Technic’s Semcon 2000 expands on the success of the Semcon 1000, a single process manual electroplating tool, by providing customers with a multiprocess version offering more options for system layout and configurations. Because of its modular construction, the customer can customize the tool to incorporate all required components needed for specific applications. The system can incorporate multiple cleaning, electroplating, rinsing, and other chemical processing all within an easy-to-manage tool that can accommodate any size and shape wafer to 200mm.