Technic Webinars

Elevate^® Ni 5950 eliminates concerns about process toxicity and low water solubility by being boric acid free and by being comprised of all liquid components, thereby eliminating any solubility issues. Elevate^® Ni 5950 produces nickel deposits equal to or better than deposits utilizing boric acid.

Immersion silver is an excellent choice for 5G, due to its low impact on insertion or signal loss. The challenge is 5G’s mobility requires a finish with superior electrical properties and stability in a variety of environments. TechniPad IS 7070 overcomes this challenge through its unique immersion silver formulation and its use of an organic post-dip.

During this webinar Denis Jacques, Global Product Manager for PWB Products at Technic will discuss why immersion silver is an excellent choice for 5G and review the electrical property requirements needed for stability in a variety of environments. After the presentation there will be a live Q&A session, where Denis will be joined by Matt Sylvestre, Research Chemist.

Two Sessions Available: English and Mandarin

Driving forces of green technology, value generation, and advanced applications in 5G technologies are rapidly changing the technical requirements for electronics finishing. To meet these challenges, Technic has developed a series of chemistries that can address these new requirements and ensure customers are prepared for the next-generation processing of electronic finishing.

This webinar focuses on the following topics:

Environmentally Advanced Products

• Replacement of compounds of concern with more  environmentally responsible materials
• Greener technology – reduced carbon footprint

Emerging Technologies

• High-frequency substrates
• Non-magnetic finishes

Value Generation

• Enhanced functionality and/or replacement of precious metal deposits
• Improved barrier layer technology

Technic's line of TechniStrip^® products for surface preparation and resist stripping provide superior results and consistently high performance with the highest standards of purity. Removal of photoresist is a critical step to today’s wafer-level packaging production. TechniStrip^® photoresist removers are environmentally friendly, NMP free, and include no hydroxamine or harsh chemicals.

Our webinar will review various applications, processing methods and discuss some of the challenges facing production. After the webinar there will be a live Q&A session with Jérôme Daviot, R&D Director - SEC products for Advanced Surface Preparation and Douglas Holmes, Global Business Development Manager at Technic Inc.

This Technic Webinar focuses on the current trends, demands, and challenges in today's post-treatment chemistry. Post-treatment is an essential step in metal finishing, used for further optimizing the characteristics of your electroplated materials. Post-treatment solutions, like anti-tarnish and passivation, provide clear benefits, such as better solderability and higher corrosion resistance, among others. The webinar presents some of our best post-treatment solutions and covers post-treatment options for prevention and protection of:

• Tarnishing Discoloration
• Oxidation
• High Humidly and Steam
• Dry Heat
• Corrosive Environments

As 5G implementation rolls out, the demand for greater speeds and higher frequencies brings significant challenges for Printed Circuit Boards manufacturing. Our webinar will explain the technology behind these challenges and try to present a clear understanding of what the current range of final finishes has to offer fabricators, assemblers, and OEM Designers.

This webinar was focused on solutions for the semiconductor industry. The Elevate^® Gold 7990 NBV process produces pure, soft gold deposits while operating at a slightly acidic pH, making it compatible with almost all photoresists. It produces a bright deposit without the use of harmful grain refiners like thallium and arsenic. The process provides excellent coplanarity and step coverage and can be used in several different plating applications (thicknesses ranging from 0.5 - 100 microns) without major modifications to the solution, and on a variety of toolsets.

Two Sessions Available: English and German

Technibrite HT 1000 process has an exceptional low current density bright range, even when the plating bath temperature and tin concentration parameters are higher than normal. This bright acid tin process can run without a chiller or at temperatures as high as 35˚C, and with tin concentrations as high as 60 g/l. Cathode efficiencies of up to 90% are achievable for Technibrite where the industry standard of leading competitors is only 60—70%. Cycle times can also be significantly reduced thereby increasing the productivity of the plating line by as much as 50%.

Three Sessions Available: English, Italian, and German

Techni Buffer IG, a new boron-free pH buffer for nickel electroplating applications. The demand for boron-free chemical products is steadily growing, especially in Europe, where boric acid has been included in the SVHC list as a dangerous, reprotoxic substance. Techni Buffer IG, designed for both general metal finishing and decorative applications, has been developed to address the growing demand for a boron-free, high-performance nickel process.