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1006 Silver
40 Acid Gold Strike
9025 Gold Stripper
Gold Stripper
High speed gold stripping formulation for removal of gold from nickel, nickel alloy, kovar, or nickel protected copper base metal.
9050 Palladium Stripper
Chemical stripper for removing deposits of palladium, palladium/nickel alloys and platinum.
- Operates at room temperature
- No attack on base metals
94 Gold Strike
Activator Cu
Ammonia-free activator and pickling additive for copper designed for use in the pretreatment cycles.
- Consistent etch rates
- Stable and economical chemistry
Activon 10
Activant
Electrolytic activant for Nickel before chromium.
Allumin 5200
Zincate for aluminum before nickel
Al Zincate process for direct nickel plating.
Allumin 810 cementaz. Aluminum
Zincate for aluminum before alkaline copper
AL Zincate process for copper plating prep.
Alphalux
Alkaline zinc cyanide free process
- Very bright deposit
- High distribution thickness
- Suitable for rack and barrel applications
Amtofimo Cromo D 44
Antifuming chrome hexavalent
Antifuming agent for hexavalent chrome solutions.
Antifume 66 NF
Antifume
Fumes dismissive agent for hexavalent decorative and technique chrome solution
Argentomerse NC
Stable, non-cyanide, immersion silver for deposition onto copper and copper alloys. The deposit is tarnish resistant and gives consistent solderability.
- Nitrate free immersion silver formula for dip applications
- Flat solderable surface
- Excellent tarnish resistance
- RoHS and WEEE compliant
Au-Electrum
Auroguard NP-12
Aurotex 1002 N 14
Decorative gold
Electrolytic gold plating process producing 2N14 color deposits.
Aurotex 1002 N 18
Decorative gold
Acid gold plating solution tolerating relatively high quantities of metal impurities and producing hard 18K deposits.
Aurotex 1002 NG
Decorative gold
Electrolytic, acid gold plating bath producing 23, 8 K deposits of "pale gold" color.
Aurotex 1100 SR
Decorative gold
Acid gold plating process operating at low gold content. Suitable either for barrel or rack applications.
Aurotex 240
Decorative gold
Decorative gold plating solution at neutral pH.
Aurotex 290
Decorative gold
Decorative gold plating solution with high tolerance to nickel impurities.
Aurotex 88 GS M
Decorative gold
Acid gold plating process suitable to plate directly on stainless steel surfaces.
Aurotex 94G
Decorative gold
Acid gold plating process suitable to plate directly on stainless steel surfaces, particularly for brush application.
Aurotex MC 418
Decorative gold
Decorative gold plating matching the brass color.
Betalux
Electrolytic alkaline zinc plating process for rack and barrel applications.
- Bright deposit at low and medium current density, with excellent throwing power
- Good brightness and chromate compatibility
- Consumption amounts are lower than conventional products as this is a highly concentrated type
- Applicable up to 35°C and easy to handle
Betalux Barrel
Alkaline zinc without cyanide
Alkaline Cyanide free zinc process for barrel application. Produce mirror deposit with good throwing power.
Betalux Rack
Alkaline zinc without cyanide
Alkaline Cyanide free zinc process for rack application. Produce mirror deposit with good throwing power.
Black Gun CL
Black Nickel
Nickel tin alloy to produce black durable color.
Black Tin Cobalt
Tin-cobalt plating
Tin/Cobalt black gunmetal color
Brass 71 D
Decorative electrolytic brass plating process.
- Deposit alloy is 70% copper and 30% zinc
- Produces uniform deposits on all types of metals
- Suitable for rack and barrel applications
Brass 71 S
Brass high thickness plating
Heavy duty, electrolytic brass plating process.
Ceramistan 1031
Ceramistan DM
Tin and Tin/Lead alloy plating process (up to 40% Lead) for small passive components.
Matte tin and tin/lead process that minimizes coupling of small parts in both barrels and SBE equipment. Deposit has excellent solderability. Solution has much lower lead concentrations than competitive processes.
Circudep 3500
Cleaner conditioner for metallization of rigid and flex PCBs.
- Great conditioning performance on wide variety of substrates
- Mildly alkali cleaner with high powered conditioning agent
- Low temperature operation eliminating high power consumption
- Eliminate oxidation and oils from copper surfaces
Circudep 4000
A highly stable and economical graphite based direct metallization system for use with horizontal flood conveyorized process equipment.
- Proprietary colloidal graphite with small particle size; ideal for blind and high aspect vias on flex and rigid PCBs
- High process yields resulting in low cost manufacturing
- Shorter process cycle resulting in lower machinery and chemical costs
- Leading edge process performance
- Elimination of formaldehyde and copper
Circumer 1800
Cote D'Or
Decorative hard gold
Green-yellow bright hard gold for heavy decorative deposits.
CUCN
CUCN-Bright Copper Cyanide Process
Cyless Electrolytic AU Strip TC
Gold Stripper
Non Cyanide based electrolytic gold stripper. Removes gold from most base metals.
DEC
Décor Gold
Décor Gold is a bright acid hard gold that contains a metallic brightener. The process was formulated for decorative applications.
- Bright decorative hard gold deposit
- Hardness ranges between 130 and 200 knoop
- Wide current density range for both rack and barrel applications
Durasil Post Treatment
Post treatment for Durasil® Silver
A non aqueous process which provides improved wear resistance and corrosion-resistant properties to Durasil® Silver deposits.
Durasil Silver
Bright Hard Silver
A proprietary silver alloy plating process designed to replace gold in reel to reel electronic component and connector applications. Provides excellent conductivity, superior corrosion resistance and improved wear resistance compared to conventional silver
EAS
Elevate AuSn 8020
Eutectic gold-tin
Deposits a eutectic gold-tin alloy with a melting point between 280° C and 320° C.
Elevate Cu 6300 Cleaner
Elevate Cu 6320
Copper Plating
Electrolytic acid copper process specifically engineered to provide excellent throwing power and distribution. This process maintains superior performance over a wide range of current densities.
Elevate Cu 6340
Copper Plating
Copper plating process capable of depositing copper at 40-60 ASF with virtually no internal stress in the deposit.
Elevate Cu 6370
Copper Plating
High speed copper plating bath that is capable of plating at a nominal rate of 4 microns per minute. Excellent WIW and WID coplanarity can be achieved on a variety of feature types such as copper pillar and RDL.
Elevate Gold 7934
High purity, soft gold plating
A cyanide based gold plating process that produces a deposit that exhibits excellent functional performance such as wire bonding and solderability from a very stable and simple to operate solution.
Elevate Gold 7990 NBV
Gold Plating
Electrolytic sulfite gold process for semiconductor applications that produces pure, soft gold deposits. Operates at an optimum acidic pH of 6.6, making it compatible with almost all photoresists. It produces a bright deposit without the use of harmful grain refiners like thallium and arsenic. Provides excellent coplanarity and step coverage. Can be used for plating several different applications (thicknesses ranging from 0.5 - 100 microns) without major modifications to the solution and can be used on a variety of tool sets.
Elevate Ni 5910
Nickel Plating
Sulfamate process that is designed to produce a low stress, semi-bright, ductile nickel deposit for semiconductor applications. The bath can be used with soluble and insoluble anodes.
Elevate Ni 5930
Nickel Plating
A high throwing power nickel process specifically engineered for semiconductor plating applications.
Elevate Ni 5950
Boric Acid free Nickel Plating
Boric acid free process that produces nickel deposits with similar attributes as a standard nickel electroplating solution. The process can be used for UBM, metal stacking and other semiconductor technologies that utilize a nickel metal deposit.
Elevate Platinum 7810
Platinum Plating
Platinum plating solution that can be used in a variety of semiconductor applications
Elevate Tin 5011
Tin Plating
Elevate Tin 5011 is a high speed electroplating process specifically designed for bump plating of pure tin in wafer plating applications especially as a solder cap for copper pillars.
Enviolet series
Glance 189 L
Uniform nickel brightener
Unique, universal brightener for rack and barrel applications.
Glance 374/G
Leveling bright nickel
Brightener for nickel usable in combination with other additives
Glance 91 S/A
Leveling bright nickel
Electrolytic bright nickel process with good throwing power and excellent leveling power. Suitable for rack applications.
Glance CSF
Semi-bright nickel process that produces a highly leveled and ductile deposit exhibiting exceptional corrosion protection when used as the undercoat in a duplex nickel system.
- Coumarin-free formulation can cut as the undercoat in a duplex nickel system
- Leveling equal to or better than that from Coumarin-based system
- S.T.E.P. and ductility values meet all automotive OEM specifications
- Easy conversion from other semi-bright nickel plating system
Glance CU 160
Copper plating, no cyanide.
Cyanide free, alkaline Copper plating solution for all metals even for zamak.
Glance CU 9002
Electrolytic alkaline copper process containing cyanide.
- Produces bright deposits on iron, steel and zinc-die-casting
- Lead free process with excellent stability
- Suitable for both rack and barrel applications
Glance HB
Semi-bright nickel process permitting to deposit the first nickel layer in the double nickel plating application and suitable for electronic and electromechanical industries.
- Deposit is ductile and very easy to nickel plate
- Excellent corrosion resistance
- Adhesion of bright nickel over the Glance HB deposit is guaranteed
Glance Lux 1
Brightener for rack and barrel nickel bath.
- White deposit
- Bright and leveling power
- Excellent throwing power
Glance LUX 2
Nickel brightener for fashion field
Unique, universal brightener for rack and barrel applications.
Glance N 23
Dark grey electrolytic nickel.
- Contains zinc metal
- Suitable only for rack applications
- Works at room temperature
Gold alloys
Goldeneye Black Nickel
Goldeneye Black Nickel produces a dark nickel/zinc (Ni/Zn) alloy finish on top of an electroplated nickel deposit. The appearance of the Goldeneye Black Nickel deposit varies from dark grey to black depending on the operating parameters and equipment used.
- Produces a uniform dark Ni/Zn alloy finish on Goldeneye Nickel deposits.
- Can be used in barrel, rack or medium speed reel-to-reel plating equipment.
- Deposit appearance is dependent on the specific alloy plated and varies from dark grey at moderately high current densities to dark black at low current densities.
Goldeneye Cobalt Tungsten
Goldeneye Cobalt Tungsten is a unique process specifically designed to deposit a 65/35 Co/W alloy in connector and electronic component applications where it can be applied as a barrier layer replacement for nickel or other nickel alloys such as nickel-tungsten.
- Highly corrosion resistant.
- Drop-in replacement for nickel or nickel-tungsten plating solutions in existing lines.
- Nickel-free deposit with no nickel dermatitis issues - suitable for consumer applications.
Goldeneye Level Nickel HS
Goldeneye Level Nickel HS is an advanced electroplating process specifically designed to produce fully bright lustrous nickel deposits at high current densities, suitable for decorative applications.
- Produces level, fully bright nickel deposits at high current densities.
- High hardness and good corrosion resistance.
- Wide operating window.
- All components are analyzable.
Goldeneye Nickel
Goldeneye Nickel is a low stress/highly corrosion-resistant nickel plating process capable of operation over a wide range of current densities from a proprietary electrolyte. Noted for its superior thickness distribution, improved corrosion-resistance, and lower waste treatment costs, Goldeneye Nickel can be utilized in reel to reel, rack and barrel applications.
- Improved corrosion resistance compared to sulfate or sulfamate plating processes.
- Superior thickness distribution with improved low current density coverage.
- Reduced waste treatment costs.
Goldeneye Nickel / Goldeneye Nickel III
Electrolytic nickel plating process.
Goldeneye Nickel is a low stress/highly corrosion-resistant nickel plating process capable of operation over a wide range of current densities from a proprietary electrolyte. Noted for its superior thickness distribution, improved corrosion-resistance, and lower waste treatment costs, Goldeneye Nickel can be utilized in reel to reel, rack and barrel plating applications
Goldeneye Nickel EF
Goldeneye Nickel EF is an advanced electroplating process specifically designed to produce fully bright lustrous nickel deposits over a wide range of current densities. The ability to produce ductile heavy deposits with very low stress makes this process especially suitable for electroforming applications.
- Produces bright nickel deposits over a wide range of current densities.
- Excellent ductility at high deposit thicknesses, especially suited for electroforming applications.
Goldeneye Nickel Iron
Goldeneye Nickel Iron is a unique process specifically designed to deposit an 80/20 Ni/Fe alloy in various applications, especially where a highly magnetic coating is desired. Goldeneye Nickel Iron is suitable for rack or medium speed reel to reel plating equipment.
- Highly magnetic coating
- High level of solution stability and very stable alloy composition: 80/20 ± 5% Ni/Fe.
- Complexor inhibits oxidation of Fe (2+) to Fe(3+)
Goldeneye Nickel Tungsten
Goldeneye Nickel Tungsten is designed to deposit a Ni/W alloy in applications requiring superior corrosion resistance, mechanical strength, high hardness, excellent wear, and other properties. It is suitable for reel to reel, rack or barrel plating equipment. Goldeneye Nickel Tungsten requires no special rectification and the process can be implemented in existing plating lines with minimal to no modifications.
- Highly corrosion resistant
- High hardness with excellent wear and mechanical properties
- Non-magnetic coating, suitable for high frequency applications (5G)
- DC plating; no special rectification required
Goldeneye Satin Nickel
Goldeneye Satin Nickel is a unique electroplating process which produces a smooth satin nickel deposit in applications requiring this finish.
- Produces a uniform satin finish with GAM values = 0.4-0.8 over a wide current density range.
- Designed for use in rack or medium speed reel-to-reel plating equipment.
High Speed Nickel Sulfamate FFP
High speed nickel sulfamate plating process
High speed Nickel plating process producing low stress, ductile nickel deposits.
Integral Dye Series
Color additive for transparent cataphoretic lacquer.
- Liquid concentration
- Easy to use
- Non hazardous
Italchrome DL Q
Decorative hexavalent chrome plating process.
- Excellent throwing power and high rate deposition
- Very good cathode-efficiency (better than 50%)
- High corrosion resistance
Italchrome HC
Process for heavy chromium deposition.
- does not contain fluoride, so the corrosive effect on material is reduced to a minimum
- High wear resistance and high deposition rate
- Excellent distribution and excellent throwing power
JB 100
JM 6000
Kemstrip 41
Electrolytic anodic striper for racks.
- Suitable for all types of metals
- Non-cyanide stripper process with neutral pH
Kemstrip Au 92 P
Immersion stripper to remove gold deposits from copper, brass and nickel surfaces.
- Operates with cyanide at room temperature
- Does not etch base material
- Good stripping rate
Kemstrip Cu 15
Stripper to remove copper deposit from steel and nickel.
- Convenient, ready-to-use solution
- Works at room temperature
- Good stripping rate despite high copper concentration
Kemstrip NI 87
Acid stripper to remove nickel from brass and copper.
- Non-cyanide stripper process
- Removes nickel deposits without etching the metal underneath
Kemstrip NI A-B
Immersion stripper used to remove nickel from iron, copper and brass.
- Cyanide free liquid stripping process
- Removes nickel without etching the base material
- Solid stripping rate
Kemstrip Ni Z
Stripper to remove nickel from zinc die cast as base material.
- Cyanide free liquid product
- Will not etch zinc die cast (even if not well-covered by copper)
- Good stripping rate
Kemstrip SN 60
Acidic stripper removes tin and tin/lead deposits from brass and copper.
- Convenient, ready-to-use solution
- Operates at low temperature
- Good stripping rate
- Removes tin-lead deposits from PCB without etching copper
LevelTech
Mark 20 L
Blackening process by chemical dip
- Velvet appearance
- Suitable for copper
- Easy to brush
Mark 25 S
Green copper color at room temperature.
- Antique natural copper
- Suitable for copper and copper alloys
- Suitable for furniture accessories
Mark 350 P
Immersion coloration
Powdered product for antique bronze color
Mark 511
Chemical dip process for bronze color.
- Easy to use for copper, copper alloy and nickel
- Stable color
- Easy to brush
MARK 5333
Blackening process for iron, steel and cast iron.
- Operates at room temperature
- Produces black finish equal to obtain with the conventional black oxides processes
- Good corrosion resistance
Mark 833
Immersion coloration
Chemical dip process for blackening brass.
Mark A 380
Blackening solution for aluminum.
- Operates at room temperature.
Mark SS 73
Blackening process for stainless steel.
- Operates at room temperature
Metasu Lubrus CE 1
Water based chrome free clear top coat agent.
- Suitable for usw with both immersion (dip/spin) and spray applications
- High corrosion resistance and consistent total friction coefficient
- Reduces fitting failures caused by excessive coating
- Produces uniform and bright finishes without iridescence
Metasu Lubrus Ke 1
Water-based chrome free black top coat agent.
- Suitable for use with both immersion (dip/spin) and spray applications
- High corrosion resistance and consistent total friction coefficient
- Reduces fitting failures caused by excessive coating
- Produces uniform and bright finishes without iridescence
MX-5
MX8-M
Oromerse MN
Am immersion gold deposit to produce a pure gold finish over a nickel substrate. Deposits are fine grain, with extremely low porosity.
- Fine grain low porosity deposit
- High tolerance for metallic contamination of copper, nickel and lead
- Sufficient thickness to maintain solderability
Oromerse SO
Oromerse SO is a cyanide free pure gold immersion deposit. Process plates up to 20 micro inches over nickel and electroless nickel.
- Non-cyanide immersion gold deposit
- Plates up to 20 micro inches over nickel and electroless nickel
Orosene 80 RC
Hard Gold For Deep Tank Application
Industry standard in hard gold products. Excellent distribution with consistent high yields. Compatible with aqueous resists. High efficiency reduces plating time.
Orosene 990
Hard gold for rack and barrel application
Industry standard for hard gold products. Excellent distribution with consistent high yields. Compatible with aqueous resists. High efficiency reduces plating time.
Orosene 990 HS
Hard gold for high speed applications
Very high efficiency, high speed bright plating solution. The solution can be operated at low gold concentrations and at temperatures to 150 F, providing high plating rates with excellent deposit distribution.
Orosene 999
Decorative hard gold
Hard Gold 24K--Type I, II Grade C designed for both rack and barrel operations.
Orostrike C
Gold strike for base metals.
Acid gold strike with excellent adhesion on most base metals, particularly electroplated nickel. High contamination resistance.
Orotemp 24
Pure gold
Neutral gold plating solution, 24 K deposit.
Orotherm HT
Hard gold
Technical gold plating process, gold/nickel alloy.
PAC
Pallaspeed
Pure palladium plate
Rhodium-look finish - lower costs. Can be deposited directly on copper, nickel alloys without a strike.
Pallaspeed 990
Palladium plating process
Chloride-free, low ammonia palladium plating process designed to produce highly ductile palladium deposits.
Pallaspeed D
Palladium plating
Cobalt alloy based, electrolytic palladium process for decorative applications.
Pallaspeed DW
Bright palladium plate
Rhodium-look finish - lower costs can deposit directly on copper, nickel alloys without a strike.
Pallaspeed S
Pure Palladium For Deep Tank Applications
Pure palladium process engineered for compatibility with aqueous dry film. Wide current density and metal concentration range. Typically utilized where better chemical resistance is required like in deep well applications.
Pallaspeed VHS
High speed pure Palladium plating process based on Palladium ammonium chloride.
Bright deposit. Deposits exhibit good ductility and moderate stress.
Pallaspeed VHS D
Palladium plating process suitable for all decorative purposes.
- Produces pure and brilliant deposit
- Neutral operating pH
PAM
Pd-AR
Platinum AP
Electrolytic hard platinum
PLATINUM AP is an electroplating process which deposits a hard platinum coating from a neutral pH bath and is highly recommended for industrial applications. The deposit exhibits excellent adhesion to most metal substrates.
Post Dye Series
Coloring for cathodic electrophoretic coatings.
Coloring for cathodic electrophoretic coatings.
Protex 65
Copper and alloy passivation
Chrome free, organic passivation suitable for all the copper alloys
Protex 73
Antirust for steel
Dryer and antioxidant for steel and cast iron.
Protex 87
Protective oil
Protective emulsifiable oil, excellent after blackening conversion or on parts must be lubricated.
Protocote 112
Protocote SPN
Remova 1700
Additive for Al alloy
Difficult pickling and silicates removal.
Remova 2011
Pickling agent for Fe
Acid pickling additive for welds.
Remova 2044
Pickling agent for gold
Oxide remover and pickling additive, suitable for ultrasonics.
Remova 2055
Additive for dipping
Supporting additive for pickling solutions and degreasers.
Remova 3021
Pickling agent
Pickling, antioxidant and activator for silver
Remova 303
Pickling agent for stainless steel
Pickling agent for stainless steel
Remova 5122
Additive for cleaners
Alkaline, chemical and electrolytic surfactant agent.
Remova 8068
Pickling for zamak
Pickling and degreasing action.
Remova 8070
Additive antifume
Antifume additive for alkaline zinc electrolytes and acid pickling solutions.
Remova 95
Neutralizing agent
Neutralizer. Sulphuric acid alternative.
Remova 97
Neutralization agent
Neutralizer for silver plated parts with cyanide based electrolytes.
Remova RA
Varnish stripper
Stripper for varnish non-etching. For silver, black nickel and aluminum substrates.
Remova RH
Varnish stripper
High speed stripper for removing epoxy paints.
Remova RY
Varnish stripper
Stripper for removing synthetic coatings.
Removel 155 IT
Liquid cleaner, strongly alkaline specific for electrolytic degreasing of ferrous material. Can be used in cathodic and anodic phase in both rack and barrel systems.
- Very low foaming surfactants that increase the wetting effect and produce a very controlled and reduced foam on the surface
- Contains complexing agent that increases the efficacy of the bath, extends bath life, and allows use even with hard water
- Reduced gas fumes
Removel 175 F
Brass, copper, zamak, bronze
Electrolytic alkaline cleaner usable in anodic and cathodic phase
Removel 555
Brass electrolytic cleaner
Cathodic and anodic degreaser
Removel SW 15
Alkaline liquid concentrated cleaner suitable for cleaning of iron, steel, cast iron, copper and copper alloys.
- Reduced amount of product in stick, decreased processing costs
- Decrease the amount of waste
- Does not emit corrosive fumes or dangerous, unpleasant odors.
Removel T 11 L
Versatile liquid cleaner
Processing oil removal. Phosphate€“ free liquid.
Removel T 11L
Base concentrated alkaline phosphate-free cleaner suitable for cleaning of iron, steel, cast iron, copper and copper alloys.
- Does not make foam and has the capability to remove dirt rapidly to avoid deposition on the walls of barrels and tanks
- Does not separate oily from sticky residues
- Avoids the formation of complex salts with metals
Removel Techno 65
Cleaner for steel
Cathodic degreaser with flocculating action
Removel Techno 66
Cleaner for steel
Non-foaming cathodic and anodic degreaser
Remover 111
Cleaner for brass and steel
Buffing compound removal
Remover 122
Cleaner for brass
Buffing compound, buffing oil and grease removal
Remover 133 IT
Cleaner for steel
Buffing compound and buffing oil removal
Remover 16 LQ
Liquid cleaner
Buffing compound and processing oil removal
Remover FDN 26
Liquid cleaner
Liquid cleaner with low foam for spray, ultrasonic and system with air agitation
Remover PB
Powder cleaner
Buffing compound and buffing grease removal
Remover Techno 13
Powder cleaner
Buffing oil and buffing compound removal with flocculating action.
Remover Techno 14
Cleaner for steel
Oil removal, also non-saponifiable type.
Remover Techno 33
Cleaner's additive
Buffing compound and oil removal
Remover Techno AL 32
Acid liquid soak cleaner for aluminum alloys, that permits to avoid the use of alkaline detergents that generally corrode and blacken the surface previously buffed.
- Can be used in ultrasonic equipment
- Reduce production cost
- Easy to handle
Remover Techno Solvit
Soak cleaner
Low alkalinity liquid degreaser with deoxidizer.
RH 221 D
RH 221 E
Rhodium IT 2
Rhodium plating process for decorative purposes.
- Produces a bright white deposit with low or high thickness
- High throwing and leveling power
- Simple to use
- Very stable process
Ruthenium AK
Alkaline ruthenium plating
Ruthenium dark process, good also for barrel application
Ruthenium-U
Ruthenium plating process.
- Produces resistance and bright deposit.
- Supplied in two versions: dark grey and white
Shedar 30
Alkaline zinc/nickel electroplating process. Suitable for barrel and rack applications.
- Produces brightness deposit 12-18% alloy
- Excellent leveling and penetration
- Excellent conversion coating properties (silver and black) after plating, that produce excellent corrosion resistance.
Silver Cyless II
Rack and barrel plate
Non-cyanide, semi-bright to bright silver plating process.
Silver Cyless II W
Rack and barrel plate
Mirror bright silver with excellent wear resistance.
Silver IT 2
Sliver semibright
Electrolytic silver plating process for industrial applications, potassium cyanide based, semi-bright deposit.
Silversene
Bright silver
Electrolytic silver plating process, sodium cyanide based producing a bright deposit for decorative and heavy duty purposes.
Silversene DW
Potassium cyanide based electrolytic silver plating process that produces mirror-bright ductile silver deposits.
- Ideal for all decorative applications
- Consistent high purity deposits
- Excellent throwing power
Silversene M
White, bright silver
Electrolytic silver plating process, potassium cyanide based, mirror-bright deposit.
Silversene ST
Silver high thickness
Electrolytic silver plating process, sodium cyanide based, bright deposit for decorative and heavy duty purposes.
Silvertek L
Pure silver plating process with organic brightener for decorative applications.
- Mirror bright deposit
- Finish is tarnish-resistant as plated
Sirio 1000
Acid zinc electroplating process based on potassium chloride. Ideal for barrel and rack applications. Useable at high temperatures (up to 45°C).
- Process free of toxic and flammable substances
- Produces uniform deposits with excellent brightness
- Excellent throwing power and good ductility
- Process suitable on cast iron and hard steel
Sirio 600
Versatile potassium chloride zinc plating process boron free. Ideal for barrel applications.
- Better adhesion property in conversion treatment than conventional brightener
- Good compatibility with trivalent conversion coating
- Particularly excellent with trivalent back
Solder Strip JA
Stannomerse
Bright tin, solderable immersion tin deposit for both decorative and industrial applications.
- Low cost acid immersion tin
- Superior brightness
- Easily solderable coating
- Ideal for industrial and decorative hardware
Starlux 30
Very bright nickel brightener
Unique, universal brightener for rack and barrel applications.
Starlux 50
Strong and very bright nickel brightener
Unique, universal brightener for rack and barrel applications.
Surfalat
Brass plating
Decorative electrolytic brass plating process.
Tarniban
Silver and copper
Thin colorless film with good resistance to corrosion with improved solderability and no effect on electrical performance.
Tarniban 118 (TC)
Post treatment for tin
Anti-discoloration during storage, thermal, heating & reflow conditions. Furthermore, matte tin deposit will not be melt after reflow.
Tarniban 2000
Copper and alloy passivation
Chrome free, metallic Passivation suitable for all the copper alloys.
Tarniban 2000
Copper and copper alloy anti-tarnish
Chrome free, metallic passivation suitable for all copper alloys
Tarniban 51
Chrome free antioxidant and anti-tarnish for silver, copper and its alloy surfaces.
- No detrimental effect to electrical properties or solderability
- Resist 96 hours to test UNI EN 4611
- Meets MIL specifications QQS-365A
Tarniban 51
Silver anti-tarnish
Metallic, chrome free passivation, good prior to painting
Tarniban 59 (TC)
Post treatment for tin and nickel
Recommended for protection of metal surfaces subjected to post plate salt spray corrosion testing (See ASTM B117). This product has been demonstrated to be effective on nickel, tin and thin gold deposits used in connector applications.
Tarniban 60
Post treatment for silver
An inorganic coating designed to improve the tarnish resistance and solderability of silver deposits, particularly after dry heat thermal exposure. Recommended for rack, barrel, and high speed reel-to-reel applications.
Tarniban C48
Post treatment process for tin and tin alloys
Specifically designed for use on tin and tin alloy deposits which are subjected to post-plate thermal exposure in high humidity/steam environments. For optimal results, Tarniban® C48 should be used in combination with Technic PST.
Tarniban C48 / C50
Tarniban C50
Post treatment for tin, tin alloys
Provides protection of tin and tin alloy deposits from discoloration following exposure to high humidity/steam environments plus dry thermal exposure (reflow/oven bake).
Tarniban D
Silver anti-tarnish
Perchloroethylene and chrome free passivation agent and antioxidant
Tarniban E
Post treatment for silver
Recommended for minimization of epoxy bleed-out without adversely affecting downstream assembly operations such as wire bonding and die attach.
Tarniban E260
Post treatment process for tin and tin alloys
Protects tin deposits from oxidation and discoloration following post-plate high temperature dry thermal exposure. Optimum results when used in combination with Techni Nickel TS. Recommended for rack, barrel and high speed application.
Tarniban KS II
Chrome free antioxidant and anti-tarnishing post treatment for silver surfaces.
- Excellent resistance to sulphide tarnishing
- Contact resistance values are extremely low 20-90 michroms/in2 at 200 PSI contact pressure
- No change in physical appearance after 300 hours of exposure to 95% R.H. and 32ºC
- Meets MIL specifications QQS-365A
Tarniban LED
Post treatment for LED Silver.
For use with Techni Silver LED and LED HS to retain brightness and reflectivity after long term storage and/or high temperature exposure.
Tarniban TS
Anti-corrosion / anti-discoloration post-treatment process for silver
Techniseal is a cathodic electrolytic passivation system that provides a transparent nano-scale, protective coating on silver which to improves corrosion resistance and minimizes appearance degradation. Techniseal protects silver from tarnishing during exposure to heat and/or sulfur corrosion testing.
TEC 1001
Electrolytic cleaner
Highly conductive electro-cleaner for removal of light oxide, oils and light buffing. Excellent risibility and wide temperature range.
TEC-1010
TECHNI 8085
Blackening for Electroless Nickel
Blackening solution for Electroless Nickel deposits
Techni Acid Gold Strike
Gold bath for stainless steel
Acid gold strike process guaranteeing a perfect adhesion. Wood Nickel treatment can be avoided.
Techni Acid Salt TAS-1
Powder acid activator for steel, brass, copper and passive nickel.
Non-flouride blend of dry acid salts for pickling metals prior to electroplating. Replaces mineral acids such as sulfuric and hydrochloric acid. Used to activate all base metals.
Techni Acid Salt TAS-3Z
Powder acid activator for zinc die cast, leaded brass, beryllium copper, aluminum, nickel, silver, tin, lead.
Blend of dry acid salts with flouride used for pickling metals prior to electroplating. For nickel alloys, copper, and brass activation. Similar to TAS-1, but more aggressive for hard-to-activate surfaces.
Techni ACT 100
Techni Act 909
Descale
Single component copper descale. Suitable for C 7025
Techni ACT 9600
Techni Alkaline BN Cleaner
Techni Alkaline BN Cleaner is an all-purpose, phosphate-free, alkaline cleaner for both ferrous and non-ferrous base materials. This product can be used for direct, reverse and soak cleaning.
- All-purpose for both ferrous and non-ferrous metals
- Phosphate-free
- Highly effective as soak or electrolytic cleaner
Techni Alkaline Zincate
Techni Aqua Shed-1
Techni Brown Gold
Decorative gold
Acid gold plating process producing dark brown color deposits.
Techni BT 1000
Techni BT2
Low speed bright Tin
Sulfate based electrolytic tin plating process, bright deposit. Suitable for rack and barrel applications
Techni Buff Solv
Soak or ultrasonic for copper and brass
Concentrated alkaline liquid cleaner for removing buffing compounds, tarnish and oxides from copper and brass.
Techni Buffer IG
Product replaces boric acid in nickel bath (sulfate base, sulphammate and Goldeneye)
Easy-to-handle liquid form. Aids in reducing brighteners additive in replenishment. According to Reach Regulation is not listed in SVHC boric acid.
Techni Chemical Deflash 38
Techni Chemical Deflash LT
Techni Chemical Deflash LT 88
Techni Copper ACP
Techni Copper C
Semi-bright cyanide copper strike
Semi bright strike process. Recommended for difficult to plate metals.
Techni Copper LUX
Acidic electrolytic copper plating process.
- Produces micro-bright, micro-pitting free and ductile deposit
- High thickness and excellent corrosion resistance
- Can be used with cathode agitation or air insufflation as well
Techni Copper P
Techni Cu 2300
Acid copper electroplating process designed for printed circuit board and reel-to-reel applications.
- Specifically engineered to produce bright and even deposits from a stable electrolyte
- High purity and fine grained equiaxed deposits
- Economical to use
Techni CU 2800
Techni CU 85
Remove the substrate defect
Aggressive etchant for copper that has a long life and high copper capacity. Used to deoxidize/activate copper based parts prior to electroplating.
Techni Cu No Dyes
Dye free acid copper plating bath, producing a bright deposit.
- Stable process
- Very bright
- Excellent throwing power
Techni CU Satin
Electroplating process that produces a smooth satin deposit.
- Provides a fine grained, equiaxed high purity and ductile deposit
- Specifically engineered for plating uniform satin, even deposits from a stable electrolyte
- Economical solution with only one additive to manage
Techni Electro Deflash #4
Techni Electro Deflash #4 Conc
Electrolytic Deflash
Low operating temperature. Highly alkaline (pH >12). Low cost.
Techni Electro Deflash PL (3X)
Techni Electro-Deflash PL
Electrolytic Deflash
Mildly alkaline solution designed to remove bleed and mold flash from plastic semiconductor packages electrolytically.
Techni EN 1500
Techni EN 2600
Techni EN 2600 SB
Techni EN 3500
Techni EN 3500 TF
High phosphorous electroless nickel process designed to deposit a uniform, nickel phosphorous composite alloy with ultra-fine PTFE particles.
- Low coefficient of friction deposits
- Excellent release resistance and corrosion resistance
- Meets MIL-C-26074E, AMS 2404 C and AMS specifications.
- ELV, RoHS and WEEE compliant.
Techni EN 4100
Alkaline electroless nickel. Ideal for aluminum surfaces.
- Excellent brightness
- Exceptional stability
- High tolerance to impurities
Techni EN 5300
Low phosphorous, bright electroless nickel deposit.
- Produce compressive stress hard deposit
- Excellent corrosion resistance in alkaline environments
- Excellent hard deposit with good wear resistance
Techni EN 6000
Medium 'phos'
Bright medium phos, self regulated
Techni EN 6500
Medium phosphorous electroless nickel, provides bright deposits.
- Lead and cadmium free
- Consistent rate plates
- Meets MIL-26074B, AMS 24043 and AMS 2405 specifications
- ELV, RoHS and WEEE compliant
Techni EN 8200
Techni EN 8380
Techni EN 9155
High phosphorous content electroless nickel, provides semi-bright and non magnetic deposit.
- Self-regulating pH bath
- Excellent corrosion resistance (with a thickness of at least 25 µm it resists 1000 hours to salt spray test ISO 9227)
- Meets the 26074-D and AMS 2404-B Military specifications
Techni EN 9500
Electroless nickel for plastic
Two component, low working temperature electroless nickel.
Techni EN AT 5600
Techni EN AT 5600 is an advances mid-phosphorus electroless nickel used in industrial plating. The process is uniquely formulated to minimize the buildup of by-products giving it a dramatically longer bath life. Can be used with ENIG and ENEPIG processes.
- Better lateral growth yielding better corrosion resistance
- Excellent solution stability
- Phosphorus between 6-9% w/w
Techni EN Strip 1700
Electroless nickel stripper
Non cyanide alkaline stripper designed to remove electroless or electrolytic nickel from copper.
Techni EN Zincate
Cyanide free zincate process for the pretreatment of aluminum and aluminum alloys. Removes aluminum oxide and applies a thin immersion film of zinc on the surface that can be electroplated.
- Promotes excellent adhesion of electroplated and electroless process
- Cyanide free process. Reduce the costs of waste treatment
- Uniform zinc coating on complex parts
Techni Gold 1020C (EG)
Cobalt hardened gold process
Cobalt-hardened gold plating process with high cathode efficiency and good thickness distribution. Lower operation cost.
Techni Gold 1020C (HH)
Cobalt hardened gold process
Cobalt-hardened gold plating process with high cathode efficiency and good thickness distribution. Anti-gold immersion.
Techni Gold 1020C (HS)
Cobalt hardened gold process
Cobalt-hardened gold plating process with high cathode efficiency and good thickness distribution.
Techni Gold 1020N (HS)
Nickel hardened gold process
Nickel-hardened gold plating process with high cathode efficiency and good thickness distribution.
Techni Gold 300
Nickel hardened gold plating process
High performance nickel hardened gold plating process for low speed, high speed, and selective applications. Very tolerant to metallic contamination.
Techni Gold 300R
Nickel hardened gold plating process
General purpose, nickel hardened gold plating process for connector applications.
Techni Gold 400
Cobalt hardened gold plating process
High performance cobalt hardened gold plating process for low speed, high speed, and selective applications. Very tolerant to metallic contamination.
Techni Gold 400R
Cobalt hardened gold plating process
General purpose, cobalt hardened gold plating process for connector applications.
Techni Gold 434
Gold plating process
Acid pure gold plating process designed to produce a gold electrodeposit of 99.9+% purity in rack and barrel electroplating applications for devices used in the semi-conductor, electronic, and PWB industries where high purity gold deposits are required.
Techni Gold 434 HS
Pure gold plating process
434 Acid Pure Gold process is designed to produce a gold electrodeposit of 99.9+% purity for devices used in the semi-conductor, electronic, and PWB industries where high purity gold deposits are required to meet wire bonding requirements.
Techni Gold 800
Nickel hardened gold plating process.
Gold plating process using pulse plating technology to produce low-porosity deposits in electronic component and connector applications.
Techni Gold 900
Cobalt hardened gold plating process
Gold plating process using pulse plating technology to produce low-porosity deposits in electronic component and connector applications.
Techni Gold Barrel 850
Nickel hardened barrel gold plating process
Gold plating process designed to minimize porosity in electronic component and connector barrel plating applications.
Techni Gold Flash 850
Nickel hardened flash gold plating process
Gold plating process recommended for a highly uniform 2 - 5 microinch flash gold over nickel, palladium and palladium nickel alloys.
Techni Gold Flash 950
Cobalt hardened flash gold plating process
Gold plating process recommended for a highly uniform 2 - 5 microinch flash gold over nickel, palladium and palladium nickel alloys.
Techni Gold Strike SS
Techni HCL Electrolytic Solder Strip
Techni IM Gold AT6000
Immersion gold
Self limiting immersion gold bath for optimum solderability.
Techni IM Gold AT8000
Techni JA Solder Strip
Single-step solder stripper
Immersion solder strip for removal of solder from Copper substrate (peroxide/fluoride base).
Techni M-16 Tin-Lead Stripper
Techni Matte Tin Sulfate 89TI
Techni MSI CuCN Bright Copper Cyanide
Techni Neutralizer E-260
Techni NF 800 HS
Techni NF BT2
Techni NF JB 3000
High speed bright tin plating process. MSA based electrolyte.
Bright, whisker resistant pure tin based on MSA. Satisfies all requirements of JEDEC JESD 201.
Techni NF JB 3400
Techni NF JB 3500
High speed bright tin/lead plating process
Mirror bright 90/10 or 60/40 tin/lead alloy deposits from MSA electrolyte.
Techni NF JM 3000
Techni NF JM 6000
Techni NF JM 6000 LS
Techni NF JM 8000
Techni NF PC6053
Techni NF Tin 400 LA Concentrate
Techni NF Tin 400 LA Concentrate utilizes Grade “A” low-lead tin to create a unique low acid tin methane sulfonate solution that provides benefits in inert anode plating and other applications. Techni NF Tin 400 LA Concentrate enables customers to increase the tin content of the plating solution during bath replenishment without increasing the acid concentration. It can be used in any Technic tin or tin-alloy plating process that uses tin methane sulfonate. Suitable for high speed applications or where insoluble anodes are used.
- Ideal for closed-loop systems
- Can be used for any MSA tin/tin alloy baths
- Odorless, clear product
- Increase tin content without increasing the acid concentration
- Easy bath makeup and replenishment
- Mitigates MSA Acid Activator
- Less tin usage with longer bath life
- Stable bath cathode efficiency
- Significant cost and labor savings
Techni NF TP-NT
Techni NF TP-NT process is a high speed matte pure tin electroplating process specifically formulated for the continuous strip and wire plating industry. Based on a methane sulfonic acid electrolyte containing a powerful antioxidant that minimizes oxidation of stannous tin. The current density range of the process is exceptionally wide, which allows the strip/wire line operator to maintain a low tin concentration in the plating bath without sacrificing line speed. Deposits have a lustrous matte to semi-bright finish, and are uniform in appearance at all usable current densities.
- Exceptionally wide current density range
- Deposits exhibit excellent visual deposit uniformity across the entire current density range
- Non-foaming electrolyte
- Operation at elevated temperatures up to 55°C
Techni Nickel HT-2
Sulfate Nickel For High Aspect Ratio Deep tank Operation
For high aspect ratio applications over 10:1 aspect ratio and holes sizes below 18 mils. Will dramatically improve throwing power compared to sulfate or sulfamate chemistries.
Techni Nickel S
Techni Nickel SE
Techni Nickel TS
Techni NiPhos 611
Techni NPD P4
Decorative gold
Alkaline, gold/copper alloy based, gold plating solution producing pink color deposits.
TECHNI NPD P6
Techni Pal PF
Palladium/Iron alloy with a bright deposit.
- White deposit
- Cobalt and nickel free
- Useful for fashion when nickel is not an option
Techni PC 75 HS
Techni Pre-dip 470 3X
Techni Silver 1006
Techni Silver 1025
Techni Silver 1028
Techni Silver 1050
Techni Silver Cyless II W
No cyanide bright silver
Cyanide free, electrolytic silver plating process, bright deposit.
Techni Silver Cyless II W Semi Bright
No cyanide semi-bright silver
Cyanide free, alkaline, electrolytic silver plating process, semi bright deposit.
Techni Silver E
Pure silver plating process with metallic brightener for decorative applications.
- Mirror bight deposit
- Hardness as deposited in the range of 140-200 Knoop (25g load)
- Deposit has low porosity
- Better tarnish resistance than pure silver
Techni Silver EHS-3R
Techni Silver HCD
Techni Silver LED
Techni Silver Stripper 3500
Techni Solder NF W
High speed matte/satin pure tin; organic MSA based process; exceptionally wide current density range.
- Non-foaming electrolyte
- Deposits exhibit excellent solderability with low organic co-deposition
- Easily analyzed bath components
- Single component grain refiner
Techni Tarnex
Techni Tin 89T
Techni Tin Lead Clear A Flock
Techni TSC 1500
Cleaner suitable for all metals
Powdered product. Buffing compound, grease and oil removal. For all metals.
Techni White
White bronze
White Bronze electrolytic process with semi-bright finish. Suitable for electronic industry. Sodium matrix.
Techni White EGB
Tri-alloy (Cu, Sn, Zn)Plating
Electrolytic process with brilliant, white finish. Suitable for electronic, decorative, and general purpose applications. Hypo-allergenic deposit.
Techni White Rhodium
Techni White Rhodium- Palladium
Techni White Rhodium-Ruthenium
Techni White V
White bronze
White bronze electrolytic process with bright finish. Suitable for fashion industry.
Techni X-Cell 318
Pattern Plate Pre-clean
Low Cost, Easy to Use, Excellent Cleaning Capability for Heavily Soils and Oxidation
Techni X-Cell 318 LF
TechniBond RM
TechniBrite 3111
Technibrite HT 1000
Technibrite HT 1000 is Technic’s most advanced bright tin process for rack and barrel applications. The process eliminates tin metal growth problems by operating at higher cathode efficiencies and warmer temperatures. With its exceptional low current density bright range, complex geometry parts are uniformly bright in all areas.
- Wide temperature operating range: 20 - 35°C (68 - 95°F)
- Exceptional low current density bright range
- Deposit is whisker mitigated per JEDEC 208 test protocol.
Technic Acid Gold Strike
Technic Antique Gold
Technic Aqua Shed-1
Technic CSP D 130
Technic CU 2300
Technic CU 2800
Technic CU 2900
DC Copper Medium to High Technology
Easy to use, designed for applications requiring high throw. One component concentrated Replenishment.
Technic CU 5300
Technic CU128
Technic CU135
Technic Cyless Silver Strip
Silver stripper
Non-cyanide stripper to remove silver from copper.
Technic Electocleaner 100
Technic Electocleaner 210G
Technic EN AT5600
Technic Envirostrip AG
Electrolytic anodic-current process to remove silver deposits from metallic under-layer as copper, brass and nickel.
- Non-cyanide stripper process
- No etching of the substrates
- Silver is readily recovered
Technic FFP Nickel
Technic FFP Nickel
Technic ISA Copper Oxide
Technic JB Nickel
Technic Microetch 85
Descale
Single component copper descale.
Technic Non-Cyanide Silver Stripper
Technic Palladium Nickel 900 TC
Technic Palladium Nickel AF-LS
Technic Palladium Nickel NFA
Palladium Nickel alloy plating process (70-90% Palladium) containing no free ammonia.
A chloride-free, alloy plating process containing no free ammonia. The deposit finish is semibright to full bright Deposit properties include good ductility and low porosity.
Technic Palladium Nickel VHS
Pd/Ni alloy, semi-bright to bright , 70-90% Palladium
Conventional Pd/Ni plating process, chloride based electrolyte. Capable of depositing Pd/Ni alloys containing 70-90% Palladium.
Technic PC Anti-Tarnish
Technic Predip 470
Technic PST Neutralizer
Technic Rhodium
Technic TEC 1016
Technic TSC 1508-L
Soak cleaner for ferrous and non-ferrous metals
Water based alkaline cleaner concentrate for ferrous and non-ferrous metals.
Technic TSC-1501
Soak cleaner ferrous and non-ferrous metals
Soak cleaner for removal of most grease and oils from ferrous and non-ferrous metal.
TechniCatalyst AT4608
Catalyst for activation of Cu surface for ENIG process
High performance palladium activator for fine features and difficult substrates
TechniClean AT 1000
TechniClean CA25
TechniClean IK73
TechniClean IK73 is a post etch residue removal product that has been specifically targeted for the selective removal of highly-inert chemical residues created during the patterning of high-k dielectric metal oxides based on hafnium, zirconium and tantalum. Compatible with a wide range of metals and dielectrics normally present during high-k patterning, TechniClean IK73 functions at room temperature, is very easily rinsed and is suitable for immersion, batch-spray and single-wafer chemical applications.
- Fast and selective removal of post etch residues created by plasma etching of high-k dielectric materials
- Compatible with aluminum, copper dielectric materials
- Designed for room temperature operation, water rinsable
- Suitable for immersion, batch-spray and single wafer application
Techniclean OH
Electrolytic microetching cleaner for copper alloy.
- Silicates-free process
- Easy to use
- Analyzable
TechniClean SF
Techniclean SF is a non-foaming, silicate free alkaline electrolytic-cleaner.
Techniclean SF is a non-foaming, silicate free alkaline electrolytic-cleaner suitable for the pre-treatment of steel and copper alloy strips in reel-to-reel applications. Techniclean SF is extremely tolerant to base metal contamination/re-deposition.
TechniClean TH1020
Acid cleaner for ENIG & ENEPIG
TechniClean TH1020 is an acid cleaner designed to inhibit electroless nickel from depositing in non-plated through holes (NPTH).
Techniclear 1100
Cathaphoretic lacquer
Cathodic electrophoretic process producing transparent coatings.
TechniENickel AT5000
TechniEtch 1118
TechniEtch 1198
TechniEtch 1688
TechniEtch AC35
Gold/Copper Etchant
The key attribute of TechniEtch AC35 is its capability to optimize a combined gold/copper etching step by controlling the gold layer undercut to a minimum while quickly etching a thick copper layer.
TechniEtch ACI2
Gold Etchant
Iodine based metal etchant for use with selective gold applications.
TechniEtch AT2000
ENIG Pre-clean
Low Cost, High Copper Capacity Compared to Generic Sodium Persulfate.
TechniEtch CN10
TechniEtch HP Stabilizer TC
TechniEtch SLC
Copper Seed Layer Etchant
Highly selective copper seed layer etchant that provides very low feature undercut and minimal metal oxidation of tin or tin/silver.
TechniEtch TBR19
Ti, TiN, and TiW Etchant
Barrier layer remover for WLP applications. Solution provides great process window resulting in minimal to zero undercut while etching both metals.
TechniFlex DRF2000F
Dry film photoimagable coverlay.
Dry film photoimagable coverlay for flexible substrates
TechniFlex LCL 1000F
Liquid Photoimagable SM/Coverlay Film For Flexible Circuits
Superior flexibility while maintaining thermal resistance, 94 V-0 certified and wide color selections.
TechniFlex LCL 1000F/001G
TechniFlex LCL 1000F/110G
TechniFlex LCL 1000F/281S
Blue photoimagable solder mask.
Blue semi-gloss photoimagable solder mask for flexible substrates.
TechniFlex LCL 1000F/410G
TechniFlex LCL 1000F/410M
TechniFlex LCL 1000F/421M Code 06
Black photoimageable flexible solder mask
Enhanced Black matte photoimagable solder mask for flexible substrates with hot bar application
TechniFlex LCL 1000F/421M R2R
Black coverlay film for flexible circuits in roll to roll applications.
Black matte photoimagable solder mask for flexible substrates using roll to roll equipment.
TechniFlex LCL 1000F/421M U6
TechniFlex LCL 1000F/423M U6
Matte black solder mask for flexible applications using direct imaging. For direct imaging/manual exposure for standard cut sheet flexible circuit panel application and roll to roll operation.
High strength material that can withstand extremely high soldering temperatures and multiple bending cycles while still meeting very fine pitch requirements.
TechniFlex LCL 1000F/423M U7
Matte black solder mask for flexible applications using direct imaging. For direct imaging/manual exposure for high multiple layer cut sheet flexible circuit panel and roll to roll applications.
High strength material that can withstand extremely high soldering temperatures and multiple bending cycles while still meeting very fine pitch requirements.
TechniFlex LCL 1000F/423M U8
TechniFlex LCL 1000F/423M U8 Direct Imaging is a liquid, photo-definable, halogen-free, flexible black matte solder mask, specially designed for low exposing energy with recently available high output direct imaging (DI) systems. This DI product exhibits high flexibility and elasticity and is Active Silicone Free. It is resistant to multiple soldering operations and is capable of lead-free soldering/hot bar processing up to 340C.
- Extremely high heat resistance
- Low exposure energy
- Stackable, tack free surface after drying
TechniFlex LCL 1000F/423M U8F
TechniFlex LCL 1000F/423M U8F Direct Imaging is a liquid, photo-definable, halogen-free, flexible black matte solder mask, specially designed for low exposing energy with recently available high output direct imaging (DI) systems. This DI product exhibits very high flexibility and elasticity and is Active Silicone Free. It is resistant to multiple soldering operations and is capable of lead-free soldering/hot bar processing.
- Extremely high flexibility and elasticity before and after baking
- High heat resistance
- Stackable, tack free surface after drying
TechniFlex LCL 1000F/452M
Black direct image soldermask
Low exposing energy black matte flexible photoimagable solder mask for DI application
TechniFlex LCL 1000F/900G
TechniMask ISR 1000
Liquid Photoimagable Solder Mask
Low cost, ENIG compatible.
TechniMask UV SR2
TechniPad 7611
Electroless palladium for ENEPIG
Autocatalytic Pd producing a pure Pd deposit
Technipad AU6100
Immersion gold for ENIG & ENEPIG
High performance cyanide based immersion gold that reduces gold usage and improves solderability.
TechniPad ENEPIG
TechniPad ENIG
TechniPolish 3212
TechniPress Resist 101
TechniPulse CU5300
Techniseal Ag
Transparent nanoscale anti-corrosion / anti-discoloration coating for high-temperature applications
Techniseal Ag is a cathodic electrolytic passivation system that provides a transparent nano-scale, protective coating on silver which to improves corrosion resistance and minimizes appearance degradation. Techniseal protects silver from tarnishing during exposure to heat and/or sulfur corrosion testing.
TechniSol Ag 2460
TechniSol Cu 3000
Acid Copper
Electrodeposition copper process that can be used with Light Induced Plating or conventional electroplating. This bath produces low stress, high conductivity deposits that are ideal for use in a solar cell metal stack application.
TechniSol Ni 2420
Technisol Nickel 2428
Boric Acid Free Nickel Plating
Produces a low stress, semi-bright, ductile, low resistivity deposit for photovoltaic cell metallization from nickel chemistry that does not contain boric acid. Can be used with LIP or conventional electroplating.
Technisol SN 2480
Tin Plating
Tin plating solution specifically formulated for use in the manufacture of photovoltaic cells. Ideal for use as the final step in a nickel, copper tin metal stack. Provides protection to the copper layer from oxidation and provides excellent solderability during module assembly. Can be used with LIP or conventional electroplating.
Technistan Ag
Technistan EP
Technistan HTM SN 4088
Technistan JB 3000
Technistan JM 6000 LS
Technistan JM 7000
Technistan TP
Technistan TP 5000
High speed pure tin process for reel-to-reel continuous strip applications
High speed matte pure tin plating process based on sulfuric acid electrolyte. Offers significant cost advantages vs MSA systems.
Technistan TP W
Reel to reel
Electrolytic Tin sulfate based plating matte ,uniform deposit, with good solderability.
Technistan TP-5000
Technistan TP-W
Technistan W
Wire application
Electrolytic tin sulfate based plating matte ,uniform deposit, with good solderability.
TechniStrip AU
Gold Stripper
Cyanide based gold stripper prepared from dry mix. Removes gold from most base metals.
TechniStrip AU RTU
Gold Stripper
RTU Cyanide based gold stripper. Removes gold from most base metals.
TechniStrip CU XP
Strips copper deposits from stainless steel substrate
An acidic electrolyte specifically formulated to strip copper deposits from stainless steel substrate. It does not contain any hydrogen peroxide, fluoride or boron. The stripper produces very little sludge and is designed for use in immersion stripping op.
TechniStrip EL
Electrolytic process for stripping copper, nickel and tin from titanium or stainless steel plating racks.
The racks to be stripped are made anodic and the plated metal on the racks is dissolved into the electrolyte and subsequently deposited on steel or copper cathodes.
TechniStrip EL-AF
Electrolytic process for stripping copper, nickel and tin from titanium or stainless steel plating racks.
Ammonia-free version of Technistrip EL
TechniStrip ELBS
Electrolytic belt stripper. MSA based.
Specifically designed for efficient stripping of tin, tin/lead and/or nickel deposits from stainless steel.
TechniStrip ELBS - II
Electrolytic Tin Stripper
Removes tin from stainless steel belt. The electrolyte is exceptionally stable & non-hazardous. It does not generate heavy metal sludge. Tin can recovered on the cathode as a metallic deposit.
TechniStrip MLO-07
Stripper for Metal Lift-Off
A highly efficient positive and negative tone photoresist remover used for IR, II/V, MEMS, photonic, TSV mask, solder bumping and hard disk stripping applications. Compatible with Cu, Al, Sn/Ag, Alumina, magnetic alloys and organic substrates such as polymide, Parylene and others. Also very efficient for metal lift off applications.
TechniStrip NF52
Stripper for Dryfilm Resist
Advanced formula that is designed to offer full dissolution with excellent metal compatibility and high loading capacity. Solvent based stripper.
TechniStrip NF90
TMAH Free Stripper
Offers similar performance to TechniStrip NF52. High resin dissolution and excellent metal compatibility.
TechniStrip NI555
Stripper for Advanced AZ EM Resist
Specially formulated to fully dissolve AZ EM advanced line of photoresist: AZ15nXT, AZ40XT, and AZnLOF 2000 series.
TechniStrip NISN
Tin Stripper
Removes nickel and tin from stainless steel substrates. The electrolyte is exceptionally stable & non-hazardous. It does not generate heavy metal sludge. Nickel and tin are recovered on the cathode as a metallic deposit.
TechniStrip P1331
Stripper for Liquid Resist
Solution that has a wide range of applications. It is ideal for use in backend applications like TSV, Cu pillar, bumping, etc. Offers complete dissolution of thick film resist with excellent metal compatibility. Water based stripper.
TechniStrip Silver Special
Sodium cyanide based stripper formulated to chemically remove silver deposits.
- Removes silver deposits from nickel surface, nickel alloy, copper, copper alloys and steel (iron)
- No attack on base metal
TechniStrip® Micro D2
TechniStrip® Micro D2 is a versatile photoresist stripper formulated to address resin lift-off and dissolution of negative and positive tone resist. TechniStrip Micro D2 is an environmentally friendly alternative for NMP, DMSO and DMSO/Amine based photoresist strippers.
- Non-hazardous replacement for NMP
- Lower running cost then NMP
- Improved performance over NMP and DMSO based resist strippers
Techno Magic 11
Versatile nickel brightener
Unique, universal brightener for rack and barrel applications.
Technotan PC
Tin Cobalt
Tin -cobalt plating
Tin-cobalt alloy bath, chrome like finish.
Tin Spray
Top Coat 11
Sealer for conversion
Sealer for zinc plated and passivated surfaces.
Top Coat 14
Sealer agent for zinc and zinc alloy.
- Improves corrosion resistance
- Suitable for use in automotive applications
- Excellent control of friction coefficient
Top Coat IG 21
Sealer agent in water phase for zinc and zinc alloy.
- Improves corrosion resistance
- For use after trivalent or hexavalent chromic passivation
- No residual rainbow stains after drying
Tri-Alloy
TRUSHADE 24 K
TRUSHADE S 7
V-10, 20, 30 series
Oil separator for plating pre-treatment
Plating pre-treatment regeneration and reuse for reduce the chemical usage.
Vega 3000
Acid chloride zinc plating process. Suitable for rack and barrel applications.
- The deposit is exceptionally bright, very fine grained from very low to very high current density
- Non-foaming surfactant system perfectly suited for high agitation/high current density plating
- Additives offer a very high cloudy point to provide excellent tolerance to high bath temperature
Vega 5 RS
Cyanide zinc process
Brightener for alkaline, cyanide based, zinc plating process. Very bright finish.
Vega W 28
Acid zinc process
Acid sulphate zinc for reel-to-reel application
Vega ZF 210
Alkaline electrolytic process for deposition of zinc-iron alloy (0.3-0.6% Fe). Suitable for barrel and rack applications.
- Process supplies a black deposit with excellent throwing power
- Deposit compared with conventional Zn offer higher corrosion resistance
- Deposit can be passivated with yellow-iridescent and black passivation
Wonder 11A/B
Trivalent chrome black conversion for zinc and nickel deposits.
- Excellent adhesion property
- Excellent weather resistance
- High corrosion resistance
Wonder 22 AL B
Trivalent chrome blue conversion for zinc and nickel deposits.
- High corrosion resistance
Wonder CFY 1
Trivalent blue chrome, cobalt free conversion coating for acid and alkaline zinc.
- Very high corrosion resistance
- Cobalt free
- Meets SVHC of Reach restriction
- Possible to obtain rainbow coating
Wonder SB 18
Trivalent chromium blue conversion coating for alkaline or acid zinc with or without cyanide.
- Medium corrosion resustance
- Suitable for both alkaline and acid zinc
- Contains cobalt metal
- Adapted to RoHS regulation and does not contain Pb, Cd, Hg, Cr6+, PBB and PBDE
Wonder TR 36
Trivalent blue chrome conversion coating for acid and alkaline zinc.
- Low corrosion resistance
- Produces dip blue deposits
- Good tolerance to iron contamination
Wonder Z 7
Trivalent black chrome conversion coating for zinc deposits.
- Good corrosion resistance
- Suitable for alkaline and acid zinc
- Good scratching
Wonder Z BL 30
Cobalt free trivalent chromium blue conversion for acid and alkaline zinc processes.
- It is considered low corrosion resistance at white rust
- Complaint at RoHS regulation. If not, it contains Pb, Cd, Hg, Cr6+, PBB, and PBDE
Wonder Z BSR
Trivalent chrome based chromate conversion coating of blue, silver (white), and rainbow (iridescent) colors on alkaline and acid zinc.
- High corrosion resistance
Wonder ZA-ZB
Trivalent black chrome conversion coating for alkaline zinc.
- High corrosion resistance
- Produces a black dip color
- Long life solution with good performance