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final finishes

PCB Final Finishes

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Final Finish Solutions for PCB Applications


Technic is well established as a worldwide leader in Final Finish Solutions for printed circuit board applications, as well as connector, lead frame and semiconductor applications. Technic is a major supplier of precious metals, tin and tin alloyed products that are used to preserve, as well as enhance, soldering and bonding through all levels of interconnection. Technic products are formulated to meet the highest industry standards, provide cost savings, and reduce environmental footprints. 

                                                                                                    

ENIG ENEPIG

TechniPad ENIG & ENEPIG

  • Precise activation
  • Non-cyanide immersion gold
  • Stable electroless palladium
  • Flat electroless nickel deposit
Learn more

                                                                                                    

Immersion Silver

Immersion Silver - Argentomerse NC

  • Cyanide and Nitrate free
  • Excellent uniformity
  • Proprietary silver complex

Unlike most immersion silver processes on the market, the Argentomerse NC Process is both cyanide and nitrate-free. It will deposit approximately 0.125 microns (5 uin) of silver per minute on copper and copper alloys. Argentomerse NC is slightly alkaline and, unlike acid processes, the deposition of silver from Argentomerse NC is controlled, yielding more uniform silver thicknesses over a wide range of PCB designs. Argentomerse NC has a wide tolerance for chloride and does not require a pre-dip or DI water rinsing prior to the immersion silver bath.

Learn More

Downloadable Files

Argentomers Press Release
Optimizing Immersion Silver Chemistries For Copper
Immersion Tin

Immersion Tin - Leveltech

Technic's Leveltech is an immersion tin process with a metallic additive which helps promote solderability and inhibit whisker growth. Leveltech is a direct alternative to HASL and ENIG; it deposits a thickness of between 0.7 and 1 micron of planar tin. The deposit is ideal for subsequent soldering and will withstand up to three thermal cycles.

  • Inhibits whisker growth
  • Consistent, uniform coating thickness
  • Extended storage, up to 12 months
  • Multiple thermal exposures without decreased solderability
  • Compatible with flux products including no-cleans
  • Short process cycle
  • Ideal for press fit connections
  • Economical to use

 

Learn More

Downloadable Files

Leveltech Technical Information

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  • Applications
    • Semiconductor
      • Fabrication & Packaging Chemistry
        • Copper
        • Nickel & Tin
        • Precious Metals
        • Photoresist Strippers
        • Metal Etchants
        • Cleaners
      • High Purity Chemistry
      • Equipment: Research & Development
        • SEMCON 1000
        • SEMCON Fountain
    • Components, Lead Frames, Connectors
      • ECLC Chemistry
        • Connectors
        • Lead Frames/LED Substrate Applications
        • Active & Passive Components
      • ECLC Equipment
    • Printed Circuit Boards
      • Chemistry
        • Final Finishes
          • ENIG & ENEPIG
        • Electrolytic Copper
        • Electrolytic Nickel & Precious Metals
        • Metallization
          • Graphite
        • Microetchants
      • Imaging Products
      • Process Control - EBA
      • Equipment
    • Industrial
      • Pretreatment
        • Cleaners
        • Activators
        • Etchants
      • Electrolytic Plating
        • Nickel
        • Tin
        • Silver
        • Copper
        • Zinc (EU Only)
      • Electroless Plating
      • Immersion
      • Post Treatment
        • Anti Tarnish
        • Passivation
        • Coatings
        • Strippers
      • Industrial Equipment
      • Anodizing Equipment
    • Solar
      • Deposition Chemistry
      • Plating Resist for Solar
      • Engineered Powder & Flake
    • Decorative
      • Pretreatment
        • Soak Cleaners
        • Electrolytic Cleaners
        • Pickling Solutions
      • Plating Chemistry
        • Gold/Gold Alloy
        • Silver
        • Tin/Tin Alloy
        • White Bronze
        • Nickel/Nickel Alloy
        • Copper
        • Palladium/Palladium Alloy
        • Brass
      • Coatings & Coloring
        • Cataphoretic Lacquers
        • Color Treatments
      • Post Treatment
      • Glass Etching
      • Equipment
    • Medical
      • Chemistry
      • Equipment
    • 3D-Printing
      • Chemistry
      • Equipment
    • Application Support
      • Application Guides
      • Application Notes
  • Chemistry
  • Equipment
    • Automated Systems
      • Hoist Systems
        • Cantilever/Sidearm
        • Rail/Rim Runner
        • Overhead Hoist
        • Hoist Automation
        • Hoist Retrofits
      • Batch Systems
        • Barrels
        • Vibratory
        • SBE Technology
      • Loose Parts Processing Systems
        • Single Parts (MP300)
        • Selective Pin (CDP2000)
        • Panels (MP100)
        • Cut Strip (Leadframes)
        • Finger Plater (FFP)
        • Single Piece (MP500)
      • Continuous
        • Reel to Reel
        • Roll-to-Roll (MP200)
      • Turnkey
    • Finishing Equipment Supplier
      • Advanced Engineered Systems
    • Manual Lines
      • Wet Benches/Modules
      • Tank Lines
    • Laboratory and R&D
      • Mini Lines
      • High Speed Reel to Reel Test Cells
      • Wafer Plating Test Cells
    • Parts, Supplies & Accessories
      • Consoles, Work Stations, Hoods, Benches & Tables
      • Mazerustar Planetary Mixers
        • Demonstration Videos
      • Amp Hour Meters, Timers & Chemical Feeders
      • Anodes, Baskets, Bags & Hooks
      • Filtration
      • Precious Metal Recovery
      • Rectifiers
      • Tanks & Auxiliary Equipment
      • Ultrasonic and Aqueous Cleaners & Dryers
      • Selective Plating
    • Process
      • Anodizing
      • Electropolishing
  • Engineered Powders
    • Products
    • Global Representatives
    • Equipment
      • Conductivity Test Apparatus
        • Tape Application Jig
    • Engineered Powders News
    • Safety Data Sheets (SDSs)
    • Daily Metal Prices
    • Conflict Minerals Report Request
    • ISO 9001:2015 Certification
    • Contact Us
  • Analytical Controls
    • Capabilities
      • Electroanalytical Methods
      • Data Analysis
      • Volumetric Analysis
    • Process Control Products
      • Real Time Analyzer (RTA)
        • RTA 3D
        • RTA Classic
        • ACE
        • SSF RTA 3D
        • PHD Option
      • EBA
        • EBA 3D
        • EBA 3D: Plus Option
        • EBA Classic
        • Technic Elevate Analyzer
      • Automatic Process Titrator
        • Maestro
        • NextChem Analyzer Support
    • Electrochemical Research Instrumentation
  • About
    • Contact Us
    • News & Events
      • Upcoming Trade Shows
      • Recent Trade Shows
    • Environmental Stewardship
    • Industry Partners
    • Conflict Minerals Reporting
    • Resources
      • Resource Library
      • Videos
      • Useful Tools
      • Daily Metal Prices
      • FAQ
    • Careers
      • Engineering Manager
      • Sales Support Associate
    • Global Facilities
      • Distributors
    • Technic SDS Access