Technic Printed Circuit chemistry provides chemical solutions for technical aspects like zero defects, high aspect ratios, blind micro vias, high Tg material, fine pitch devices, and high temperature processing. In addition, Technic advanced chemistries are engineered to reduce environmental footprint through on site reclaim of metals, use of concentrates, lead free final finishes and biodegradable products. At the same time reducing process cost through increased production capacity, reduced raw material usage, and use of concentrates.
Technic Final Finishes are qualified and production proven for eutectic, lead-free processing, wire bonding, touch contacts as well as other types of interconnection.
Technic offers a variety of Acid Copper solutions for printed circuit board applications.
Electrolytic Nickel and Gold
Technic Electrolytic Nickel and Gold processes have been specifically engineered to provide the widest operating window for tab or pattern plating of nickel and hard or soft gold.
Technic offers solutions for metallization of die-electric materials specializing in flexible substrates while reducing environmental impact associated with electroless copper.
Preparation of the copper surface in PCB fabrication is key to adhesion of resists and any subsequent plating operation. Technic offers a number of microetchant solutions to provide the best surface for success.