High Performing Photoresist Removers for Superior Results in Residue Removal and Surface Prep
Technic offers a number of photoresist strippers for residue removal, each with specialized characteristics and benefits, for use in semiconductor fabrication and packaging.
Technic's line of TechniStrip® products for surface preparation and resist stripping provide superior results and consistently high performance with the highest standards of purity. TechniStrip® photoresist removers are environmentally friendly, NMP free, and include no hydroxamine or harsh chemicals.
As with all Technic products, we offer our extensive experience and the unparalleled customer service that has made Technic a respected resource for quality around the globe.
A highly effective NMP free negative tone photoresist remover used mainly for TSV mask and solder bumping applications. Developed to address laminated photo-resins and liquid resins, the novel stripping formulation of this TMAH/DMSO chemistry exhibits high dissolution performance compared to standard TMAH based blends, and very high metal compatibility. The stripping performance has been validated on various laminated films including WBR2010, WBR2100, TOK P50120, etc.
TechniStrip® NF52 provides full dissolution of most photoresist without the use of harmful products such as NMP and Hydroxylamine. NF52 successfully performs without any negative impact to the copper surface, preserving critical fine features that would otherwise be negatively impacted by photoresist strippers that can etch into fine surface details.
Our photoresist is effective and compatible with numerous substrates. TechniStrip® NF52 has been documented to perform with an extended bath life that is typically 2–3 times greater than standard photoresist strippers, resulting in a significant savings in operating costs.
An advanced NMP free photoresist stripper that has a wide range of stripping applications from DUV to thick positive, negative resins and passivation layer reworking. It is especially ideal for use in back end applications like TSV, Cu pillar, bumping, etc. Offers complete resin dissolution of thick film photoresist such as THB 151N, AZ 125XT, OIR 906, SPR 3000, TOK, etc. while maintaining a very high metal compatibility with Cu, Al, Ni, and Sn.
TechniStrip® MLO 07
TechniStrip® MLO-07 is a highly effective negative & positive photoresist remover used for TSV mask, solder bumping, hard disk stripping and metal lift off applications. Developed to address high dissolution performance and high material compatibility such as Cu, Al, Sn/Ag, Alumina, magnetic alloys, etc. TechniStrip® MLO-07 advantages are its process versatility, longer bath life and safer alternative compared to standard TMAH based blends.
Specially formulated to fully dissolve AZ EM advanced line of photoresist: AZ15nXt, AZ40XT, AZ4999 and AZnLOF 2000 series. This resist remover offers high metal compatibility from a DMSO and TMAH free solution.
TechniStrip® Micro NGA II
TechniStrip® Micro NGA II is an organic based resist stripper dedicated to achieving fast, complete resin dissolution and/or lift off of resilient organic films such as rubber-like resin (SC 180, SC420), epoxy, grease, and backlap wax. NGA II does not contain mono and poly hydroxy benzene such as catechol, phenol, chlorinated and/or napthalene based solvents.
TechniStrip® Micro D2
TechniStrip® Micro D2 is an organic mixture designed to address selective resist stripping and negative tone development with high metal compatibility. This lower cost, NMP replacement solution can effectively strip positive resin off with total compatibility on III/V substrate such as GaAs.