ENIG & ENEPIG Plating Processes

• Sulfate based chemistry with a proprietary palladium complex.
• Precision catalyst for selective plating of electroless nickel on copper traces and pads.
• Wider process window for fine spaces eliminates deposition on porous materials like Teflon or polyimide.
• Reduces cost through longer bath life and lower palladium consumption.

• NEW family of organic stabilizers that produce lateral nickel growth on copper.
• TechniPad process with the Technic EN AT 5600 is the only process that provides a flatter, substantially improved Ni surface for soldering.
• Unsurpassed in tank stability.

• Extremely stable process engineered to deposit pure palladium over electroless nickel.
• Consistently produce a wide range of thickness required by wire bonding, touch and or slide contacts.
• The deposit improves protection for high corrosive environments such as deep well or under hood.

• Cyanide immersion gold process operating on a completely novel mechanism of gold reduction in the presence of nickel and TechniPad Au 6100 additive.
• Ni is not removed from the substrate eliminating all of the corrosion associated with black pad and hyper corrosion found in a typical cyanide based immersion gold process.
• Pore free deposit with improved solderability and reduced gold usage.

Techni IM Gold AT8000

• Cyanide free immersion gold bath utilizing a proprietary gold complex.
• Controlled gold deposit that is corrosion free, thus producing a significantly improved solder spread.
• Reduced gold usage
• Eliminates discoloration of white solder mask