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ENIG and ENEPIG

ENIG & ENEPIG Plating Processes

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ENIG & ENEPIG for PCB Fabrication and Assembly 


TechniPad ENIG and ENEPIG plating processes are next generation solutions in printed circuit board (PCB) manufacturing, engineered to increase first pass yields while reducing costs in both fabrication and assembly. 

Technic's ground-breaking electroless Nickel, electroless Palladium, and immersion Gold formulas offer high fabrication and assembly yields while eliminating corrosion and provide cost savings through superior thickness consistency (even with fine features on high speed laminates), reduced waste generation and reduced precious metal usage. 

TechniPad processes are engineered for advanced fabrication and assembly, yielding excellent wire bond strength, superior solderability and low contact resistance for touch and slide contacts. Whether it's fine pitch assembly on high TG material or high speed applications with tight lines and spaces, only TechniPad can provide the consistency required for today's advanced electronics.

TechniPad ENIG Factsheet Icon

TechniPad ENIG Process

World-Class Acceptance Per IPC 4552 A & B 

TechniPad ENIG is a paradigm shift that eliminates black pad and reduces cost. TechniPad chemistry utilizes unique EN stabilizers and a novel Pd complex to eliminate fabrication issues and dramatically reduce maintenance. In addition, gold deposition is substrate catalyzed, eliminating Ni corrosion, common with typical replacement chemistry. 

View TechniPad ENIG Process Fact Sheet
Technic TechniPad ENEPIG Process

TechniPad ENEPIG Process

High Performance / Easy Operation

TechniPad ENEPIG utilizes unique EN stabilizers and a novel Pd complex to eliminate fabrication issues and dramatically reduce maintenance. In addition, the gold deposition is substrate catalyzed, eliminating Ni corrosion common with typical replacement chemistry.

View TechniPad ENEPIG Process Fact Sheet


Catalyst                                                                             

TechniPad ENIG & ENEPIG Processes: Electroless Nickel on Copper (Cu)

Techni Catalyst AT 4608

  • Sulfate based chemistry with a proprietary palladium complex.
  • Precision catalyst for selective plating of electroless nickel on copper traces and pads.
  • Wider process window for fine spaces eliminates deposition on porous materials like Teflon or polyimide.
  • Reduces cost through longer bath life and lower palladium consumption.
Learn More


Electroless Nickel                                                                             

TechniPad ENIG & ENEPIG Processes: Technic EN AT 5600 Results

Technic EN AT 5600

  • NEW family of organic stabilizers that produce lateral nickel growth on copper.
  • TechniPad process with the Technic EN AT 5600 is the only process that provides a flatter, substantially improved Ni surface for soldering.
  • Unsurpassed in tank stability.
Learn More

Downloadable Files

Electroless Nickel AT5600 - Press Release

Electroless Palladium                                                                            

Gold ball bond

TechniPad PD 7611

  • Extremely stable process engineered to deposit pure palladium over electroless nickel.
  • Consistently produce a wide range of thickness required by wire bonding, touch and or slide contacts.
  • The deposit improves protection for high corrosive environments such as deep well or under hood.
Learn More

Immersion Gold                                                                            

Immersion Gold

TechniPad Au 6100

  • Cyanide immersion gold process operating on a completely novel mechanism of gold reduction in the presence of nickel and TechniPad Au 6100 additive.
  • Ni is not removed from the substrate eliminating all of the corrosion associated with black pad and hyper corrosion found in a typical cyanide based immersion gold process.
  • Pore free deposit with improved solderability and reduced gold usage.

Techni IM Gold AT8000

  • Cyanide free immersion gold bath utilizing a proprietary gold complex.
  • Controlled gold deposit that is corrosion free, thus producing a significantly improved solder spread.
  • Reduced gold usage
  • Eliminates discoloration of white solder mask
Learn More

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  • Applications
    • Semiconductor
      • Chemistry: Fabrication & Packaging Materials
        • Copper
        • Nickel & Tin
        • Precious Metals
        • Photoresist Strippers
        • Metal Etchants
        • Cleaners
      • Equipment: Research & Development
        • Semcon 1000
        • Semcon Fountain
        • Semcon 2000
        • Semcon 2500
      • Chemistry: High Purity
    • Components, Lead Frames, Connectors
      • ECLC Chemistry
        • Connectors
        • Lead Frames/LED Substrate Applications
        • Active & Passive Components
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      • Chemistry
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        • Electrolytic Copper
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        • Microetchants
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      • Equipment
    • Industrial
      • Pretreatment
        • Cleaners
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        • Nickel
        • Tin
        • Silver
        • Copper
        • Zinc (EU Only)
      • Process Chemistry
      • Immersion
      • Post-Treatment
        • Anti-corrosion/discoloration coating
        • Anti Tarnish
        • Passivation
        • Coatings
        • Strippers
      • Equipment
      • Anodizing Equipment
    • Solar
      • Chemistry
      • TechniSol UV-PR
      • Engineered Powder & Flake
    • Decorative
      • Cleaners & Pretreatment
        • Soak Cleaners
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      • Plating Chemistry
        • Gold/Gold Alloy
        • Silver
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        • White Bronze
        • Nickel/Nickel Alloy
        • Copper
        • Palladium/Palladium Alloy
        • Brass
      • Colorings, Coatings, and Paints
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      • Batch Systems
        • Barrels
        • Vibratory
        • SBE Technology
      • Loose Parts Processing Systems
        • Single Piece (MP500)
        • Single Parts (MP300)
        • Selective Pin (CDP2000)
        • Cut Strip (Leadframes)
        • Panels (MP100)
      • Continuous
        • Reel to Reel
        • Roll-to-Roll (MP200)
      • Turnkey
    • Manual Lines
      • Wet Benches/Modules
      • Tank Lines
    • Laboratory and R&D
      • Mini Lines
      • High Speed Reel to Reel Test Cells
      • Wafer Plating Test Cells
    • Anodizing Equipment
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      • Filtration
      • Precious Metal Recovery
      • Rectifiers
      • Tanks & Auxiliary Equipment
      • Ultrasonic and Aqueous Cleaners & Dryers
      • Selective Plating
    • Process
      • Anodizing
      • Electropolishing
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