Imaging 제품

Black Liquid Soldermask for Flexible Fine Pitch Direct Imaging

• Ideal for demanding assembly conditions
• No cracking – durable and flexible
• Less than 10 microns of undercut
• High resolution
• Superior chemical resistance

TechniFlex LCL 1000F/423M is ideally suited for demanding assembly conditions, including hot-bar soldering or multiple lead-free reflows. Extensive testing of TechniFlex 423M has shown no cracking after multiple 180 degree bends, even when processing 12-micron polyimide substrate.
This product is RoHS compliant and free from bisphenol A, halogen, Sb, Be and phthalate.

TechniFlex LCL 1000F/423M provides exceptionally fine resolution in a matte black product. With less than 10 microns of undercut, TechiFlex LCL 1000F/423M consistently provides high resolution on 50-micron solder dams with excellent chemical resistance to ENIG, ENEPIG, Ag and Sn finishes.

TechniFlex LCL 1000F/423M is available in three versions:

• TechniFlex LCL 1000F/423M U6 - for direct imaging/manual exposure
• TechniFlex LCL 1000F/423M U7 - for either direct imaging/manual exposure or roll to roll coating operations
• TechniFlex LCL 1000F/423M U8 - Next generation black direct image high heat resistance flexible solder mask

TechniFlex LCL1000F/423M U8 Fact Sheet

TechniFlex LCL1000F/423M U8F Fact Sheet

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Liquid photoimageable solder mask/coverlay for Rigid-Flexible circuit panels

• Easily passes industry flexibility testing (10,000x at 180° bending with 1/16 inch mandrel)
• Halogen free and RoHS compliant
• 2 mil resolution capability for today's most advanced technologies
• Excellent Copper, FR4 and Polyimide adhesion
• Passes UL94 V-0 & NASA outgassing specifications
• Meets or exceeds IPC SM 840C, Bellcore TR-NWT-000078, and MIL P55110D specifications
• Colors: Green, Amber, (Other colors are available upon request)

Liquid photoimageable solder mask for rigid circuit panels

• Excellent cosmetic appearance, with a range of colors and surface finishes
• Wide process latitude enabling fine image reproduction with clean PTH/via development
• Resolution capability below 2 mils for ultra fine pitch solder dams
• Superior resistance to all plated surface finishing processes including ENIG, immersion tin and immersion silver
• UL File #E83246, rated 94 V-0 with soldering limits of 20 seconds @ 288°C
• Meets or exceeds IPC SM 840C, Bellcore TR-NWT-000078, and MIL P55110D specifications
• Available Colors: Green, Blue, White, Red, Black, Clear

TechniMask UV-SR2

UV curable Rigid/Flexible solder mask

• Suitable for use on single, double sided, PTH, multilayer PC boards and flexible circuit boards
• No bleed around exposed pads
• Superior resistance to all plated surface finishing processes
• UL File #E83246, rated 94V.0 with soldering limits of 20 seconds @ 260°C
• Meets or exceeds IPC SM-840C, Bellcore TR-NWT-000078, and Mil P55110D specifications
• Colors: Green, Blue, White, Red, Black, Yellow, Clear

TechniMask Brochure

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Protokote SPN

Solvent free single pack thermal cure marking inks

• No VOCs (volatile organic compounds), single component, ready to use
• No mesh drying, no discoloration after curing
• Excellent adhesion to a wide variety of laminates and solder resists
• High definition
• Colors: White, Yellow, Black

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Protokote 112

Thermal cure etching/plating resists

• Alkaline strippable/ 3-7%NaOH at 40-50°C
• High definition/minimizing resist smearing
• Chemically resistant to all acid plating processes
• Resistant to acid etching processes
• Color: Translucent Blue

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