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Process Results (3) Request More Information
Elevate AuSn 8020
Deposits a eutectic gold-tin alloy with a melting point between 280° C and 320° C.
Elevate Gold 7934
High purity, soft gold plating
A cyanide based gold plating process that produces a deposit that exhibits excellent functional performance such as wire bonding and solderability from a very stable and simple to operate solution.
Elevate Gold 7990 NBV
Electrolytic sulfite gold process for semiconductor applications that produces pure, soft gold deposits. Operates at an optimum acidic pH of 6.6, making it compatible with almost all photoresists. It produces a bright deposit without the use of harmful grain refiners like thallium and arsenic. Provides excellent coplanarity and step coverage. Can be used for plating several different applications (thicknesses ranging from 0.5 - 100 microns) without major modifications to the solution and can be used on a variety of tool sets.