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Process Results (12) Request More Information
Circudep DM AC 170
PCB specific: Accelerator for Direct metalization.
CIRCUDEP DM AC 170 is the final step in the Direct Metallization plating process. It is used after the CIRCUDEP DM CT 60 activator solution and produces the final conductive coating.
Circudep DM CC 124
PCB specific: Cleaner Conditioner for Direct Metallization.
CIRCUDEP DM CC 124 is a concentrated blend of surfactants and wetting agents designed to clean the copper foil surfaces of printed circuit boards. It contains conditioning agents which activate glass fibers and epoxy.
Circudep DM CT 60
PCB specific: Catalyst for direct metalization.
CIRCUDEP DM CT 60 is designed to help produce a conductive coating on non-conductive surfaces for Direct Metallization.
Circudep DM PD 55
PCB specific: Catalyst predip for Direct Metalization.
CIRCUDEP DM PD 55 is an acidic-salts solution designed to improve the efficiency of the Catalyst.
Circudep EC AC 77
PCB specific: Accelerator, electroless copper process.
CIRCUDEP EC AC 77 is a non-fluoride product that optimizes catalyst activity on non-conductive substrates, providing void-free electroless copper deposits.
CIRCUDEP EC CC 18
PCB specific: Cleaner Conditioner for Electroless Copper process.
CIRCUDEP EC CC 18 contains conditioning agents which activate glass fibers, epoxy and other non- conductive materials, allowing for a reliable absorption of the palladium catalyst in Electroless Copper processing.
Circudep EC CT 74
PCB specific: Catalyst for Electroless Copper.
CIRCUDEP EC CT 74 provides a highly charged colloid that promotes a uniform, highly adherent electroless copper deposit.
Circudep EC EC 92
PCB specific: Electroless Copper bath.
CIRCUDEP EC EC 92 is a medium-depth electroless copper system engineered to deposit a pure, fine-grained, equiaxed copper. CIRCUDEP EC EC 92 is engineered to work with today’s sophisticated non-conductive substrates.
Circudep EC PD 70
PCB specific: Catalyst predip for Electroless Copper.
CIRCUDEP EC PD 70 is a neutral solution that prepares non-conductive substrate materials for uniform absorption of the palladium catalyst.
Circudep G 3500
PCB specific: Cleaner conditioner for metallization of rigid and flex PCBs.
CIRCUDEP G 3500 is the next-generation Alkaline Cleaner Conditioner designed for Graphite systems.
Circudep G 4300
PCB specific.
CIRCUDEP G 4300 is a fine particle graphite-based direct metallization process specifically formulated for use in horizontal flood conveyor systems.