidation of Fe (2+) to Fe(3+)
Availability: North America, Asia Pacific, Europe
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Goldeneye Nickel Tungsten

Goldeneye Nickel Tungsten is designed to deposit a Ni/W alloy in applications requiring superior corrosion resistance, mechanical strength, high hardness, excellent wear, and other properties.  It is suitable for reel to reel, rack or barrel plating equipment.  Goldeneye Nickel Tungsten requires no special rectification and the process can be implemented in existing plating lines with minimal to no modifications. 

Characteristics:
  • Highly corrosion resistant
  • High hardness with excellent wear and mechanical properties
  • Non-magnetic coating, suitable for high frequency applications (5G)
  • DC plating; no special rectification required
Availability: North America, Asia Pacific, Europe
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Goldeneye Satin Nickel

Goldeneye Satin Nickel is a unique electroplating process which produces a smooth satin nickel deposit in applications requiring this finish. 

Characteristics:
  • Produces a uniform satin finish with GAM values = 0.4-0.8 over a wide current density range.
     
  • Designed for use in rack or medium speed reel-to-reel plating equipment.
Availability: North America, Asia Pacific, Europe
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High Speed Nickel Sulfamate FFP

High speed nickel sulfamate plating process

Characteristics:

High speed Nickel plating process producing low stress, ductile nickel deposits.

Availability: North America, Asia Pacific, Europe
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Integral Dye Series

Color additive for transparent cataphoretic lacquer.

Characteristics:
  • Liquid concentration
  • Easy to use
  • Non hazardous
Availability: Europe
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Italchrome DL Q

Decorative hexavalent chrome plating process.

Characteristics:
  • Excellent throwing power and high rate deposition
  • Very good cathode-efficiency (better than 50%)
  • High corrosion resistance
Availability: Europe
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Italchrome HC

Process for heavy chromium deposition.

 

Characteristics:
  • does not contain fluoride, so the corrosive effect on material is reduced to a minimum
  • High wear resistance and high deposition rate
  • Excellent distribution and excellent throwing power
Availability: Europe
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JB 100

Nickel sulfate plating
Characteristics: Bright decorative finish for both rack and barrel plating.
Availability: Asia Pacific
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JM 6000

Matte tin or tin/lead plating process. MSA based electrolyte
Characteristics: Medium grained, high speed, matte tin whisker resistant plating process based on MSA. Satisfies all requirements of JEDEC JESD 201. Can be formulated as a tin/lead process.
Availability: Asia Pacific
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Kemstrip 41

Electrolytic anodic striper for racks.

 

 

Characteristics:
  • Suitable for all types of metals
  • Non-cyanide stripper process with neutral pH

 

Availability: Europe
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Kemstrip Au 92 P

Immersion stripper to remove gold deposits from copper, brass and nickel surfaces.

Characteristics:
  • Operates with cyanide at room temperature
  • Does not etch base material
  • Good stripping rate
Availability: Europe
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Kemstrip Cu 15

Stripper to remove copper deposit from steel and nickel.

Characteristics:
  • Convenient, ready-to-use solution
  • Works at room temperature
  • Good stripping rate despite high copper concentration
Availability: Europe
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Kemstrip NI 87

Acid stripper to remove nickel from brass and copper.

Characteristics:
  • Non-cyanide stripper process
  • Removes nickel deposits without etching the metal underneath
Availability:
添加 移除

Kemstrip NI A-B

Immersion stripper used to remove nickel from iron, copper and brass.

Characteristics:
  • Cyanide free liquid stripping process
  • Removes nickel without etching the base material
  • Solid stripping rate
Availability: Europe
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Kemstrip Ni Z

Stripper to remove nickel from zinc die cast as base material.

Characteristics:
  • Cyanide free liquid product
  • Will not etch zinc die cast (even if not well-covered by copper)
  • Good stripping rate

 

Availability: Europe
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Kemstrip SN 60

Acidic stripper removes tin and tin/lead deposits from brass and copper.

Characteristics:
  • Convenient, ready-to-use solution
  • Operates at low temperature
  • Good stripping rate
  • Removes tin-lead deposits from PCB without etching copper
Availability: Europe
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LevelTech

Immersion Tin
Characteristics: Immersion tin providing a co-deposited structure eliminates whiskers and increases resistance to dendritic growth. Excellent surface cleanliness. Low cost, fully conveyorizable process.
Availability: North America, Asia Pacific, Europe
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Mark 20 L

Blackening process by chemical dip

Characteristics:
  • Velvet appearance
  • Suitable for copper
  • Easy to brush
Availability: Europe
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Mark 25 S

Green copper color at room temperature.

Characteristics:
  • Antique natural copper
  • Suitable for copper and copper alloys
  • Suitable for furniture accessories
Availability: Europe
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Mark 350 P

Immersion coloration

Characteristics:

Powdered product for antique bronze color

Availability: Europe
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Mark 511

Chemical dip process for bronze color.

Characteristics:
  • Easy to use for copper, copper alloy and nickel
  • Stable color
  • Easy to brush
Availability: Europe
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MARK 5333

Blackening process for iron, steel and cast iron.

Characteristics:
  • Operates at room temperature
  • Produces black finish equal to obtain with the conventional black oxides processes
  • Good corrosion resistance
Availability: Europe
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Mark 71

Immersion coloration

Characteristics:

Blackening process for silver.

Availability: Europe
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Mark 833

Immersion coloration

Characteristics:

Chemical dip process for blackening brass.

Availability: Europe
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Mark A 380

Blackening solution for aluminum.

Characteristics:
  • Operates at room temperature.
Availability: Europe
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Mark SS 73

Blackening process for stainless steel.

Characteristics:
  • Operates at room temperature
Availability: Europe
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Metasu Lubrus CE 1

Water based chrome free clear top coat agent.

Characteristics:
  • Suitable for usw with both immersion (dip/spin) and spray applications
  • High corrosion resistance and consistent total friction coefficient
  • Reduces fitting failures caused by excessive coating
  • Produces uniform and bright finishes without iridescence
Availability: Europe
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Metasu Lubrus Ke 1

Water-based chrome free black top coat agent.

Characteristics:
  • Suitable for use with both immersion (dip/spin) and spray applications
  • High corrosion resistance and consistent total friction coefficient
  • Reduces fitting failures caused by excessive coating
  • Produces uniform and bright finishes without iridescence
Availability: Europe
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MX-5

Barrel plating
Characteristics: High leveling one component system.
Availability: North America
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MX8-M

Nickel Plate
Characteristics: Designed for application where a very white level deposit is required for the final nickel plate.
Availability: North America, Asia Pacific
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NIST AS 233

Satin nickel
Characteristics: Satin nickel plating process
Availability: Europe
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Oromerse MN

Am immersion gold deposit to produce a pure gold finish over a nickel substrate.  Deposits are fine grain, with extremely low porosity.

Characteristics:
  • Fine grain low porosity deposit
  • High tolerance for metallic contamination of copper, nickel and lead
  • Sufficient thickness to maintain solderability
Availability: North America, Europe
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Oromerse SO

Oromerse SO is a cyanide free pure gold immersion deposit.  Process plates up to 20 micro inches over nickel and electroless nickel. 

Characteristics:
  • Non-cyanide immersion gold deposit
  • Plates up to 20 micro inches over nickel and electroless nickel
Availability: North America, Europe
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Orosene 80 RC

Hard Gold For Deep Tank Application

Characteristics:

Industry standard in hard gold products. Excellent distribution with consistent high yields. Compatible with aqueous resists. High efficiency reduces plating time.

Availability: North America, Asia Pacific
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Orosene 990

Hard gold for rack and barrel application

Characteristics:

Industry standard for hard gold products. Excellent distribution with consistent high yields. Compatible with aqueous resists. High efficiency reduces plating time.

Availability: North America
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Orosene 990 HS

Hard gold for high speed applications

Characteristics:

Very high efficiency, high speed bright plating solution. The solution can be operated at low gold concentrations and at temperatures to 150 F, providing high plating rates with excellent deposit distribution.

Availability: North America, Asia Pacific
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Orosene 999

Decorative hard gold

Characteristics:

Hard Gold 24K--Type I, II Grade C designed for both rack and barrel operations.

Availability: North America, Asia Pacific, Europe
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Orostrike C

Gold strike for base metals.

Characteristics:

Acid gold strike with excellent adhesion on most base metals, particularly electroplated nickel.  High contamination resistance. 

Availability: North America, Asia Pacific, Europe
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Orotemp 24

Pure gold

Characteristics:

Neutral gold plating solution, 24 K deposit.

Availability: North America, Asia Pacific, Europe
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Orotherm HT

Hard gold

Characteristics:

Technical gold plating process, gold/nickel alloy.

Availability: Europe
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PAC

Coagulant agent
Characteristics: Shorten settling time and improve flocculation performance.
Availability: Asia Pacific
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Pallaspeed

Pure palladium plate

Characteristics:

Rhodium-look finish - lower costs. Can be deposited directly on copper, nickel alloys without a strike.

Availability: Asia Pacific
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Pallaspeed 990

Palladium plating process

Characteristics:

Chloride-free, low ammonia palladium plating process designed to produce highly ductile palladium deposits.

Availability: North America, Asia Pacific
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Pallaspeed D

Palladium plating

Characteristics:

Cobalt alloy based, electrolytic palladium process for decorative applications.

Availability: Europe
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Pallaspeed DW

Bright palladium plate

Characteristics:

Rhodium-look finish - lower costs can deposit directly on copper, nickel alloys without a strike.

Availability: North America
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Pallaspeed S

Pure Palladium For Deep Tank Applications

Characteristics:

Pure palladium process engineered for compatibility with aqueous dry film. Wide current density and metal concentration range. Typically utilized where better chemical resistance is required like in deep well applications.

Availability: North America
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Pallaspeed VHS

High speed pure Palladium plating process based on Palladium ammonium chloride.

Characteristics:

Bright deposit. Deposits exhibit good ductility and moderate stress.

Availability: North America, Asia Pacific, Europe
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Pallaspeed VHS D

Palladium plating process suitable for all decorative purposes.

Characteristics:
  • Produces pure and brilliant deposit
  • Neutral operating pH
Availability: Europe
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PAM

Flocculent agent
Characteristics: Produce stable flocs and dry filter cake.
Availability: Asia Pacific
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Pd-AR

Precious Metal Recovery for Pd
Characteristics: Recovers Pd from the dragout tank of Pd plating and spent chemical from Activator of PTH.
Availability: Asia Pacific
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Platinum AP

Electrolytic hard platinum

Characteristics:

PLATINUM AP is an electroplating process which deposits a hard platinum coating from a neutral pH bath and is highly recommended for industrial applications. The deposit exhibits excellent adhesion to most metal substrates.

Availability: Europe
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Post Dye Series

Coloring for cathodic electrophoretic coatings.

Characteristics:

Coloring for cathodic electrophoretic coatings.

Availability: Europe
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Protex 65

Copper and alloy passivation

Characteristics:

Chrome free, organic passivation suitable for all the copper alloys

Availability: Europe
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Protex 73

Antirust for steel

Characteristics:

Dryer and antioxidant for steel and cast iron.

Availability: Europe
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Protex 87

Protective oil

Characteristics:

Protective emulsifiable oil, excellent after blackening conversion or on parts must be lubricated.

Availability: Europe
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Protocote 112

Thermal cure etching and plating resist
Characteristics: Alkaline strippable resist for acid etching and plating solutions.
Availability: North America
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Protocote SPN

Thermal cure marking ink
Characteristics: VOC free single component with excellent adhesion on a wide variety of laminates and solder masks.
Availability: North America
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Remova 1700

Additive for Al alloy

Characteristics:

Difficult pickling and silicates removal.

Availability: Europe
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Remova 2011

Pickling agent for Fe

Characteristics:

Acid pickling additive for welds.

Availability: Europe
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Remova 2044

Pickling agent for gold

Characteristics:

Oxide remover and pickling additive, suitable for ultrasonics.

Availability: Europe
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Remova 205

Brass pickling

Characteristics:

Pickling and brightening agent.

Availability: Europe
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Remova 2055

Additive for dipping

Characteristics:

Supporting additive for pickling solutions and degreasers.

Availability: Europe
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Remova 3021

Pickling agent

Characteristics:

Pickling, antioxidant and activator for silver

Availability: Europe
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Remova 303

Pickling agent for stainless steel

Characteristics:

Pickling agent for stainless steel

Availability: Europe
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Remova 5122

Additive for cleaners

Characteristics:

Alkaline, chemical and electrolytic surfactant agent.

Availability: Europe
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Remova 8068

Pickling for zamak

Characteristics:

Pickling and degreasing action.

Availability: Europe
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Remova 8070

Additive antifume

Characteristics:

Antifume additive for alkaline zinc electrolytes and acid pickling solutions.

Availability: Europe
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Remova 95

Neutralizing agent

Characteristics:

Neutralizer. Sulphuric acid alternative.

Availability: Europe
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Remova 97

Neutralization agent

Characteristics:

Neutralizer for silver plated parts with cyanide based electrolytes.

Availability: Europe
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Remova RA

Varnish stripper

Characteristics:

Stripper for varnish non-etching. For silver, black nickel and aluminum substrates.

Availability: Europe
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Remova RH

Varnish stripper

Characteristics:

High speed stripper for removing epoxy paints.

Availability: Europe
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Remova RY

Varnish stripper

Characteristics:

Stripper for removing synthetic coatings.

Availability: Europe
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Removel 155 IT

Liquid cleaner, strongly alkaline specific for electrolytic degreasing of ferrous material. Can be used in cathodic and anodic phase in both rack and barrel systems.

Characteristics:
  • Very low foaming surfactants that increase the wetting effect and produce a very controlled and reduced foam on the surface
  • Contains complexing agent that increases the efficacy of the bath, extends bath life, and allows use even with hard water
  • Reduced gas fumes
Availability: Europe
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Removel 175 F

Brass, copper, zamak, bronze

Characteristics:

Electrolytic alkaline cleaner usable in anodic and cathodic phase

Availability: Europe
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Removel 555

Brass electrolytic cleaner

Characteristics:

Cathodic and anodic degreaser

Availability: Europe
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Removel 558

All metal cleaner

Characteristics:

Cathodic and anodic degreaser

Availability: Europe
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Removel 600

Activation

Characteristics:

Nickel plated surface activator

Availability: Europe
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Removel 611

Cleaner for steel

Characteristics:

Cathodic and anodic degreaser

Availability: Europe
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Removel SW 15

Alkaline liquid concentrated cleaner suitable for cleaning of iron, steel, cast iron, copper and copper alloys.

Characteristics:
  • Reduced amount of product in stick, decreased processing costs
  • Decrease the amount of waste
  • Does not emit corrosive fumes or dangerous, unpleasant odors. 
Availability: Europe
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Removel T 11 L

Versatile liquid cleaner

Characteristics:

Processing oil removal. Phosphate€“ free liquid.

Availability: Europe
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Removel T 11L

Base concentrated alkaline phosphate-free cleaner suitable for cleaning of iron, steel, cast iron, copper and copper alloys.

Characteristics:
  • Does not make foam and has the capability to remove dirt rapidly to avoid deposition on the walls of barrels and tanks
  • Does not separate oily from sticky residues
  • Avoids the formation of complex salts with metals
Availability: Europe
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Removel Techno 65

Cleaner for steel

Characteristics:

Cathodic degreaser with flocculating action

Availability: Europe
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Removel Techno 66

Cleaner for steel

Characteristics:

Non-foaming cathodic and anodic degreaser

Availability: Europe
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Remover 111

Cleaner for brass and steel

Characteristics:

Buffing compound removal

Availability: Europe
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Remover 122

Cleaner for brass

Characteristics:

Buffing compound, buffing oil and grease removal

Availability: Europe
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Remover 133 IT

Cleaner for steel

Characteristics:

Buffing compound and buffing oil removal

Availability: Europe
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Remover 16 LQ

Liquid cleaner

Characteristics:

Buffing compound and processing oil removal

Availability: Europe
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Remover FDN 26

Liquid cleaner

Characteristics:

Liquid cleaner with low foam for spray, ultrasonic and system with air agitation

Availability: Europe
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Remover PB

Powder cleaner

Characteristics:

Buffing compound and buffing grease removal

Availability: Europe
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Remover Techno 13

Powder cleaner

Characteristics:

Buffing oil and buffing compound removal with flocculating action.

Availability: Europe
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Remover Techno 14

Cleaner for steel

Characteristics:

Oil removal, also non-saponifiable type.

Availability: Europe
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Remover Techno 33

Cleaner's additive

Characteristics:

Buffing compound and oil removal

Availability: Europe
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Remover Techno AL 32

Acid liquid soak cleaner for aluminum alloys, that permits to avoid the use of alkaline detergents that generally corrode and blacken the surface previously buffed.

Characteristics:
  • Can be used in ultrasonic equipment
  • Reduce production cost
  • Easy to handle
Availability: Europe
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Remover Techno Solvit

Soak cleaner

Characteristics:

Low alkalinity liquid degreaser with deoxidizer.

Availability: Europe
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RH 221 D

Rhodium plate
Characteristics: Bright white sulfate process with excellent corrosion resistance.
Availability: North America, Asia Pacific
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RH 221 E

Rhodium plate
Characteristics: Bright white sulfate process.
Availability: North America, Asia Pacific
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Rhodium IT 2

Rhodium plating process for decorative purposes.

Characteristics:
  • Produces a bright white deposit with low or high thickness
  • High throwing and leveling power
  • Simple to use 
  • Very stable process
Availability: Europe
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Ruthenium AK

Alkaline ruthenium plating

Characteristics:

Ruthenium dark process, good also for barrel application

Availability: Europe
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Ruthenium-U

Ruthenium plating process.

Characteristics:
  • Produces resistance and bright deposit.
  • Supplied in two versions:  dark grey and white
Availability: Europe
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Shedar 30

Alkaline zinc/nickel electroplating process.  Suitable for barrel and rack applications.

Characteristics:
  • Produces brightness deposit 12-18% alloy
  • Excellent leveling and penetration
  • Excellent conversion coating properties (silver and black) after plating, that produce excellent corrosion resistance.
Availability: Europe
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Silver Cyless II

Rack and barrel plate

Characteristics:

Non-cyanide, semi-bright to bright silver plating process.

Availability: North America
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Silver Cyless II W

Rack and barrel plate

Characteristics:

Mirror bright silver with excellent wear resistance.

Availability: North America, Asia Pacific
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Silver IT 2

Sliver semibright

Characteristics:

Electrolytic silver plating process for industrial applications, potassium cyanide based, semi-bright deposit.

Availability: Europe
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Silversene

Bright silver

Characteristics:

Electrolytic silver plating process, sodium cyanide based producing a bright deposit for decorative and heavy duty purposes.

Availability: Europe
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Silversene DW

Potassium cyanide based electrolytic silver plating process that produces mirror-bright ductile silver deposits.

Characteristics:
  • Ideal for all decorative applications
  • Consistent high purity deposits
  • Excellent throwing power
Availability: North America, Asia Pacific, Europe
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Silversene M

White, bright silver

Characteristics:

Electrolytic silver plating process, potassium cyanide based, mirror-bright deposit.

Availability: Europe
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Silversene ST

Silver high thickness

Characteristics:

Electrolytic silver plating process, sodium cyanide based, bright deposit for decorative and heavy duty purposes.

Availability: Europe
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Silvertek L

Pure silver plating process with organic brightener for decorative applications.

Characteristics:
  • Mirror bright deposit
  • Finish is tarnish-resistant as plated
Availability: Europe
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Sirio 1000

Acid zinc electroplating process based on potassium chloride.  Ideal for barrel and rack applications.  Useable at high temperatures (up to 45°C).

Characteristics:
  • Process free of toxic and flammable substances
  • Produces uniform deposits with excellent brightness
  • Excellent throwing power and good ductility
  • Process suitable on cast iron and hard steel
Availability: Europe
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Sirio 600

Versatile potassium chloride zinc plating process boron free.  Ideal for barrel applications.

Characteristics:
  • Better adhesion property in conversion treatment than conventional brightener
  • Good compatibility with trivalent conversion coating
  • Particularly excellent with trivalent back
Availability: Europe
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Solder Strip JA

Single-step solder stripper
Characteristics: Immersion solder strip for removal of solder from Copper substrate (peroxide/fluoride base).
Availability: Asia Pacific
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Stannomerse

Bright tin, solderable immersion tin deposit for both decorative and industrial applications. 

Characteristics:
  • Low cost acid immersion tin
  • Superior brightness
  • Easily solderable coating
  • Ideal for industrial and decorative hardware
Availability: North America, Europe
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Starlux 30

Very bright nickel brightener

Characteristics:

Unique, universal brightener for rack and barrel applications.

Availability: Europe
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Starlux 50

Strong and very bright nickel brightener

Characteristics:

Unique, universal brightener for rack and barrel applications.

Availability: Europe
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Surfalat

Brass plating

Characteristics:

Decorative electrolytic brass plating process.

Availability: Europe
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Tarniban

Silver and copper

Characteristics:

Thin colorless film with good resistance to corrosion with improved solderability and no effect on electrical performance.

Availability: North America, Asia Pacific, Europe
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Tarniban 118 (TC)

Post treatment for tin

Characteristics:

Anti-discoloration during storage, thermal, heating & reflow conditions. Furthermore, matte tin deposit will not be melt after reflow.

Availability: Asia Pacific
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Tarniban 2000

Copper and alloy passivation

Characteristics:

Chrome free, metallic Passivation suitable for all the copper alloys.

Availability: Europe
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Tarniban 2000

Copper and copper alloy anti-tarnish

Characteristics:

Chrome free, metallic passivation suitable for all copper alloys

Availability: Europe
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Tarniban 51

Chrome free antioxidant and anti-tarnish for silver, copper and its alloy surfaces.

Characteristics:
  • No detrimental effect to electrical properties or solderability
  • Resist 96 hours to test UNI EN 4611
  • Meets MIL specifications QQS-365A
Availability: Europe
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Tarniban 51

Silver anti-tarnish

Characteristics:

Metallic, chrome free passivation, good prior to painting

Availability: Europe
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Tarniban 59 (TC)

Post treatment for tin and nickel

Characteristics:

Recommended for protection of metal surfaces subjected to post plate salt spray corrosion testing (See ASTM B117). This product has been demonstrated to be effective on nickel, tin and thin gold deposits used in connector applications.

Availability: Asia Pacific
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Tarniban 60

Post treatment for silver

Characteristics:

An inorganic coating designed to improve the tarnish resistance and solderability of silver deposits, particularly after dry heat thermal exposure. Recommended for rack, barrel, and high speed reel-to-reel applications.

Availability: North America, Asia Pacific
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Tarniban C48

Post treatment process for tin and tin alloys

Characteristics:

Specifically designed for use on tin and tin alloy deposits which are subjected to post-plate thermal exposure in high humidity/steam environments. For optimal results, Tarniban® C48 should be used in combination with Technic PST.

Availability: North America, Asia Pacific, Europe
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Tarniban C48 / C50

Anti-corrosion / anti-discoloration post-treatment process for tin deposits
Characteristics: Tarniban C48/C50 minimizes deposit discoloration during storage and provides improvements in solderability performance after steam age pre-conditioning. Tarniban C48/C50 also minimizes corrosion-induced tin whisker growth caused by high temperature/humidity exposure.
Availability: North America
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Tarniban C50

Post treatment for tin, tin alloys

Characteristics:

Provides protection of tin and tin alloy deposits from discoloration following exposure to high humidity/steam environments plus dry thermal exposure (reflow/oven bake).

Availability: North America, Asia Pacific, Europe
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Tarniban D

Silver anti-tarnish

Characteristics:

Perchloroethylene and chrome free passivation agent and antioxidant

Availability: Europe
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Tarniban E

Post treatment for silver

Characteristics:

Recommended for minimization of epoxy bleed-out without adversely affecting downstream assembly operations such as wire bonding and die attach.

Availability: North America
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Tarniban E260

Post treatment process for tin and tin alloys

Characteristics:

Protects tin deposits from oxidation and discoloration following post-plate high temperature dry thermal exposure. Optimum results when used in combination with Techni Nickel TS. Recommended for rack, barrel and high speed application.

Availability: North America, Asia Pacific, Europe
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Tarniban KS II

Chrome free antioxidant and anti-tarnishing post treatment for silver surfaces.

Characteristics:
  • Excellent resistance to sulphide tarnishing
  • Contact resistance values are extremely low 20-90 michroms/in2 at 200 PSI contact pressure
  • No change in physical appearance after 300 hours of exposure to 95% R.H. and 32ºC
  • Meets MIL specifications QQS-365A
Availability: Europe
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Tarniban LED

Post treatment for LED Silver.

Characteristics:

For use with Techni Silver LED and LED HS to retain brightness and reflectivity after long term storage and/or high temperature exposure.

Availability: Asia Pacific
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Tarniban TS

Anti-corrosion / anti-discoloration post-treatment process for silver

Characteristics:

Techniseal is a cathodic electrolytic passivation system that provides a transparent nano-scale, protective coating on silver which to improves corrosion resistance and minimizes appearance degradation. Techniseal protects silver from tarnishing during exposure to heat and/or sulfur corrosion testing.

Availability: North America
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TEC 1001

Electrolytic cleaner 

Characteristics:

Highly conductive electro-cleaner for removal of light oxide, oils and light buffing. Excellent risibility and wide temperature range.

Availability: North America, Asia Pacific
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TEC-1010

Electro or Soak Cleaner for brass, steel, and copper
Characteristics: Highly conductive electro-cleaner for removal of light oxide, oils and light buffing compound with excellent low recess cleaning.
Availability: North America
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TECHNI 8085

Blackening for Electroless Nickel

Characteristics:

Blackening solution for Electroless Nickel deposits

Availability: North America, Asia Pacific, Europe
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Techni Acid Gold Strike

Gold bath for stainless steel

Characteristics:

Acid gold strike process guaranteeing a perfect adhesion. Wood Nickel treatment can be avoided.

Availability: Europe
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Techni Acid Salt TAS-1

Powder acid activator for steel, brass, copper and passive nickel.

Characteristics:

Non-flouride blend of dry acid salts for pickling metals prior to electroplating.  Replaces mineral acids such as sulfuric and hydrochloric acid. Used to activate all base metals.

Availability: North America, Asia Pacific
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Techni Acid Salt TAS-3Z

Powder acid activator for zinc die cast, leaded brass, beryllium copper, aluminum, nickel, silver, tin, lead.

Characteristics:

Blend of dry acid salts with flouride used for pickling metals prior to electroplating.  For nickel alloys, copper, and brass activation. Similar to TAS-1, but more aggressive for hard-to-activate surfaces.

Availability: North America
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Techni ACT 100

Silver Stripper
Characteristics: A non-hazardous, non-toxic product developed for environmentally safe back stripping and electropolishing of copper base materials, as a high speed electrolytic silver strip for semiconductor silver bleed from all copper and copper alloy substrates.
Availability: Asia Pacific
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Techni Act 505

Descale

Characteristics:

Single component copper descale

Availability: Asia Pacific
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Techni Act 909

Descale

Characteristics:

Single component copper descale. Suitable for C 7025

Availability: Asia Pacific
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Techni ACT 9600

Mild descaler
Characteristics: Acidic, non-foaming, mildly aggressive chemistry. Effectively removes oxides and heat scale.
Availability: North America, Asia Pacific, Europe
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Techni Alkaline BN Cleaner

Techni Alkaline BN Cleaner is an all-purpose, phosphate-free, alkaline cleaner for both ferrous and non-ferrous base materials.  This product can be used for direct, reverse and soak cleaning.

Characteristics:
  • All-purpose for both ferrous and non-ferrous metals
  • Phosphate-free
  • Highly effective as soak or electrolytic cleaner
Availability: North America
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Techni Alkaline Zincate

Alkaline Zincate
Characteristics: Process designed to properly prepare aluminum and its alloys for electroless or electrolytic plating.
Availability: North America, Asia Pacific
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Techni Aqua Shed-1

Rinse aid
Characteristics: Aqueous mixture that creates a hydrophobic surface to increase rinseability and reduce water staining.
Availability: North America, Asia Pacific, Europe
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Techni Brown Gold

Decorative gold

Characteristics:

Acid gold plating process producing dark brown color deposits.

Availability: Europe
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Techni BT 1000

Tin for rack and barrel
Characteristics: Sulfate based electrolytic tin plating process, bright deposit.
Availability: Europe
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Techni BT2

Low speed bright Tin

Characteristics:

Sulfate based electrolytic tin plating process, bright deposit. Suitable for rack and barrel applications

Availability: Europe
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Techni Buff Solv

Soak or ultrasonic for copper and brass

Characteristics:

Concentrated alkaline liquid cleaner for removing buffing compounds, tarnish and oxides from copper and brass.

Availability: North America
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Techni Buffer IG

Product replaces boric acid in nickel bath (sulfate base, sulphammate and Goldeneye)

Characteristics:

Easy-to-handle liquid form. Aids in reducing brighteners additive in replenishment. According to Reach Regulation is not listed in SVHC boric acid.

Availability: Europe
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Techni Chemical Deflash 38

Immersion Deflash
Characteristics: Chemical process recommended to remove bleed and light flash from plastic semiconductor packages at lower operating temperatures.
Availability: Asia Pacific
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Techni Chemical Deflash LT

Immersion Deflash
Characteristics: Chemical process recommended to remove bleed and light flash from plastic semiconductor packages at lower operating temperatures.
Availability: Asia Pacific
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Techni Chemical Deflash LT 88

Immersion Deflash
Characteristics: Chemical process recommended to remove bleed and light flash from plastic semiconductor packages at lower operating temperatures.
Availability: Asia Pacific
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Techni Copper ACP

Alkaline Cyanide Copper Strike
Characteristics: Exhibits improved copper and molding compound adhesion.
Availability: North America, Asia Pacific
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Techni Copper C

Semi-bright cyanide copper strike

Characteristics:

Semi bright strike process. Recommended for difficult to plate metals.

Availability: North America, Asia Pacific
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Techni Copper LUX

Acidic electrolytic copper plating process.

Characteristics:
  • Produces micro-bright, micro-pitting free and ductile deposit
  • High thickness and excellent corrosion resistance
  • Can be used with cathode agitation or air insufflation as well
Availability: North America, Europe
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Techni Copper P

Alkaline Copper
Characteristics: A semi to bright pyrophosphate copper solution used as an alternative to copper cyanide.
Availability: North America
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Techni Cu 2300

Acid copper electroplating process designed for printed circuit board and reel-to-reel applications.

Characteristics:
  • Specifically engineered to produce bright and even deposits from a stable electrolyte
  • High purity and fine grained equiaxed deposits
  • Economical to use
Availability: Europe
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Techni CU 2800

Electrolytic Acid Copper
Characteristics: Copper acid process for low current density.
Availability: Europe
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Techni CU 85

Remove the substrate defect

Characteristics:

Aggressive etchant for copper that has a long life and high copper capacity. Used to deoxidize/activate copper based parts prior to electroplating.

Availability: Asia Pacific
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Techni Cu No Dyes

Dye free acid copper plating bath, producing a bright deposit.

Characteristics:
  • Stable process
  • Very bright
  • Excellent throwing power
Availability: Europe
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Techni CU Satin

Electroplating process that produces a smooth satin deposit.

Characteristics:
  • Provides a fine grained, equiaxed high purity and ductile deposit
  • Specifically engineered for plating uniform satin, even deposits from a stable electrolyte
  • Economical solution with only one additive to manage
Availability: Europe
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Techni Electro Deflash #4

Electrolytic Deflash
Characteristics: Low operating temperature. Highly alkaline (pH >12). Low cost.
Availability: North America, Asia Pacific, Europe
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Techni Electro Deflash #4 Conc

Electrolytic Deflash

Characteristics:

Low operating temperature. Highly alkaline (pH >12). Low cost.

Availability: Asia Pacific
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Techni Electro Deflash PL (3X)

Electrolytic Deflash
Characteristics: Mildly alkaline solution designed to remove bleed and mold flash from plastic semiconductor packages electrolytically.
Availability: Asia Pacific
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Techni Electro-Deflash PL

Electrolytic Deflash

Characteristics:

Mildly alkaline solution designed to remove bleed and mold flash from plastic semiconductor packages electrolytically.

Availability: Asia Pacific, Europe
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Techni EN 1500

Low phos (1-4% P) electroless nickel plating process
Characteristics: Semi bright EN deposit, deposition rate 300-400 u/hr (7-10 u/hr).
Availability: North America, Asia Pacific
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Techni EN 2600

Mid Phos (6-9%) EN Process
Characteristics: Full bright, high speed EN process designed for high bath loading for steel, Al, and metal alloy substrates
Availability: North America, Asia Pacific
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Techni EN 2600 SB

Mid phos (7-8% P) electroless nickel plating process
Characteristics: Semi bright EN deposit, deposition rate 500-1000 u-in/hr (12-25 um/hr).
Availability: North America
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Techni EN 3500

High phos (10-12% P) electroless nickel plating process
Characteristics: Semi bright EN deposit, deposition rate 400-600 u-in/hr (10-15 um/hr). Highest level of corrosion resistance.
Availability: North America, Asia Pacific
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Techni EN 3500 TF

High phosphorous electroless nickel process designed to deposit a uniform, nickel phosphorous composite alloy with ultra-fine PTFE particles.

Characteristics:
  • Low coefficient of friction deposits
  • Excellent release resistance and corrosion resistance
  • Meets MIL-C-26074E, AMS 2404 C and AMS specifications.
  • ELV, RoHS and WEEE compliant.
Availability: Europe
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Techni EN 4100

Alkaline electroless nickel.  Ideal for aluminum surfaces.

Characteristics:
  • Excellent brightness
  • Exceptional stability
  • High tolerance to impurities
Availability: Europe
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Techni EN 5300

Low phosphorous, bright electroless nickel deposit.

Characteristics:
  • Produce compressive stress hard deposit
  • Excellent corrosion resistance in alkaline environments
  • Excellent hard deposit with good wear resistance
Availability: Europe
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Techni EN 6000

Medium 'phos'

Characteristics:

Bright medium phos, self regulated

Availability: Europe
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Techni EN 6500

Medium phosphorous electroless nickel, provides bright deposits.

Characteristics:
  • Lead and cadmium free
  • Consistent rate plates
  • Meets MIL-26074B, AMS 24043 and AMS 2405 specifications
  • ELV, RoHS and WEEE compliant
Availability: Europe
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Techni EN 8200

RoHS Compliant Mid "phos" Electroless Nickel
Characteristics: Designed for high bath loading in plating RoHS compliant mid phos nickel deposit on steel, aluminum and metal alloys.
Availability: North America, Asia Pacific
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Techni EN 8380

Mid phos (7-8% P) electroless nickel plating process
Characteristics: Semi bright EN deposit, deposition rate 500-1000 u-in/hr (12-25 um/hr).
Availability: Asia Pacific
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Techni EN 9155

High phosphorous content electroless nickel, provides semi-bright and non magnetic deposit.

Characteristics:
  • Self-regulating pH bath
  • Excellent corrosion resistance (with a thickness of at least 25 µm it resists 1000 hours to salt spray test ISO 9227)
  • Meets the 26074-D and AMS 2404-B Military specifications
Availability: Europe
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Techni EN 9500

Electroless nickel for plastic

Characteristics:

Two component, low working temperature electroless nickel.

Availability: Europe
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Techni EN AT 5300

Low P

Characteristics:

Electroless nickel low P content

Availability: Europe
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Techni EN AT 5600

Techni EN AT 5600 is an advances mid-phosphorus electroless nickel used in industrial plating. The process is uniquely formulated to minimize the buildup of by-products giving it a dramatically longer bath life.  Can be used with ENIG and ENEPIG processes.

Characteristics:
  • Better lateral growth yielding better corrosion resistance
  • Excellent solution stability
  • Phosphorus between 6-9% w/w
Availability: North America, Europe
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Techni EN Strip 1700

Electroless nickel stripper

Characteristics:

Non cyanide alkaline stripper designed to remove electroless or electrolytic nickel from copper.

Availability: North America, Asia Pacific
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Techni EN Zincate

Cyanide free zincate process for the pretreatment of aluminum and aluminum alloys.  Removes aluminum oxide and applies a thin immersion film of zinc on the surface that can be electroplated.

Characteristics:
  • Promotes excellent adhesion of electroplated  and electroless process
  • Cyanide free process.  Reduce the costs of waste treatment
  • Uniform zinc coating on complex parts
Availability: Europe
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Techni Gold 1020C (EG)

Cobalt hardened gold process

Characteristics:

Cobalt-hardened gold plating process with high cathode efficiency and good thickness distribution. Lower operation cost.

Availability: Asia Pacific
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Techni Gold 1020C (HH)

Cobalt hardened gold process

Characteristics:

Cobalt-hardened gold plating process with high cathode efficiency and good thickness distribution. Anti-gold immersion.

Availability: Asia Pacific
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Techni Gold 1020C (HS)

Cobalt hardened gold process

Characteristics:

Cobalt-hardened gold plating process with high cathode efficiency and good thickness distribution.

Availability: North America, Asia Pacific
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Techni Gold 1020N (HS)

Nickel hardened gold process

Characteristics:

Nickel-hardened gold plating process with high cathode efficiency and good thickness distribution.

Availability: North America, Asia Pacific
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Techni Gold 300

Nickel hardened gold plating process

Characteristics:

High performance nickel hardened gold plating process for low speed, high speed, and selective applications.  Very tolerant to metallic contamination.

Availability: North America, Europe
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Techni Gold 300R

Nickel hardened gold plating process

Characteristics:

General purpose, nickel hardened gold plating process for connector applications.

Availability: Asia Pacific
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Techni Gold 400

Cobalt hardened gold plating process

Characteristics:

High performance cobalt hardened gold plating process for low speed, high speed, and selective applications.  Very tolerant to metallic contamination.

Availability: North America, Europe
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Techni Gold 400R

Cobalt hardened gold plating process

Characteristics:

General purpose, cobalt hardened gold plating process for connector applications.

Availability: Asia Pacific
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Techni Gold 434

Gold plating process

Characteristics:

Acid pure gold plating process designed to produce a gold electrodeposit of 99.9+% purity in rack and barrel electroplating applications for devices used in the semi-conductor, electronic, and PWB industries where high purity gold deposits are required.

Availability: Asia Pacific
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Techni Gold 434 HS

Pure gold plating process

Characteristics:

434 Acid Pure Gold process is designed to produce a gold electrodeposit of 99.9+% purity for devices used in the semi-conductor, electronic, and PWB industries where high purity gold deposits are required to meet wire bonding requirements.

Availability: North America, Asia Pacific
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Techni Gold 800

Nickel hardened gold plating process.

Characteristics:

Gold plating process using pulse plating technology to produce low-porosity deposits in electronic component and connector applications.

Availability: North America, Asia Pacific, Europe
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Techni Gold 900

Cobalt hardened gold plating process

Characteristics:

Gold plating process using pulse plating technology to produce low-porosity deposits in electronic component and connector applications.

Availability: North America
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Techni Gold Barrel 850

Nickel hardened barrel gold plating process

Characteristics:

Gold plating process designed to minimize porosity in electronic component and connector barrel plating applications.

Availability: Asia Pacific
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Techni Gold Flash 850

Nickel hardened flash gold plating process

Characteristics:

Gold plating process recommended for a highly uniform 2 - 5 microinch flash gold over nickel, palladium and palladium nickel alloys.

Availability: North America, Asia Pacific
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Techni Gold Flash 950

Cobalt hardened flash gold plating process

Characteristics:

Gold plating process recommended for a highly uniform 2 - 5 microinch flash gold over nickel, palladium and palladium nickel alloys.

Availability: North America, Asia Pacific
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Techni Gold Strike SS

Gold alloy bath
Characteristics: Gold for stainless steel. It is available both with cobalt or nickel
Availability: Europe
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Techni HCL Electrolytic Solder Strip

Tin Stripper For Tab Platers
Characteristics: Electrolytic stripper used on auto plating machines for removal of solder from Copper based substrate.
Availability: North America
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Techni IM Gold AT6000

Immersion gold

Characteristics:

Self limiting immersion gold bath for optimum solderability.

Availability: North America, Asia Pacific, Europe
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Techni IM Gold AT8000

Non Cyanide immersion gold
Characteristics: Proprietary non cyanide immersion gold bath for optimum solderability and reduced gold usage.
Availability: North America, Asia Pacific, Europe
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Techni JA Solder Strip

Single-step solder stripper

Characteristics:

Immersion solder strip for removal of solder from Copper substrate (peroxide/fluoride base).

Availability: North America, Asia Pacific, Europe
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Techni M-16 Tin-Lead Stripper

Immersion belt stripper. Nitric acid based
Characteristics: Low sludge, low cost stripper. High strip rate (0.33-0.83 um/second. High solder capacity.
Availability: North America
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Techni Matte Tin Sulfate 89TI

Matte Tin for rack and barrel
Characteristics: Low operating cost. Good product for most technology types. Optimum distribution in the range of 15 - 20 ASF.
Availability: North America, Europe
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Techni MSI CuCN Bright Copper Cyanide

Alkaline Cyanide Copper Strike
Characteristics: Full bright process used for both strike and full build applications.
Availability: North America, Asia Pacific
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Techni Neutralizer E-260

Post treatment process for tin and tin alloys
Characteristics: Protects tin deposits from oxidation and discoloration following post-plate high temperature dry thermal exposure. Optimum results when used in combination with Techni Nickel TS. Recommended for rack, barrel and high speed application.
Availability: Asia Pacific
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Techni NF 800 HS

TinLead Plating
Characteristics: High speed tin lead plating.
Availability: Asia Pacific
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Techni NF BT2

MSA-based bright tin and tin/lead plating process
Characteristics: Operates over a wide CD range for increased output and flexibility in production. Produces brilliant deposits with good ductility. Exhibits good throwing power and distribution characteristics.
Availability: North America
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Techni NF JB 3000

High speed bright tin plating process. MSA based electrolyte.

Characteristics:

Bright, whisker resistant pure tin based on MSA. Satisfies all requirements of JEDEC JESD 201.

Availability: North America, Asia Pacific, Europe
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Techni NF JB 3400

High speed bright tin/lead plating process
Characteristics: Mirror bright 90/10 or 60/40 tin/lead alloy deposits from MSA electrolyte.
Availability: North America
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Techni NF JB 3500

High speed bright tin/lead plating process

Characteristics:

Mirror bright 90/10 or 60/40 tin/lead alloy deposits from MSA electrolyte.

Availability: North America, Asia Pacific, Europe
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Techni NF JM 3000

High speed MSA based matte tin plating process   Fully compatible with Techni NF JB 3000 bright tin.  Excellent solderability and resistance to reflow discoloration.
Characteristics: High speed matte tin plating process based on MSA. Fully compatible with Techni NF JB 3000 bright tin.
Availability: North America, Europe
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Techni NF JM 6000

High speed tin lead for reel to reel strip plating
Characteristics: Medium grained, high speed, MSA based, matte whisker resistant tin plating process.  Satisfies all requirements of JEDEC JESD 201. Available as a tin/lead process.
Availability: North America, Asia Pacific, Europe
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Techni NF JM 6000 LS

MSA based process for matte tin and tin/lead plating
Characteristics: General purpose rack and barrel matte tin and tin/lead plating process. Operates over a wide current density range with uniform deposit appearance.
Availability: North America, Asia Pacific
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Techni NF JM 8000

MSA tin process that can be used in rack, barrel and high speed RTR equipment.
Characteristics: Specifically designed for ultra-high, high, and medium speed, MSA based matte tin deposition with outstanding whisker resistance (JEDEC compliant).  Excellent on-line reflow performance.  Superior deposit uniformity and throwing power.
Availability: North America, Asia Pacific, Europe
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Techni NF PC6053

Matte Tin Etch Resist
Characteristics: Good product for all technology types. Optimum distribution in the range of 15 - 20 ASF. Excellent throwing power.
Availability: Asia Pacific
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Techni NF Tin 400 LA Concentrate

Techni NF Tin 400 LA Concentrate utilizes Grade “A” low-lead tin to create a unique low acid tin methane sulfonate solution that provides benefits in inert anode plating and other applications.  Techni NF Tin 400 LA Concentrate enables customers to increase the tin content of the plating solution during bath replenishment without increasing the acid concentration. It can be used in any Technic tin or tin-alloy plating process that uses tin methane sulfonate. Suitable for high speed applications or where insoluble anodes are used.  

Characteristics:
  • Ideal for closed-loop systems
  • Can be used for any MSA tin/tin alloy baths
  • Odorless, clear product
  • Increase tin content without increasing the acid concentration
  • Easy bath makeup and replenishment
  • Mitigates MSA Acid Activator
  • Less tin usage with longer bath life
  • Stable bath cathode efficiency
  • ​​​​​​Significant cost and labor savings
Availability: North America, Asia Pacific, Europe
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Techni NF TP-NT

Techni NF TP-NT process is a high speed matte pure tin electroplating process specifically formulated for the continuous strip and wire plating industry.  Based on a methane sulfonic acid electrolyte containing a powerful antioxidant that minimizes oxidation of stannous tin.  The current density range of the process is exceptionally wide, which allows the strip/wire line operator to maintain a low tin concentration in the plating bath without sacrificing line speed.  Deposits have a lustrous matte to semi-bright finish, and are uniform in appearance at all usable current densities.  

Characteristics:
  • Exceptionally wide current density range
  • Deposits exhibit excellent visual deposit uniformity across the entire current density range
  • Non-foaming electrolyte
  • Operation at elevated temperatures up to 55°C

 

Availability: North America, Asia Pacific, Europe
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Techni Nickel HT-2

Sulfate Nickel For High Aspect Ratio Deep tank Operation

Characteristics:

For high aspect ratio applications over 10:1 aspect ratio and holes sizes below 18 mils. Will dramatically improve throwing power compared to sulfate or sulfamate chemistries.

Availability: North America, Asia Pacific, Europe
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Techni Nickel S

Low stress, semi-bright, ductile nickel plating process
Characteristics: Sulfate or sulfamate, semi-bright, general purpose nickel underplate or final finish.  Wide operational window and control parameters.   Uses nickel bromide for anode corrosion.
Availability: North America, Europe, Asia Pacific
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Techni Nickel SE

Low stress, semi-bright, ductile nickel plating process
Characteristics: Can be used as a nickel underplate or final finish. Easy to operate and control. Semi-bright deposit. A general purpose bath which should be recommended for all non-critical applications. Uses nickel bromide for anode corrosion.
Availability: Asia Pacific
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Techni Nickel TS

High speed nickel sulfamate plating process.
Characteristics: Recommended for use in applications requiring no discoloration of overlying tin deposits during thermal exposure.
Availability: North America, Asia Pacific, Europe
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Techni NiPhos 611

Electrolytic nickel-phosphorous alloy plating process.
Characteristics: A nickel-phosphorous alloy plating process which provides a deposit containing 6-11% phosphorous for increased corrosion resistance in reel to reel electronic component and connector plating applications. Specifically designed to prevent discoloration of parts which are subjected to high temperature bake after tin plating and improve deposit corrosion resistance.
Availability: North America, Asia Pacific
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Techni NPD P4

Decorative gold

Characteristics:

Alkaline, gold/copper alloy based, gold plating solution producing pink color deposits.

Availability: Europe
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TECHNI NPD P6

Decorative gold
Characteristics: Alkaline, Gold/Nickel/Silver Alloy based, gold plating bath.
Availability: Europe
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Techni Pal PF

Palladium/Iron alloy with a bright deposit.

Characteristics:
  • White deposit
  • Cobalt and nickel free
  • Useful for fashion when nickel is not an option
Availability: Europe
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Techni PC 75 HS

Acid Copper
Characteristics: Mid to high speed semi-bright to bright copper plating process.
Availability: Asia Pacific
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Techni Pre-dip 470 3X

Anti-immersion of Silver on Copper during high speed silver plating
Characteristics: Effective anti-immersion process for leadframe application, long bath life and simple operation
Availability: Asia Pacific
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Techni Silver 1006

Full bright silver
Characteristics: Antimony-hardened silver plating process for electronics applications.
Availability: North America, Europe
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Techni Silver 1025

Full bright silver
Characteristics: Robust rack, barrel, and medium speed silver plating process.  Designed for most electronic applications.  Excellent wear resistance.
Availability: North America, Asia Pacific, Europe
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Techni Silver 1028

Full bright silver
Characteristics: General purpose silver plating process for rack, barrel and medium speed applications. Good for most electronic applications except where Se brightener is not desired/permitted; e.g., RF applications.
Availability: Asia Pacific
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Techni Silver 1050

High speed
Characteristics: Matte to semi-bright 99.9% ductile silver deposit.
Availability: North America, Europe
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Techni Silver Cyless II W

No cyanide bright silver

Characteristics:

Cyanide free, electrolytic silver plating process, bright deposit.

Availability: Europe
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Techni Silver Cyless II W Semi Bright

No cyanide semi-bright silver

Characteristics:

Cyanide free, alkaline, electrolytic silver plating process, semi bright deposit.

Availability: Europe
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Techni Silver E

Pure silver plating process with metallic brightener for decorative applications.

Characteristics:
  • Mirror bight deposit
  • Hardness as deposited in the range of 140-200 Knoop (25g load)
  • Deposit has low porosity 
  • Better tarnish resistance than pure silver
Availability: Europe
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Techni Silver EHS-3R

High GAM / high brightness silver electroplating process for LED applications
Characteristics: Techni Silver EHS 3R is a high speed silver plating solution designed to deposit pure silver in spot plating and other automatic machine applications from a phosphate electrolyte using inert anodes. Techni Silver EHS 3R produces full bright deposits with high GAM values for LED applications
Availability: North America, Asia Pacific
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Techni Silver HCD

Matte to bright silver plating process
Characteristics: A silver plating process designed to operate with inert anodes and very low concentrations of free cyanide. Recommended where high purity, heat resistant deposits with excellent die and wire bonding characteristics are required.
Availability: North America, Asia Pacific, Europe
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Techni Silver LED

High GAM / high brightness silver electroplating process for LED applications
Characteristics: Techni Silver® LED is a silver electroplating process which produces ultra-bright and reflective silver deposits for LED substrate applications, in rack and medium speed reel to reel plating equipment using soluble anodes.
Availability: North America
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Techni Silver Stripper 3500

Anodic, high speed silver back-strip solution
Characteristics: Alkaline, non-cyanide stripper for use on copper and copper alloys.
Availability: North America
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Techni Solder NF W

High speed matte/satin pure tin; organic MSA based process; exceptionally wide current density range.

Characteristics:
  • Non-foaming electrolyte
  • Deposits exhibit excellent solderability with low organic co-deposition
  • Easily analyzed bath components
  • Single component grain refiner
Availability: Europe
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Techni Tarnex

Corrosion and tarnish protection
Characteristics: A newly developed post treatment process which provides effective corrosion and tarnish protection for copper, brass, bronze, silver, palladium and low karat gold alloys. This product will provide excellent protection during storage for contacts, switches.
Availability: Asia Pacific
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Techni Tin 89T

Matte Tin for rack and barrel
Characteristics: Low operating cost. Good product for most technology types. Optimum distribution in the range of 15 - 20 ASF.
Availability: Asia Pacific
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Techni Tin Lead Clear A Flock

Treatment for removal of stannic tin
Characteristics: Recommended for use in tin and tin alloy baths. Acts by coagulating and precipitating the stannic tin. Can be readily filtered, leaving behind a clear plating bath.
Availability: North America
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Techni TSC 1500

Cleaner suitable for all metals

Characteristics:

Powdered product. Buffing compound, grease and oil removal. For all metals.

Availability: Europe
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Techni White

White bronze

Characteristics:

White Bronze electrolytic process with semi-bright finish. Suitable for electronic industry. Sodium matrix.

Availability: Europe
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Techni White EGB

Tri-alloy (Cu, Sn, Zn)Plating

Characteristics:

Electrolytic process with brilliant, white finish. Suitable for electronic, decorative, and general purpose applications.  Hypo-allergenic deposit.

Availability: North America, Asia Pacific, Europe
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Techni White Rhodium

Electrolytic Rhodium Plating Process
Characteristics: The Techni White Rhodium series of rhodium-based finishes is recommended to provide the ultimate in corrosion protection, particularly for satisfying end user imposed electrolytic sweat test requirements.
Availability: North America
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Techni White Rhodium- Palladium

Electrolytic Rhodium-Palladium Plating Process
Characteristics: The Techni White Rhodium series of rhodium-based finishes is recommended to provide the ultimate in corrosion protection, particularly for satisfying end user imposed electrolytic sweat test requirements. Techni White Rhodium-Palladium provides the optimum combination of ease of operation and results for the most demanding applications.
Availability: North America
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Techni White Rhodium-Ruthenium

Electrolytic Rhodium-Ruthenium Plating Processes
Characteristics: The Techni White Rhodium series of rhodium-based finishes is recommended to provide the ultimate in corrosion protection, particularly for satisfying end user imposed electrolytic sweat test requirements.
Availability: North America
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Techni White V

White bronze

Characteristics:

White bronze electrolytic process with bright finish. Suitable for fashion industry.

Availability: Europe
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Techni X-Cell 318

Pattern Plate Pre-clean

Characteristics:

Low Cost, Easy to Use, Excellent Cleaning Capability for Heavily Soils and Oxidation

Availability: North America, Asia Pacific
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Techni X-Cell 318 LF

Pattern Plate Pre-clean
Characteristics: Low Cost, Easy to Use, Excellent Cleaning Capability for Heavily Soils and Oxidation.
Availability: Asia Pacific
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TechniBond RM

Pure gold for all applications
Characteristics: Deposit meets Mil-G-45204C, Type III, Grade A requirement.
Availability: Europe
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TechniBrite 3111

Barrel & Rack bright tin plating
Characteristics: Industry standard in low speed bright tin plating process, non hazardous additive system with even thickness distribution
Availability: Asia Pacific
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Technibrite HT 1000

Technibrite HT 1000 is Technic’s most advanced bright tin process for rack and barrel applications.  The process eliminates tin metal growth problems by operating at higher cathode efficiencies and warmer temperatures.  With its exceptional low current density bright range, complex geometry parts are uniformly bright in all areas.

Characteristics:
  • Wide temperature operating range: 20 - 35°C (68 - 95°F)
     
  • Exceptional low current density bright range
     
  • Deposit is whisker mitigated per JEDEC 208 test protocol.
Availability: North America, Asia Pacific, Europe
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Technic Acid Gold Strike

Gold strike on difficult to plate base metals
Characteristics: Low pH gold strike with excellent adhesion on tin-nickel, stainless steel, Kovar, titanium, passive nickel and other difficult to plate base metals.
Availability: North America, Asia Pacific
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Technic Antique Gold

Specialty finish gold
Characteristics: For smuts, hues, and highlights.
Availability: North America, Asia Pacific
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Technic Aqua Shed-1

Drying enhancement
Characteristics: Aqueous blend of additives designed to rapidly dry parts by shedding water.
Availability: North America, Asia Pacific
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Technic CSP D 130

Copper Plating
Characteristics: High speed high throw process for thin substrates. Ideal for VCP applications.
Availability: Asia Pacific
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Technic CU 2300

DC Copper For Medium to High Technology
Characteristics: Easy to use, low cost two component, analyzable.
Availability: North America, Europe
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Technic CU 2800

Medium to high technology DC Copper
Characteristics: Easy to use, low cost two component, analyzable high performance / low CD operation.
Availability: North America
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Technic CU 2900

DC Copper Medium to High Technology

Characteristics:

Easy to use, designed for applications requiring high throw. One component concentrated Replenishment.

Availability: North America
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Technic CU 5300

PPR Copper For Medium to High Technology
Characteristics: easy to use, stable PPR process yielding a bright deposit.
Availability: North America, Europe
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Technic CU128

Acid Copper for thin substrates
Characteristics: High speed high throw process for thin substrates. Ideal for VCP applications.
Availability: North America, Asia Pacific
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Technic CU135

DC acid copper for use with insoluble anodes
Characteristics: Easy to use, designed for applications requiring high throw. One component concentrated Replenishment to be used with Technic ISA insoluble anode system.
Availability: North America, Asia Pacific, Europe
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Technic Cyless Silver Strip

Silver stripper

Characteristics:

Non-cyanide stripper to remove silver from copper.

Availability: North America, Asia Pacific, Europe
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Technic Electocleaner 100

Electrolytic cleaner
Characteristics: Alkaline low foaming, chelated. High speed application. Rapidly removes oils, grease, and other contaminants. Low COD, free of phosphorous
Availability: Asia Pacific
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Technic Electocleaner 210G

Electrolytic cleaner
Characteristics: Alkaline, chelated, l ow speed application. Rapidly removes oils, grease, and other contaminants. Low COD, low of phosphorous.
Availability: Asia Pacific
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Technic EN AT5600

RoHS compliant electroless nickel
Characteristics: Mid Phos electroless nickel for optimum solderability.
Availability: North America
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Technic Envirostrip AG

Electrolytic anodic-current process to remove silver deposits from metallic under-layer as copper, brass and nickel.

Characteristics:
  • Non-cyanide stripper process
  • No etching of the substrates
  • Silver is readily recovered
Availability: Europe
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Technic FFP Nickel

Sulfate Nickel For High Speed Applications
Characteristics: Sulfate nickel for high speed plating. Specifically designed for use in TAB plating.
Availability: Asia Pacific
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Technic FFP Nickel

Sulfate Nickel For High Speed Applications
Characteristics: Sulfate nickel for high speed plating. Specifically designed for use in TAB plating.
Availability: North America, Europe
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Technic ISA Copper Oxide

Copper Oxide for use with insoluble anodes
Characteristics: High purity, easy to dissolve copper oxide for use with insoluble anodes
Availability: North America, Asia Pacific, Europe
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Technic JB Nickel

Nickel sulfate plating
Characteristics: Bright decorative finish for both rack and barrel plating.
Availability: North America
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Technic Microetch 85

Descale

Characteristics:

Single component copper descale.

Availability: Asia Pacific
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Technic Non-Cyanide Silver Stripper

Silver Stripper
Characteristics: Non-hazardous, non-toxic product developed for environmentally safe back stripping and electropolishing of copper base materials, particularly as a high speed electrolytic silver strip for semiconductor silver bleed.
Availability: Asia Pacific
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Technic Palladium Nickel 900 TC

Pd/Ni alloy, semi-bright to bright , 70-90% Palladium
Characteristics: Low ammonia Pd/Ni plating process, chloride based electrolyte. Capable of depositing Pd/Ni alloys containing 70/90% Palladium.
Availability: Asia Pacific
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Technic Palladium Nickel AF-LS

Ammonia-free Palladium Nickel alloy barrel plating process (65-90% Palladium)
Characteristics: Ammonia-free process yielding semi-bright to bright deposits. Low pH provides enhanced adhesion to nickel substrates. Operates at 3-25 ASF.
Availability: North America, Asia Pacific
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Technic Palladium Nickel NFA

Palladium Nickel alloy plating process (70-90% Palladium) containing no free ammonia.

Characteristics:

A chloride-free, alloy plating process containing no free ammonia. The deposit finish is semibright to full bright  Deposit properties include good ductility and low porosity.  

Availability: North America, Asia Pacific, Europe
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Technic Palladium Nickel VHS

Pd/Ni alloy, semi-bright to bright , 70-90% Palladium

Characteristics:

Conventional Pd/Ni plating process, chloride based electrolyte. Capable of depositing Pd/Ni alloys containing 70-90% Palladium.

Availability: North America, Asia Pacific
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Technic PC Anti-Tarnish

Corrosion and tarnish protection
Characteristics: Post treatment process which provides effective corrosion and tarnish protection for copper. This product will provide excellent protection during storage for contacts, switches.
Availability: Asia Pacific
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Technic Predip 470

Anti-immersion predip chemistry prior to silver plating
Characteristics: Recommended for copper and copper alloy lead frame materials.
Availability: North America
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Technic PST Neutralizer

Neutralizer-rinse aid
Characteristics: Effectively neutralizes acid films from plating processes.
Availability: North America, Asia Pacific, Europe
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Technic Rhodium

Rhodium plate
Characteristics: Bright white sulfate high throw process.
Availability: North America, Asia Pacific
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Technic TEC 1016

Electrolytic cleaner
Characteristics: Alkaline low foaming; chelated. Rapidly removes oils, grease, and other contaminants.
Availability: North America, Asia Pacific
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Technic TSC 1508-L

Soak cleaner for ferrous and non-ferrous metals

Characteristics:

Water based alkaline cleaner concentrate for ferrous and non-ferrous metals.

Availability: North America
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Technic TSC-1501

Soak cleaner ferrous and non-ferrous metals

Characteristics:

Soak cleaner for removal of most grease and oils from ferrous and non-ferrous metal.

Availability: North America, Asia Pacific
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TechniCatalyst AT4608

Catalyst for activation of Cu surface for ENIG process

Characteristics:

High performance palladium activator for fine features and difficult substrates

Availability: North America, Asia Pacific, Europe
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TechniClean AT 1000

Final Finish and Pattern Plate Pre-clean
Characteristics: Low Cost, Easy to Use, Free Rinsing, Will Not Etch / Ideal for Thin Copper Coatings.
Availability: North America, Asia Pacific
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TechniClean CA25

PER Remover
Characteristics: Post Etch Residue remover that works effectively on various metal stacks including: Tungsten, Al and Cu.
Availability: North America, Asia Pacific, Europe
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TechniClean IK73

TechniClean IK73 is a post etch residue removal product that has been specifically targeted for the selective removal of highly-inert chemical residues created during the patterning of high-k dielectric metal oxides based on hafnium, zirconium and tantalum.  Compatible with a wide range of metals and dielectrics normally present during high-k patterning, TechniClean IK73 functions at room temperature, is very easily rinsed and is suitable for immersion, batch-spray and single-wafer chemical applications. 

Characteristics:
  • Fast and selective removal of post etch residues created by plasma etching of high-k dielectric materials
  • Compatible with aluminum, copper dielectric materials
  • Designed for room temperature operation, water rinsable
  • Suitable for immersion, batch-spray and single wafer application
Availability: North America, Asia Pacific, Europe
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Techniclean OH

Electrolytic microetching cleaner for copper alloy.  

Characteristics:
  • Silicates-free process
  • Easy to use 
  • Analyzable 
Availability: Europe
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TechniClean SF

Techniclean SF is a non-foaming, silicate free alkaline electrolytic-cleaner.

Characteristics:

Techniclean SF is a non-foaming, silicate free alkaline electrolytic-cleaner suitable for the pre-treatment of steel and copper alloy strips in reel-to-reel applications. Techniclean SF is extremely tolerant to base metal contamination/re-deposition.

Availability: Europe
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TechniClean TH1020

Acid cleaner for ENIG & ENEPIG

Characteristics:

TechniClean TH1020 is an acid cleaner designed to inhibit electroless nickel from depositing in non-plated through holes (NPTH).

Availability: North America
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Techniclear 1100

Cathaphoretic lacquer

Characteristics:

Cathodic electrophoretic process producing transparent coatings.

Availability: Europe
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TechniENickel AT5000

RoHS compliant electroless nickel
Characteristics: Mid Phos electroless nickel for optimum solderability.
Availability: Europe
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TechniEtch 1118

Horizontal or vertical process for preparation of copper prior to resist application or prior to plating copper, tin or nickel.
Characteristics: Improved topography and longer bath life versus generic Sodium Persulfate prior to resist.
Availability: North America
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TechniEtch 1198

I/L & O/L Pretreatment
Characteristics: Enhancer for NaPS micro-etch cleaning system that increases the Cu holding capacity from 20g/L to 45g/L.
Availability: Asia Pacific
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TechniEtch 1688

Organic acid based Cu Micro Etch
Characteristics: Horizontal Process designed to create a micro roughened topography for optimum adhesion of polymeric materials like dry film & solder mask.
Availability: North America
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TechniEtch AC35

Gold/Copper Etchant

Characteristics:

The key attribute of TechniEtch AC35 is its capability to optimize a combined gold/copper etching step by controlling the gold layer undercut to a minimum while quickly etching a thick copper layer.

Availability: North America, Asia Pacific, Europe
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TechniEtch ACI2

Gold Etchant

Characteristics:

Iodine based metal etchant for use with selective gold applications.

Availability: North America, Asia Pacific, Europe
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TechniEtch AT2000

ENIG Pre-clean

Characteristics:

Low Cost, High Copper Capacity Compared to Generic Sodium Persulfate.

Availability: North America
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TechniEtch CN10

Copper Seed Layer Etchant
Characteristics: Provides selective etch and high loading capacity for UBM and RDL applications. Used also for selective Cu/Ni in UBM stack because of its great etching metal selectivity.
Availability: North America, Asia Pacific, Europe
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TechniEtch HP Stabilizer TC

I/L & O/L Pretreatment
Characteristics: Hydrogen Peroxide based micro-etch formula with increased copper holding capacity and reduced etch depth.
Availability: Asia Pacific
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TechniEtch SLC

Copper Seed Layer Etchant

Characteristics:

Highly selective copper seed layer etchant that provides very low feature undercut and minimal metal oxidation of tin or tin/silver.

Availability: North America, Asia Pacific, Europe
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TechniEtch TBR19

Ti, TiN, and TiW Etchant

Characteristics:

Barrier layer remover for WLP applications. Solution provides great process window resulting in minimal to zero undercut while etching both metals.

Availability: North America, Asia Pacific, Europe
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TechniFlex DRF2000F

Dry film photoimagable coverlay. 

Characteristics:

Dry film photoimagable coverlay for flexible substrates

Availability: North America, Asia Pacific, Europe
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TechniFlex LCL 1000F

Liquid Photoimagable SM/Coverlay Film For Flexible Circuits

Characteristics:

Superior flexibility while maintaining thermal resistance, 94 V-0 certified and wide color selections.

Availability: North America, Asia Pacific
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TechniFlex LCL 1000F/001G

Amber photoimagable solder mask
Characteristics: Amber gloss photoimagable solder mask for flexible substrates
Availability: Asia Pacific
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TechniFlex LCL 1000F/110G

Green photoimagable solder mask
Characteristics: Green gloss photoimagable solder mask for flexible substrates.
Availability: Asia Pacific
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TechniFlex LCL 1000F/281S

Blue photoimagable solder mask.

Characteristics:

Blue semi-gloss photoimagable solder mask for flexible substrates.

Availability: North America, Asia Pacific, Europe
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TechniFlex LCL 1000F/410G

Black photoimagable solder mask
Characteristics: Black gloss photoimagable solder mask for flexible substrates.
Availability: Asia Pacific
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TechniFlex LCL 1000F/410M

Black photoimagable flexible solder mask
Characteristics: Black matte photoimagable solder mask for flexible substrates
Availability: North America, Asia Pacific, Europe
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TechniFlex LCL 1000F/421M Code 06

Black photoimageable flexible solder mask

Characteristics:

Enhanced Black matte photoimagable solder mask for flexible substrates with hot bar application

Availability: North America, Asia Pacific, Europe
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TechniFlex LCL 1000F/421M R2R

Black coverlay film for flexible circuits in roll to roll applications.

Characteristics:

Black matte photoimagable solder mask for flexible substrates using roll to roll equipment.

Availability: North America, Asia Pacific, Europe
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TechniFlex LCL 1000F/421M U6

Black direct image coverlay
Characteristics: Black matte photoimagable solder mask for flexible substrates
Availability: Asia Pacific
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TechniFlex LCL 1000F/423M U6

Matte black solder mask for flexible applications using direct imaging. For direct imaging/manual exposure for standard cut sheet flexible circuit panel application and roll to roll operation.

Characteristics:

High strength material that can withstand extremely high soldering temperatures and multiple bending cycles while still meeting very fine pitch requirements.

Availability: North America, Asia Pacific
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TechniFlex LCL 1000F/423M U7

Matte black solder mask for flexible applications using direct imaging. For direct imaging/manual exposure for high multiple layer cut sheet flexible circuit panel and roll to roll applications.

Characteristics:

High strength material that can withstand extremely high soldering temperatures and multiple bending cycles while still meeting very fine pitch requirements.

Availability: North America, Asia Pacific
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TechniFlex LCL 1000F/423M U8

TechniFlex LCL 1000F/423M U8 Direct Imaging is a liquid, photo-definable, halogen-free, flexible black matte solder mask, specially designed for low exposing energy with recently available high output direct imaging (DI) systems.  This DI product exhibits high flexibility and elasticity and is Active Silicone Free.  It is resistant to multiple soldering operations and is capable of lead-free soldering/hot bar processing up to 340C.

Characteristics:
  • Extremely high heat resistance
  • Low exposure energy
  • Stackable, tack free surface after drying
Availability: North America, Asia Pacific, Europe
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TechniFlex LCL 1000F/423M U8F

TechniFlex LCL 1000F/423M U8F Direct Imaging is a liquid, photo-definable, halogen-free, flexible black matte solder mask, specially designed for low exposing energy with recently available high output direct imaging (DI) systems.  This DI product exhibits very high flexibility and elasticity and is Active Silicone Free.  It is resistant to multiple soldering operations and is capable of lead-free soldering/hot bar processing.

Characteristics:
  • Extremely high flexibility and elasticity before and after baking
  • High heat resistance
  • Stackable, tack free surface after drying
Availability: North America, Asia Pacific, Europe
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TechniFlex LCL 1000F/452M

Black direct image soldermask

Characteristics:

Low exposing energy black matte flexible photoimagable solder mask for DI application

Availability: North America, Asia Pacific, Europe
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TechniFlex LCL 1000F/900G

White photoimagable solder mask
Characteristics: White gloss photoimagable solder mask for flexible substrates
Availability: Asia Pacific
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TechniMask ISR 1000

Liquid Photoimagable Solder Mask

Characteristics:

Low cost, ENIG compatible.

Availability: North America, Asia Pacific
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TechniMask UV SR2

UV Curable Solder Mask
Characteristics: UV curable solder mask for flexible circuits.
Availability: North America, Asia Pacific, Europe
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TechniPad 7611

Electroless palladium for ENEPIG

Characteristics:

Autocatalytic Pd producing a pure Pd deposit

Availability: North America
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Technipad AU6100

Immersion gold for ENIG & ENEPIG

Characteristics:

High performance cyanide based immersion gold that reduces gold usage and improves solderability.

Availability: North America, Asia Pacific, Europe
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TechniPad ENEPIG

Electroless Nickel, Electroless Palladium, Immersion Gold
Characteristics: TechniPad ENEPIG provides a very stable true electroless palladium for gold wire bonding capability and better wear resistance for multiple contacts.
Availability: North America, Asia Pacific, Europe
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TechniPad ENIG

Electroless Nickel Immersion Gold Process
Characteristics: ENIG process designed for Pb-free reflow temperatures. Excellent solder joint strength. Equiaxal nickel grain structure.
Availability: North America, Asia Pacific, Europe
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TechniPolish 3212

Remove the substrate defect
Characteristics: Electrolytic polishing for Copper, Iron based alloy.
Availability: Asia Pacific
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TechniPress Resist 101

Press solder mask
Characteristics: Press solder mask for flexible substrates
Availability: Asia Pacific
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TechniPulse CU5300

PPR Copper For Medium to High Technology
Characteristics: Characteristics: Easy to use, stable PPR process yielding a bright deposit.
Availability: North America
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Techniseal Ag

Transparent nanoscale anti-corrosion / anti-discoloration coating for high-temperature applications

Characteristics:

Techniseal Ag is a cathodic electrolytic passivation system that provides a transparent nano-scale, protective coating on silver which to improves corrosion resistance and minimizes appearance degradation. Techniseal protects silver from tarnishing during exposure to heat and/or sulfur corrosion testing.

Availability: North America, Asia Pacific, Europe
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TechniSol Ag 2460

Silver Plating
Characteristics: Non-cyanide silver electrodeposition process that can be used to enhance a silver paste seed layer or can be used as a solderable layer in a solar cell metal stack application. Can be used with Light Induced Plating or conventional electroplating.
Availability: North America, Asia Pacific, Europe
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TechniSol Cu 3000

Acid Copper

Characteristics:

Electrodeposition copper process that can be used with Light Induced Plating or conventional electroplating. This bath produces low stress, high conductivity deposits that are ideal for use in a solar cell metal stack application.

Availability: North America, Asia Pacific
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TechniSol Ni 2420

Electrolytic Nickel Barrier Layer
Characteristics: Electrodeposition nickel process that can be used with Light Induced Plating or conventional electroplating. Ideal for use as a barrier layer over alternative seed layers and can be used as a barrier layer over silver paste.
Availability: North America, Asia Pacific, Europe
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Technisol Nickel 2428

Boric Acid Free Nickel Plating

Characteristics:

Produces a low stress, semi-bright, ductile, low resistivity deposit for photovoltaic cell metallization from nickel chemistry that does not contain boric acid.  Can be used with LIP or conventional electroplating.

Availability: North America, Asia Pacific, Europe
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Technisol SN 2480

Tin Plating

Characteristics:

Tin plating solution specifically formulated for use in the manufacture of photovoltaic cells.  Ideal for use as the final step in a nickel, copper tin metal stack.  Provides protection to the copper layer from oxidation and provides excellent solderability during module assembly.  Can be used with LIP or conventional electroplating.

Availability: North America, Asia Pacific, Europe
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Technistan Ag

MSA based semi-bright to full bright tin-silver alloy (1-7% silver)
Characteristics: A high speed tin-silver alloy plating process for use in applications such as high temperature solder in automotive applications.
Availability: North America, Asia Pacific, Europe
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Technistan EP

High Speed Electrolytic Matte Tin
Characteristics: Technistan EP is a high speed, pure tin whisker resistant plating process based on Technic’s proprietary and patented mixed acid technology. Industry standard for Pb-free plating for more than 10 years
Availability: North America, Asia Pacific
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Technistan HTM SN 4088

Matte Tin Etch Resist
Characteristics: Low operating cost. Good product for all technology types. Optimum distribution in the range of 15 - 20 ASF. Excellent throwing power.
Availability: North America
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Technistan JB 3000

High speed bright tin plating process. Sulfate based electrolyte.
Characteristics: Bright, whisker resistant pure tin, mixed acid/sulfate based. Satisfies all requirements of JEDEC JESD 201.
Availability: North America, Asia Pacific
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Technistan JM 6000 LS

Sulfate based matte tin. Sulfate based electrolyte.
Characteristics: Matte whisker resistant deposit. Recommended for rack/barrel applications (up to 4 ASD).
Availability: North America
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Technistan JM 7000

Sulfate tin process that can be used in rack, barrel and high speed RTR equipment.
Characteristics: Whisker resistant deposit (JEDEC tests). Excellent deposit uniformity at all usable current densities. Excellent solderability. Great throwing power, even with high tin formulations. Sulfate formulation eliminates potential problems with lead co-depos
Availability: North America, Asia Pacific, Europe
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Technistan TP

High speed matte tin sulfate process designed for use on lines with in-line tin reflow furnaces.
Characteristics: High speed matte pure tin plating process based on sulfuric acid electrolyte. Offers significant cost advantages vs MSA systems.
Availability: North America, Asia Pacific
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Technistan TP 5000

High speed pure tin process for reel-to-reel continuous strip applications

Characteristics:

High speed matte pure tin plating process based on sulfuric acid electrolyte. Offers significant cost advantages vs MSA systems.

Availability: Europe
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Technistan TP W

Reel to reel

Characteristics:

Electrolytic Tin sulfate based plating matte ,uniform deposit, with good solderability.

Availability: Europe
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Technistan TP-5000

High speed matte tin sulfate process designed for use on lines with in-line tin reflow furnaces.
Characteristics: High speed matte pure tin plating process based on sulfuric acid electrolyte. Offers significant cost advantages vs MSA systems.
Availability: Asia Pacific
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Technistan TP-W

High speed matte/satin pure tin for wire applications
Characteristics: High speed matte pure tin process based on sulfuric acid technology. Offers significant cost advantages to MSA systems.
Availability: North America, Asia Pacific, Europe
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Technistan W

Wire application

Characteristics:

Electrolytic tin sulfate based plating matte ,uniform deposit, with good solderability.

Availability: Europe
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TechniStrip AU

Gold Stripper

Characteristics:

Cyanide based gold stripper prepared from dry mix. Removes gold from most base metals.

Availability: North America, Asia Pacific
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TechniStrip AU RTU

Gold Stripper

Characteristics:

RTU Cyanide based gold stripper. Removes gold from most base metals.

Availability: Asia Pacific
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TechniStrip CU XP

Strips copper deposits from stainless steel substrate

Characteristics:

An acidic electrolyte specifically formulated to strip copper deposits from stainless steel substrate. It does not contain any hydrogen peroxide, fluoride or boron. The stripper produces very little sludge and is designed for use in immersion stripping op.

Availability: Asia Pacific
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TechniStrip EL

Electrolytic process for stripping copper, nickel and tin from titanium or stainless steel plating racks.

Characteristics:

The racks to be stripped are made anodic and the plated metal on the racks is dissolved into the electrolyte and subsequently deposited on steel or copper cathodes.

Availability: North America
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TechniStrip EL-AF

Electrolytic process for stripping copper, nickel and tin from titanium or stainless steel plating racks.

Characteristics:

Ammonia-free version of Technistrip EL

Availability: North America, Asia Pacific
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TechniStrip ELBS

Electrolytic belt stripper. MSA based.

Characteristics:

Specifically designed for efficient stripping of tin, tin/lead and/or nickel deposits from stainless steel.

Availability: North America
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TechniStrip ELBS - II

Electrolytic Tin Stripper

Characteristics:

Removes tin from stainless steel belt. The electrolyte is exceptionally stable & non-hazardous. It does not generate heavy metal sludge. Tin can recovered on the cathode as a metallic deposit.

Availability: Asia Pacific
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TechniStrip MLO-07

Stripper for Metal Lift-Off

Characteristics:

A highly efficient positive and negative tone photoresist remover used for IR, II/V, MEMS, photonic, TSV mask, solder bumping and hard disk stripping applications. Compatible with Cu, Al, Sn/Ag, Alumina, magnetic alloys and organic substrates such as polymide, Parylene and others. Also very efficient for metal lift off applications.

Availability: North America, Asia Pacific, Europe
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TechniStrip NF52

Stripper for Dryfilm Resist

Characteristics:

Advanced formula that is designed to offer full dissolution with excellent metal compatibility and high loading capacity. Solvent based stripper.

Availability: North America, Asia Pacific, Europe
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TechniStrip NF90

TMAH Free Stripper

Characteristics:

Offers similar performance to TechniStrip NF52. High resin dissolution and excellent metal compatibility.

Availability: North America, Asia Pacific, Europe
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TechniStrip NI555

Stripper for Advanced AZ EM Resist

Characteristics:

Specially formulated to fully dissolve AZ EM advanced line of photoresist: AZ15nXT, AZ40XT, and AZnLOF 2000 series.

Availability: North America, Asia Pacific, Europe
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TechniStrip NISN

Tin Stripper

Characteristics:

Removes nickel and tin from stainless steel substrates. The electrolyte is exceptionally stable & non-hazardous. It does not generate heavy metal sludge. Nickel and tin are recovered on the cathode as a metallic deposit.

Availability: Asia Pacific
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TechniStrip P1331

Stripper for Liquid Resist

Characteristics:

Solution that has a wide range of applications. It is ideal for use in backend applications like TSV, Cu pillar, bumping, etc. Offers complete dissolution of thick film resist with excellent metal compatibility. Water based stripper.

Availability: North America, Asia Pacific, Europe
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TechniStrip Silver Special

Sodium cyanide based stripper formulated to chemically remove silver deposits.

Characteristics:
  • Removes silver deposits from nickel surface, nickel alloy, copper, copper alloys and steel (iron)
  • No attack on base metal

 

Availability: Europe
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TechniStrip® Micro D2

TechniStrip® Micro D2 is a versatile photoresist stripper formulated to address resin lift-off and dissolution of negative and positive tone resist.  TechniStrip Micro D2 is an environmentally friendly alternative for NMP, DMSO and DMSO/Amine based photoresist strippers.

Characteristics:
  • Non-hazardous replacement for NMP
     
  • Lower running cost then NMP
     
  • Improved performance over NMP and DMSO based resist strippers
Availability: North America, Asia Pacific, Europe
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Techno Magic 11

Versatile nickel brightener

Characteristics:

Unique, universal brightener for rack and barrel applications.

Availability: Europe
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Technotan PC

Prevention of copper surfactant oxidization
Characteristics: Developed post-treatment process for printed circuit applications which effectively protects copper from oxidation/tarnishing during storage.
Availability: Asia Pacific
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Tin Cobalt

Tin -cobalt plating

Characteristics:

Tin-cobalt alloy bath, chrome like finish.

Availability: Europe
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Tin Spray

Matte Tin Etch Resist for rack and barrel
Characteristics: Non-foaming process providing a fine grained tin deposit
Availability: North America
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Top Coat 11

Sealer for conversion

Characteristics:

Sealer for zinc plated and passivated surfaces.

Availability: Europe
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Top Coat 14

Sealer agent for zinc and zinc alloy.

Characteristics:
  • Improves corrosion resistance
  • Suitable for use in automotive applications
  • Excellent control of friction coefficient
Availability: Europe
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Top Coat IG 21

Sealer agent in water phase for zinc and zinc alloy.

Characteristics:
  • Improves corrosion resistance
  • For use after trivalent or hexavalent chromic passivation
  • No residual rainbow stains after drying
Availability: Europe
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Tri-Alloy

Nickel/Cobalt/borum alloy
Characteristics: Electrolytic alloy process (84% Nickel, 15% Cobalt, 1% Boron). Alternative of decorative nickel plating processes.
Availability: Europe
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TRUSHADE 24 K

Decorative gold
Characteristics: Alkaline, decorative, gold plating process producing a bright 24K color deposit.
Availability: Europe
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TRUSHADE S 7

Decorative gold
Characteristics: Electrolytic, alkaline gold plating process producing "champagne" color deposits.
Availability: Europe
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V-10, 20, 30 series

Oil separator for plating pre-treatment

Characteristics:

Plating pre-treatment regeneration and reuse for reduce the chemical usage.

Availability: Asia Pacific
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Vega 3000

Acid chloride zinc plating process.  Suitable for rack and barrel applications.

Characteristics:
  • The deposit is exceptionally bright, very fine grained from very low to very high current density
  • Non-foaming surfactant system perfectly suited for high agitation/high current density plating
  • Additives offer a very high cloudy point to provide excellent tolerance to high bath temperature
Availability: Europe
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Vega 5 RS

Cyanide zinc process

Characteristics:

Brightener for alkaline, cyanide based, zinc plating process. Very bright finish.

Availability: Europe
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Vega W 28

Acid zinc process

Characteristics:

Acid sulphate zinc for reel-to-reel application

Availability: Europe
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Vega ZF 210

Alkaline electrolytic  process for deposition of zinc-iron alloy (0.3-0.6% Fe).  Suitable for barrel and rack applications.

Characteristics:
  • Process supplies a black deposit with excellent throwing power
  • Deposit compared with conventional Zn offer higher corrosion resistance
  • Deposit can be passivated with yellow-iridescent and black passivation
Availability: Europe
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Wonder 11A/B

Trivalent chrome black conversion for zinc and nickel deposits.

Characteristics:
  • Excellent adhesion property
  • Excellent weather resistance
  • High corrosion resistance
Availability: Europe
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Wonder 22 AL B

Trivalent chrome blue conversion for zinc and nickel deposits.

Characteristics:
  • High corrosion resistance
Availability:
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Wonder CFY 1

Trivalent blue chrome, cobalt free conversion coating for acid and alkaline zinc.

Characteristics:
  • Very high corrosion resistance 
  • Cobalt free
  • Meets SVHC of Reach restriction
  • Possible to obtain rainbow coating
Availability: Europe
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Wonder SB 18

Trivalent chromium blue conversion coating for alkaline or acid zinc with or without cyanide.

Characteristics:
  • Medium corrosion resustance
  • Suitable for both alkaline and acid zinc
  • Contains cobalt metal
  • Adapted to RoHS regulation and does not contain Pb, Cd, Hg, Cr6+, PBB and PBDE
Availability: Europe
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Wonder TR 36

Trivalent blue chrome conversion coating for acid and alkaline zinc.

Characteristics:
  • Low corrosion resistance
  • Produces dip blue deposits
  • Good tolerance to iron contamination
Availability: Europe
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Wonder Z 7

Trivalent black chrome conversion coating for zinc deposits.

Characteristics:
  • Good corrosion resistance
  • Suitable for alkaline and acid zinc
  • Good scratching
Availability: Europe
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Wonder Z BL 30

Cobalt free trivalent chromium blue conversion for acid and alkaline zinc processes.

Characteristics:
  • It is considered low corrosion resistance at white rust
  • Complaint at RoHS regulation.  If not, it contains Pb, Cd, Hg, Cr6+, PBB, and PBDE
Availability: Europe
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Wonder Z BSR

Trivalent chrome based chromate conversion coating of blue, silver (white), and rainbow (iridescent) colors on alkaline and acid zinc.

Characteristics:
  • High corrosion resistance
Availability:
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Wonder ZA-ZB

Trivalent black chrome conversion coating for alkaline zinc.

Characteristics:
  • High corrosion resistance
  • Produces a black dip color
  • Long life solution with good performance
Availability: Europe
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Woods Nickel Strike

Nickel Strike
Characteristics: Formulation used for improved adhesion over difficult to plate base materials such as Kovar, Alloy 52 and Stainless Steel prior to subsequent plating.
Availability: North America
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