Highly Effective Desmear Chemistry
Technic supplies a variety of products for the efficient removal of resin and drilling debris and for improved adhesion of the metalization process.
Techni SW 33 is a superior one-component hole conditioner that facilitates rapid, uniform smear removal or etch back when used with Technic Desmear chemistry. Followed by Techni MN 63, this system will increase the hole wall topography and prepare the surface for optimum direct metallization, graphite, and electroless copper adhesion.
Techni SW 43 is an alkali chemistry hole conditioner that facilitates rapid, uniform smear removal or etch back when used with Technic Desmear chemistry. Followed by Techni MN 63, this system will increase the hole wall topography and prepare the surface for optimum Direct metallization, graphite, and electroless copper adhesion.
Techni MN 63 (A solid or L liquid) epoxy etch compound that is used to clear multilayer printed circuit boards of drilling residue prior to metallization. It will promote good adhesion of direct metallization, graphite, and electroless copper coating to the epoxy. It is part of a three-part cleaning cycle; Techni SW 33 or Techni SW 43, Techni MN 63A or L, and Techni MN-66. If properly used, it can produce etch back depths of 0.2 to 0.4 mil. Techni MN 63 will remove and etch back both tetra-functional and normal epoxy material. It will also remove and etch polyimide material from the hole wall of multilayer boards.
Techni MN 66 is a post-etch back neutralizer solution designed to neutralize and clean permanganate residue out of the holes of printed circuit boards. Techni MN 66 insures a well-conditioned hole wall surface that allows for subsequent metallization. When used with Techni GE 70, a mild glass frost will occur. Techni MN 66 contains no ammonium compounds, which makes it easy to waste treat the spent solutions. It does not contain any chloride compounds, thereby helping to prevent pink ring formation.
Glass Etch or Frost
Techni GE 70 is an acidic, dry crystalline powder that is used to frost and etch glass fibers found exposed after the multilayer etch back cycle. It contains a concentrated blend of fluorides developed and designed to ensure the removal of debris and promote good adhesion of direct metallization, graphite, and electroless copper. Techni GE 70 is used after the panels have been etched back and prior to the PTH line. It can also be used to remove drilling debris sometimes left embedded in the slots and holes of printed circuit boards.
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