Search Technic Chemistry, Equipment & Controls

High speed gold stripping formulation for removal of gold from nickel, nickel alloy, kovar, or nickel protected copper base metal.

• Operates at room temperature
• No attack on base metals

• Consistent etch rates
• Stable and economical chemistry 

Activator for EN and Nickel

Electrolytic activant for Nickel before chromium.

Al Zincate process for direct nickel plating.

AL Zincate process for copper plating prep.

• Very bright deposit
• High distribution thickness
• Suitable for rack and barrel applications

Antifuming agent for hexavalent chrome solutions.

Fumes dismissive agent for hexavalent decorative and technique chrome solution

• Nitrate free immersion silver formula for dip applications
• Flat solderable surface
• Excellent tarnish resistance
• RoHS and WEEE compliant

Electrolytic gold plating process producing 2N14 color deposits.

Acid gold plating solution tolerating relatively high quantities of metal impurities and producing hard 18K deposits.

Electrolytic, acid gold plating bath producing 23, 8 K deposits of "pale gold" color.

Acid gold plating process operating at low gold content. Suitable either for barrel or rack applications.

Decorative gold plating solution at neutral pH.

Decorative gold plating solution with high tolerance to nickel impurities.

Acid gold plating process suitable to plate directly on stainless steel surfaces.

Acid gold plating process suitable to plate directly on stainless steel surfaces, particularly for brush application.

Decorative gold plating matching the brass color.

• Bright deposit at low and medium current density, with excellent throwing power
• Good brightness and chromate compatibility 
• Consumption amounts are lower than conventional products as this is a highly concentrated type
• Applicable up to 35°C and easy to handle

Alkaline Cyanide free zinc process for barrel application. Produce mirror deposit with good throwing power.

Alkaline Cyanide free zinc process for rack application. Produce mirror deposit with good throwing power.

Nickel tin alloy to produce black durable color.

Tin/Cobalt black gunmetal color

• Deposit alloy is 70% copper and 30% zinc
• Produces uniform deposits on all types of metals 
• Suitable for rack and barrel applications

Heavy duty, electrolytic brass plating process.

Matte tin and tin/lead process that minimizes coupling of small parts in both barrels and SBE equipment.  Deposit has excellent solderability.  Solution has much lower lead concentrations than competitive processes.

• Great conditioning performance on wide variety of substrates
• Mildly alkali cleaner with high powered conditioning agent
• Low temperature operation eliminating high power consumption
• Eliminate oxidation and oils from copper surfaces

• Proprietary colloidal graphite with small particle size; ideal for blind and high aspect vias on flex and rigid PCBs
• High process yields resulting in low cost manufacturing
• Shorter process cycle resulting in lower machinery and chemical costs
• Leading edge process performance
• Elimination of formaldehyde and copper

Green-yellow bright hard gold for heavy decorative deposits.

Non Cyanide based electrolytic gold stripper. Removes gold from most base metals.

• Bright decorative hard gold deposit
• Hardness ranges between 130 and 200 knoop
• Wide current density range for both rack and barrel applications

A non aqueous process which provides improved wear resistance and corrosion-resistant properties to Durasil® Silver deposits.

A proprietary silver alloy plating process designed to replace gold in reel to reel electronic component and connector applications. Provides excellent conductivity, superior corrosion resistance and improved wear resistance compared to conventional silver

Deposits a eutectic gold-tin alloy with a melting point between 280° C and 320° C.

Electrolytic acid copper process specifically engineered to provide excellent throwing power and distribution. This process maintains superior performance over a wide range of current densities.

Copper plating process capable of depositing copper at 40-60 ASF with virtually no internal stress in the deposit.

High speed copper plating bath that is capable of plating at a nominal rate of 4 microns per minute. Excellent WIW and WID coplanarity can be achieved on a variety of feature types such as copper pillar and RDL.

A cyanide based gold plating process that produces a deposit that exhibits excellent functional performance such as wire bonding and solderability from a very stable and simple to operate solution.

Electrolytic sulfite gold process for semiconductor applications that produces pure, soft gold deposits. Operates at an optimum acidic pH of 6.6, making it compatible with almost all photoresists.  It produces a bright deposit without the use of harmful grain refiners like thallium and arsenic. Provides excellent coplanarity and step coverage.  Can be used for plating several different applications (thicknesses ranging from 0.5 - 100 microns) without major modifications to the solution and can be used on a variety of tool sets.  

Sulfamate process that is designed to produce a low stress, semi-bright, ductile nickel deposit for semiconductor applications. The bath can be used with soluble and insoluble anodes.

A high throwing power nickel process specifically engineered for semiconductor plating applications.

Boric acid free process that produces nickel deposits with similar attributes as a standard nickel electroplating solution. The process can be used for UBM, metal stacking and other semiconductor technologies that utilize a nickel metal deposit.

Platinum plating solution that can be used in a variety of semiconductor applications

Elevate Tin 5011 is a high speed electroplating process specifically designed for bump plating of pure tin in wafer plating applications especially as a solder cap for copper pillars.

Unique, universal brightener for rack and barrel applications.

Brightener for nickel usable in combination with other additives

Electrolytic bright nickel process with good throwing power and excellent leveling power. Suitable for rack applications.

• Coumarin-free formulation can cut as the undercoat in a duplex nickel system
• Leveling equal to or better than that from Coumarin-based system
• S.T.E.P. and ductility values meet all automotive OEM specifications
• Easy conversion from other semi-bright nickel plating system

Cyanide free, alkaline Copper plating solution for all metals even for zamak.

• Produces bright deposits on iron, steel and zinc-die-casting
• Lead free process with excellent  stability
• Suitable for both rack and barrel applications

• Deposit is ductile and very easy to nickel plate
• Excellent corrosion resistance 
• Adhesion of bright nickel over the Glance HB deposit is guaranteed

• White deposit
• Bright and leveling power
• Excellent throwing power

Unique, universal brightener for rack and barrel applications.

• Contains zinc metal
• Suitable only for rack applications
• Works at room temperature

Electrolytic P nickel plating

• Produces a uniform dark Ni/Zn alloy finish on Goldeneye Nickel deposits.

• Can be used in barrel, rack or medium speed reel-to-reel plating equipment.

• Deposit appearance is dependent on the specific alloy plated and varies from dark grey at moderately high current densities to dark black  at low current densities.

• Highly corrosion resistant.

• Drop-in replacement for nickel or nickel-tungsten plating solutions in existing lines.

• Nickel-free deposit with no nickel dermatitis issues - suitable for consumer applications.

• Produces level, fully bright nickel deposits at high current densities. 
   
• High hardness and good corrosion resistance.
   
• Wide operating window.
   
• All components are analyzable.

• Improved corrosion resistance compared to sulfate or sulfamate plating processes.
   
• Superior thickness distribution with improved low current density coverage.
   
• Reduced waste treatment costs.

Goldeneye Nickel is a low stress/highly corrosion-resistant nickel plating process capable of operation over a wide range of current densities from a proprietary electrolyte. Noted for its superior thickness distribution, improved corrosion-resistance, and lower waste treatment costs, Goldeneye Nickel can be utilized in reel to reel, rack and barrel plating applications

• Produces bright nickel deposits over a wide range of current densities. 

• Excellent ductility at high deposit thicknesses, especially suited for electroforming applications.

• Highly magnetic coating

• High level of solution stability and very stable alloy composition:  80/20 ± 5% Ni/Fe.

• Complexor inhibits oxidation of Fe (2+) to Fe(3+)

• Highly corrosion resistant
• High hardness with excellent wear and mechanical properties
• Non-magnetic coating, suitable for high frequency applications (5G)
• DC plating; no special rectification required

• Produces a uniform satin finish with GAM values = 0.4-0.8 over a wide current density range.
   
• Designed for use in rack or medium speed reel-to-reel plating equipment.

High speed Nickel plating process producing low stress, ductile nickel deposits.

• Liquid concentration
• Easy to use
• Non hazardous

• Excellent throwing power and high rate deposition
• Very good cathode-efficiency (better than 50%)
• High corrosion resistance

• does not contain fluoride, so the corrosive effect on material is reduced to a minimum
• High wear resistance and high deposition rate
• Excellent distribution and excellent throwing power

• Suitable for all types of metals
• Non-cyanide stripper process with neutral pH

• Operates with cyanide at room temperature
• Does not etch base material
• Good stripping rate

• Convenient, ready-to-use solution
• Works at room temperature
• Good stripping rate despite high copper concentration

• Non-cyanide stripper process
• Removes nickel deposits without etching the metal underneath

• Cyanide free liquid stripping process
• Removes nickel without etching the base material
• Solid stripping rate

• Cyanide free liquid product
• Will not etch zinc die cast (even if not well-covered by copper)
• Good stripping rate

• Convenient, ready-to-use solution
• Operates at low temperature
• Good stripping rate
• Removes tin-lead deposits from PCB without etching copper

• Velvet appearance
• Suitable for copper
• Easy to brush

• Antique natural copper
• Suitable for copper and copper alloys
• Suitable for furniture accessories

Powdered product for antique bronze color

• Easy to use for copper, copper alloy and nickel
• Stable color
• Easy to brush

• Operates at room temperature
• Produces black finish equal to obtain with the conventional black oxides processes
• Good corrosion resistance

Blackening process for silver.

Chemical dip process for blackening brass.

• Operates at room temperature.

• Operates at room temperature

• Suitable for usw with both immersion (dip/spin) and spray applications
• High corrosion resistance and consistent total friction coefficient
• Reduces fitting failures caused by excessive coating
• Produces uniform and bright finishes without iridescence

• Suitable for use with both immersion (dip/spin) and spray applications
• High corrosion resistance and consistent total friction coefficient
• Reduces fitting failures caused by excessive coating
• Produces uniform and bright finishes without iridescence

• Fine grain low porosity deposit
• High tolerance for metallic contamination of copper, nickel and lead
• Sufficient thickness to maintain solderability

• Non-cyanide immersion gold deposit
• Plates up to 20 micro inches over nickel and electroless nickel

Industry standard in hard gold products. Excellent distribution with consistent high yields. Compatible with aqueous resists. High efficiency reduces plating time.

Industry standard for hard gold products. Excellent distribution with consistent high yields. Compatible with aqueous resists. High efficiency reduces plating time.

Very high efficiency, high speed bright plating solution. The solution can be operated at low gold concentrations and at temperatures to 150 F, providing high plating rates with excellent deposit distribution.

Hard Gold 24K--Type I, II Grade C designed for both rack and barrel operations.

Acid gold strike with excellent adhesion on most base metals, particularly electroplated nickel.  High contamination resistance. 

Neutral gold plating solution, 24 K deposit.

Technical gold plating process, gold/nickel alloy.

Rhodium-look finish - lower costs. Can be deposited directly on copper, nickel alloys without a strike.

Chloride-free, low ammonia palladium plating process designed to produce highly ductile palladium deposits.

Cobalt alloy based, electrolytic palladium process for decorative applications.

Rhodium-look finish - lower costs can deposit directly on copper, nickel alloys without a strike.

Pure palladium process engineered for compatibility with aqueous dry film. Wide current density and metal concentration range. Typically utilized where better chemical resistance is required like in deep well applications.

Bright deposit. Deposits exhibit good ductility and moderate stress.

• Produces pure and brilliant deposit
• Neutral operating pH

PLATINUM AP is an electroplating process which deposits a hard platinum coating from a neutral pH bath and is highly recommended for industrial applications. The deposit exhibits excellent adhesion to most metal substrates.

Coloring for cathodic electrophoretic coatings.

Chrome free, organic passivation suitable for all the copper alloys

Dryer and antioxidant for steel and cast iron.

Protective emulsifiable oil, excellent after blackening conversion or on parts must be lubricated.

Difficult pickling and silicates removal.

Acid pickling additive for welds.

Oxide remover and pickling additive, suitable for ultrasonics.

Pickling and brightening agent.

Supporting additive for pickling solutions and degreasers.

Pickling, antioxidant and activator for silver

Pickling agent for stainless steel

Alkaline, chemical and electrolytic surfactant agent.

Pickling and degreasing action.

Antifume additive for alkaline zinc electrolytes and acid pickling solutions.

Neutralizer. Sulphuric acid alternative.

Neutralizer for silver plated parts with cyanide based electrolytes.

Stripper for varnish non-etching. For silver, black nickel and aluminum substrates.

High speed stripper for removing epoxy paints.

Stripper for removing synthetic coatings.

• Very low foaming surfactants that increase the wetting effect and produce a very controlled and reduced foam on the surface
• Contains complexing agent that increases the efficacy of the bath, extends bath life, and allows use even with hard water
• Reduced gas fumes

Electrolytic alkaline cleaner usable in anodic and cathodic phase

Cathodic and anodic degreaser

Cathodic and anodic degreaser

Nickel plated surface activator

Cathodic and anodic degreaser

• Reduced amount of product in stick, decreased processing costs
• Decrease the amount of waste
• Does not emit corrosive fumes or dangerous, unpleasant odors. 

Processing oil removal. Phosphate€“ free liquid.

• Does not make foam and has the capability to remove dirt rapidly to avoid deposition on the walls of barrels and tanks
• Does not separate oily from sticky residues
• Avoids the formation of complex salts with metals

Cathodic degreaser with flocculating action

Non-foaming cathodic and anodic degreaser

Buffing compound removal

Buffing compound, buffing oil and grease removal

Buffing compound and buffing oil removal

Buffing compound and processing oil removal

Liquid cleaner with low foam for spray, ultrasonic and system with air agitation

Buffing compound and buffing grease removal

Buffing oil and buffing compound removal with flocculating action.

Oil removal, also non-saponifiable type.

Buffing compound and oil removal

• Can be used in ultrasonic equipment
• Reduce production cost
• Easy to handle

Low alkalinity liquid degreaser with deoxidizer.

• Produces a bright white deposit with low or high thickness
• High throwing and leveling power
• Simple to use 
• Very stable process

Ruthenium dark process, good also for barrel application

• Produces resistance and bright deposit.
• Supplied in two versions:  dark grey and white

• Produces brightness deposit 12-18% alloy
• Excellent leveling and penetration
• Excellent conversion coating properties (silver and black) after plating, that produce excellent corrosion resistance.

Non-cyanide, semi-bright to bright silver plating process.

Mirror bright silver with excellent wear resistance.

Electrolytic silver plating process for industrial applications, potassium cyanide based, semi-bright deposit.

Electrolytic silver plating process, sodium cyanide based producing a bright deposit for decorative and heavy duty purposes.

• Ideal for all decorative applications
• Consistent high purity deposits
• Excellent throwing power

Electrolytic silver plating process, potassium cyanide based, mirror-bright deposit.

Electrolytic silver plating process, sodium cyanide based, bright deposit for decorative and heavy duty purposes.

• Mirror bright deposit
• Finish is tarnish-resistant as plated

• Process free of toxic and flammable substances
• Produces uniform deposits with excellent brightness
• Excellent throwing power and good ductility
• Process suitable on cast iron and hard steel

• Better adhesion property in conversion treatment than conventional brightener
• Good compatibility with trivalent conversion coating
• Particularly excellent with trivalent back

• Low cost acid immersion tin
• Superior brightness
• Easily solderable coating
• Ideal for industrial and decorative hardware

Unique, universal brightener for rack and barrel applications.

Unique, universal brightener for rack and barrel applications.

Decorative electrolytic brass plating process.

Thin colorless film with good resistance to corrosion with improved solderability and no effect on electrical performance.

Anti-discoloration during storage, thermal, heating & reflow conditions. Furthermore, matte tin deposit will not be melt after reflow.

Chrome free, metallic Passivation suitable for all the copper alloys.

Chrome free, metallic passivation suitable for all copper alloys

• No detrimental effect to electrical properties or solderability
• Resist 96 hours to test UNI EN 4611
• Meets MIL specifications QQS-365A

Metallic, chrome free passivation, good prior to painting

Recommended for protection of metal surfaces subjected to post plate salt spray corrosion testing (See ASTM B117). This product has been demonstrated to be effective on nickel, tin and thin gold deposits used in connector applications.

An inorganic coating designed to improve the tarnish resistance and solderability of silver deposits, particularly after dry heat thermal exposure. Recommended for rack, barrel, and high speed reel-to-reel applications.

Specifically designed for use on tin and tin alloy deposits which are subjected to post-plate thermal exposure in high humidity/steam environments. For optimal results, Tarniban® C48 should be used in combination with Technic PST.

Provides protection of tin and tin alloy deposits from discoloration following exposure to high humidity/steam environments plus dry thermal exposure (reflow/oven bake).

Perchloroethylene and chrome free passivation agent and antioxidant

Recommended for minimization of epoxy bleed-out without adversely affecting downstream assembly operations such as wire bonding and die attach.

Protects tin deposits from oxidation and discoloration following post-plate high temperature dry thermal exposure. Optimum results when used in combination with Techni Nickel TS. Recommended for rack, barrel and high speed application.

• Excellent resistance to sulphide tarnishing
• Contact resistance values are extremely low 20-90 michroms/in² at 200 PSI contact pressure
• No change in physical appearance after 300 hours of exposure to 95% R.H. and 32ºC
• Meets MIL specifications QQS-365A

For use with Techni Silver LED and LED HS to retain brightness and reflectivity after long term storage and/or high temperature exposure.

Techniseal is a cathodic electrolytic passivation system that provides a transparent nano-scale, protective coating on silver which to improves corrosion resistance and minimizes appearance degradation. Techniseal protects silver from tarnishing during exposure to heat and/or sulfur corrosion testing.

Highly conductive electro-cleaner for removal of light oxide, oils and light buffing. Excellent risibility and wide temperature range.

Blackening solution for Electroless Nickel deposits

Acid gold strike process guaranteeing a perfect adhesion. Wood Nickel treatment can be avoided.

Non-flouride blend of dry acid salts for pickling metals prior to electroplating.  Replaces mineral acids such as sulfuric and hydrochloric acid. Used to activate all base metals.

Blend of dry acid salts with flouride used for pickling metals prior to electroplating.  For nickel alloys, copper, and brass activation. Similar to TAS-1, but more aggressive for hard-to-activate surfaces.

Single component copper descale

Single component copper descale. Suitable for C 7025

• All-purpose for both ferrous and non-ferrous metals
• Phosphate-free
• Highly effective as soak or electrolytic cleaner

Acid gold plating process producing dark brown color deposits.

Sulfate based electrolytic tin plating process, bright deposit. Suitable for rack and barrel applications

Concentrated alkaline liquid cleaner for removing buffing compounds, tarnish and oxides from copper and brass.

Easy-to-handle liquid form. Aids in reducing brighteners additive in replenishment. According to Reach Regulation is not listed in SVHC boric acid.

Semi bright strike process. Recommended for difficult to plate metals.

• Produces micro-bright, micro-pitting free and ductile deposit
• High thickness and excellent corrosion resistance
• Can be used with cathode agitation or air insufflation as well

• Specifically engineered to produce bright and even deposits from a stable electrolyte
• High purity and fine grained equiaxed deposits
• Economical to use

Aggressive etchant for copper that has a long life and high copper capacity. Used to deoxidize/activate copper based parts prior to electroplating.

• Stable process
• Very bright
• Excellent throwing power

• Provides a fine grained, equiaxed high purity and ductile deposit
• Specifically engineered for plating uniform satin, even deposits from a stable electrolyte
• Economical solution with only one additive to manage

Low operating temperature. Highly alkaline (pH >12). Low cost.

Mildly alkaline solution designed to remove bleed and mold flash from plastic semiconductor packages electrolytically.

• Low coefficient of friction deposits
• Excellent release resistance and corrosion resistance
• Meets MIL-C-26074E, AMS 2404 C and AMS specifications.
• ELV, RoHS and WEEE compliant.

• Excellent brightness
• Exceptional stability
• High tolerance to impurities

• Produce compressive stress hard deposit
• Excellent corrosion resistance in alkaline environments
• Excellent hard deposit with good wear resistance

Bright medium phos, self regulated

• Lead and cadmium free
• Consistent rate plates
• Meets MIL-26074B, AMS 24043 and AMS 2405 specifications
• ELV, RoHS and WEEE compliant

• Self-regulating pH bath
• Excellent corrosion resistance (with a thickness of at least 25 µm it resists 1000 hours to salt spray test ISO 9227)
• Meets the 26074-D and AMS 2404-B Military specifications

Two component, low working temperature electroless nickel.

Electroless nickel low P content

• Better lateral growth yielding better corrosion resistance
• Excellent solution stability
• Phosphorus between 6-9% w/w

Non cyanide alkaline stripper designed to remove electroless or electrolytic nickel from copper.

• Promotes excellent adhesion of electroplated  and electroless process
• Cyanide free process.  Reduce the costs of waste treatment
• Uniform zinc coating on complex parts

Cobalt-hardened gold plating process with high cathode efficiency and good thickness distribution. Lower operation cost.

Cobalt-hardened gold plating process with high cathode efficiency and good thickness distribution. Anti-gold immersion.

Cobalt-hardened gold plating process with high cathode efficiency and good thickness distribution.

Nickel-hardened gold plating process with high cathode efficiency and good thickness distribution.

High performance nickel hardened gold plating process for low speed, high speed, and selective applications.  Very tolerant to metallic contamination.

General purpose, nickel hardened gold plating process for connector applications.

High performance cobalt hardened gold plating process for low speed, high speed, and selective applications.  Very tolerant to metallic contamination.

General purpose, cobalt hardened gold plating process for connector applications.

Acid pure gold plating process designed to produce a gold electrodeposit of 99.9+% purity in rack and barrel electroplating applications for devices used in the semi-conductor, electronic, and PWB industries where high purity gold deposits are required.

434 Acid Pure Gold process is designed to produce a gold electrodeposit of 99.9+% purity for devices used in the semi-conductor, electronic, and PWB industries where high purity gold deposits are required to meet wire bonding requirements.

Gold plating process using pulse plating technology to produce low-porosity deposits in electronic component and connector applications.

Gold plating process using pulse plating technology to produce low-porosity deposits in electronic component and connector applications.

Gold plating process designed to minimize porosity in electronic component and connector barrel plating applications.

Gold plating process recommended for a highly uniform 2 - 5 microinch flash gold over nickel, palladium and palladium nickel alloys.

Gold plating process recommended for a highly uniform 2 - 5 microinch flash gold over nickel, palladium and palladium nickel alloys.

Self limiting immersion gold bath for optimum solderability.

Immersion solder strip for removal of solder from Copper substrate (peroxide/fluoride base).

Bright, whisker resistant pure tin based on MSA. Satisfies all requirements of JEDEC JESD 201.

Mirror bright 90/10 or 60/40 tin/lead alloy deposits from MSA electrolyte.

• Ideal for closed-loop systems
• Can be used for any MSA tin/tin alloy baths
• Odorless, clear product
• Increase tin content without increasing the acid concentration
• Easy bath makeup and replenishment
• Mitigates MSA Acid Activator
• Less tin usage with longer bath life
• Stable bath cathode efficiency
• ​​​​​​Significant cost and labor savings

• Exceptionally wide current density range
• Deposits exhibit excellent visual deposit uniformity across the entire current density range
• Non-foaming electrolyte
• Operation at elevated temperatures up to 55°C

For high aspect ratio applications over 10:1 aspect ratio and holes sizes below 18 mils. Will dramatically improve throwing power compared to sulfate or sulfamate chemistries.

Alkaline, gold/copper alloy based, gold plating solution producing pink color deposits.

• White deposit
• Cobalt and nickel free
• Useful for fashion when nickel is not an option

Cyanide free, electrolytic silver plating process, bright deposit.

Cyanide free, alkaline, electrolytic silver plating process, semi bright deposit.

• Mirror bight deposit
• Hardness as deposited in the range of 140-200 Knoop (25g load)
• Deposit has low porosity 
• Better tarnish resistance than pure silver

• Non-foaming electrolyte
• Deposits exhibit excellent solderability with low organic co-deposition
• Easily analyzed bath components
• Single component grain refiner

Powdered product. Buffing compound, grease and oil removal. For all metals.

White Bronze electrolytic process with semi-bright finish. Suitable for electronic industry. Sodium matrix.

Electrolytic process with brilliant, white finish. Suitable for electronic, decorative, and general purpose applications.  Hypo-allergenic deposit.

White bronze electrolytic process with bright finish. Suitable for fashion industry.

Low Cost, Easy to Use, Excellent Cleaning Capability for Heavily Soils and Oxidation

• Wide temperature operating range: 20 - 35°C (68 - 95°F)
   
• Exceptional low current density bright range
   
• Deposit is whisker mitigated per JEDEC 208 test protocol.

Easy to use, designed for applications requiring high throw. One component concentrated Replenishment.

Non-cyanide stripper to remove silver from copper.

• Non-cyanide stripper process
• No etching of the substrates
• Silver is readily recovered

Single component copper descale.

A chloride-free, alloy plating process containing no free ammonia. The deposit finish is semibright to full bright  Deposit properties include good ductility and low porosity.  

Conventional Pd/Ni plating process, chloride based electrolyte. Capable of depositing Pd/Ni alloys containing 70-90% Palladium.

Water based alkaline cleaner concentrate for ferrous and non-ferrous metals.

Soak cleaner for removal of most grease and oils from ferrous and non-ferrous metal.

High performance palladium activator for fine features and difficult substrates

• Fast and selective removal of post etch residues created by plasma etching of high-k dielectric materials
• Compatible with aluminum, copper dielectric materials
• Designed for room temperature operation, water rinsable
• Suitable for immersion, batch-spray and single wafer application

• Silicates-free process
• Easy to use 
• Analyzable 

Techniclean SF is a non-foaming, silicate free alkaline electrolytic-cleaner suitable for the pre-treatment of steel and copper alloy strips in reel-to-reel applications. Techniclean SF is extremely tolerant to base metal contamination/re-deposition.

TechniClean TH1020 is an acid cleaner designed to inhibit electroless nickel from depositing in non-plated through holes (NPTH).

Cathodic electrophoretic process producing transparent coatings.

The key attribute of TechniEtch AC35 is its capability to optimize a combined gold/copper etching step by controlling the gold layer undercut to a minimum while quickly etching a thick copper layer.

Iodine based metal etchant for use with selective gold applications.

Low Cost, High Copper Capacity Compared to Generic Sodium Persulfate.

Highly selective copper seed layer etchant that provides very low feature undercut and minimal metal oxidation of tin or tin/silver.

Barrier layer remover for WLP applications. Solution provides great process window resulting in minimal to zero undercut while etching both metals.

Dry film photoimagable coverlay for flexible substrates

Superior flexibility while maintaining thermal resistance, 94 V-0 certified and wide color selections.

Blue semi-gloss photoimagable solder mask for flexible substrates.

Enhanced Black matte photoimagable solder mask for flexible substrates with hot bar application

Black matte photoimagable solder mask for flexible substrates using roll to roll equipment.

High strength material that can withstand extremely high soldering temperatures and multiple bending cycles while still meeting very fine pitch requirements.

High strength material that can withstand extremely high soldering temperatures and multiple bending cycles while still meeting very fine pitch requirements.

• Extremely high heat resistance
• Low exposure energy
• Stackable, tack free surface after drying

• Extremely high flexibility and elasticity before and after baking
• High heat resistance
• Stackable, tack free surface after drying

Low exposing energy black matte flexible photoimagable solder mask for DI application

Low cost, ENIG compatible.

Autocatalytic Pd producing a pure Pd deposit

High performance cyanide based immersion gold that reduces gold usage and improves solderability.

Techniseal Ag is a cathodic electrolytic passivation system that provides a transparent nano-scale, protective coating on silver which to improves corrosion resistance and minimizes appearance degradation. Techniseal protects silver from tarnishing during exposure to heat and/or sulfur corrosion testing.

Electrodeposition copper process that can be used with Light Induced Plating or conventional electroplating. This bath produces low stress, high conductivity deposits that are ideal for use in a solar cell metal stack application.

Produces a low stress, semi-bright, ductile, low resistivity deposit for photovoltaic cell metallization from nickel chemistry that does not contain boric acid.  Can be used with LIP or conventional electroplating.

Tin plating solution specifically formulated for use in the manufacture of photovoltaic cells.  Ideal for use as the final step in a nickel, copper tin metal stack.  Provides protection to the copper layer from oxidation and provides excellent solderability during module assembly.  Can be used with LIP or conventional electroplating.

High speed matte pure tin plating process based on sulfuric acid electrolyte. Offers significant cost advantages vs MSA systems.

Electrolytic Tin sulfate based plating matte ,uniform deposit, with good solderability.

Electrolytic tin sulfate based plating matte ,uniform deposit, with good solderability.

Cyanide based gold stripper prepared from dry mix. Removes gold from most base metals.

RTU Cyanide based gold stripper. Removes gold from most base metals.

An acidic electrolyte specifically formulated to strip copper deposits from stainless steel substrate. It does not contain any hydrogen peroxide, fluoride or boron. The stripper produces very little sludge and is designed for use in immersion stripping op.

The racks to be stripped are made anodic and the plated metal on the racks is dissolved into the electrolyte and subsequently deposited on steel or copper cathodes.

Ammonia-free version of Technistrip EL

Specifically designed for efficient stripping of tin, tin/lead and/or nickel deposits from stainless steel.

Removes tin from stainless steel belt. The electrolyte is exceptionally stable & non-hazardous. It does not generate heavy metal sludge. Tin can recovered on the cathode as a metallic deposit.

A highly efficient positive and negative tone photoresist remover used for IR, II/V, MEMS, photonic, TSV mask, solder bumping and hard disk stripping applications. Compatible with Cu, Al, Sn/Ag, Alumina, magnetic alloys and organic substrates such as polymide, Parylene and others. Also very efficient for metal lift off applications.

Advanced formula that is designed to offer full dissolution with excellent metal compatibility and high loading capacity. Solvent based stripper.

Offers similar performance to TechniStrip NF52. High resin dissolution and excellent metal compatibility.

Specially formulated to fully dissolve AZ EM advanced line of photoresist: AZ15nXT, AZ40XT, and AZnLOF 2000 series.

Removes nickel and tin from stainless steel substrates. The electrolyte is exceptionally stable & non-hazardous. It does not generate heavy metal sludge. Nickel and tin are recovered on the cathode as a metallic deposit.

Solution that has a wide range of applications. It is ideal for use in backend applications like TSV, Cu pillar, bumping, etc. Offers complete dissolution of thick film resist with excellent metal compatibility. Water based stripper.

• Removes silver deposits from nickel surface, nickel alloy, copper, copper alloys and steel (iron)
• No attack on base metal

• Non-hazardous replacement for NMP
   
• Lower running cost then NMP
   
• Improved performance over NMP and DMSO based resist strippers

Unique, universal brightener for rack and barrel applications.

Tin-cobalt alloy bath, chrome like finish.

Sealer for zinc plated and passivated surfaces.

• Improves corrosion resistance
• Suitable for use in automotive applications
• Excellent control of friction coefficient

• Improves corrosion resistance
• For use after trivalent or hexavalent chromic passivation
• No residual rainbow stains after drying

Plating pre-treatment regeneration and reuse for reduce the chemical usage.

• The deposit is exceptionally bright, very fine grained from very low to very high current density
• Non-foaming surfactant system perfectly suited for high agitation/high current density plating
• Additives offer a very high cloudy point to provide excellent tolerance to high bath temperature

Brightener for alkaline, cyanide based, zinc plating process. Very bright finish.

Acid sulphate zinc for reel-to-reel application

• Process supplies a black deposit with excellent throwing power
• Deposit compared with conventional Zn offer higher corrosion resistance
• Deposit can be passivated with yellow-iridescent and black passivation

• Excellent adhesion property
• Excellent weather resistance
• High corrosion resistance

• High corrosion resistance

• Very high corrosion resistance 
• Cobalt free
• Meets SVHC of Reach restriction
• Possible to obtain rainbow coating

• Medium corrosion resustance
• Suitable for both alkaline and acid zinc
• Contains cobalt metal
• Adapted to RoHS regulation and does not contain Pb, Cd, Hg, Cr⁶⁺, PBB and PBDE

• Low corrosion resistance
• Produces dip blue deposits
• Good tolerance to iron contamination

• Good corrosion resistance
• Suitable for alkaline and acid zinc
• Good scratching

• It is considered low corrosion resistance at white rust
• Complaint at RoHS regulation.  If not, it contains Pb, Cd, Hg, Cr⁶⁺, PBB, and PBDE

• High corrosion resistance

• High corrosion resistance
• Produces a black dip color
• Long life solution with good performance