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Process Results (3) Request More Information
Elevate Cu 6320
Electrolytic acid copper process specifically engineered to provide excellent throwing power and distribution. This process maintains superior performance over a wide range of current densities.
Elevate Cu 6340
Copper plating process capable of depositing copper at 40-60 ASF with virtually no internal stress in the deposit.
Elevate Cu 6370
High speed copper plating bath that is capable of plating at a nominal rate of 4 microns per minute. Excellent WIW and WID coplanarity can be achieved on a variety of feature types such as copper pillar and RDL.