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Graphite Process Chemistry

Graphite Based Metallization

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Circudep 4000

Circudep 4000 is a highly stable and economical, graphite based direct metallization system for use with horizontal flood conveyorized process equipment. The full process sequence is comprised of three chemical stages offering a low cost and high-speed, reliable alternative to Electroless Copper. Combined with our cleaner/conditioner Circudep 3500, Circudep 4000 provides highly effective coverage for both rigid and flexible PCB applications.

Circudep 4000 and Circudep 3500 cleaner/conditioner are available in both Europe and Asia and provide the following key advantages:

  • High process yields resulting in low-cost manufacturing.
  • Shorter process cycle allowing for less equipment and reduced chemical costs.
  • Leading-edge process performance
  • Green chemistry eliminating formaldehyde and copper

Circudep 3500 - Cleaner Conditioner

Graphite Cleaner Conditioner - Technic Circudept 3500

Circudep 3500 is a unique formulation providing excellent conditioning performance on a wide variety of substrates including polyimide, Rogers, and FR-4.

Advantages:

  • Mildly alkali cleaner with a high powered conditioning agent
  • Low-temperature operation, eliminating high power consumption and lengthy startup times.
  • Excellent cleaning properties eliminating oxidation and oils such as fingerprints from the copper surfaces.
  • Superb conditioning agent that provides uniform absorption of the Circudep 4000 graphite particles.

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Circudep 4000 - Graphite Metalization Process

Graphite Process -Technic Circudep 4000

Circudep 4000 is a proprietary formulation offering great performance on a wide variety of substrates for rigid and flexible circuitry, including some of the most difficult to plate substrates and features.

Advantages:

  • Stable graphite solution with small particle sizes between 0.3 and 0.7 μm, making it ideal for blind vias and high aspect ratio holes.
  • Low operating temperature providing reduced operating costs and resulting in minimal copper attack and a longer solution life.
  • High process yields capable of treating 135 square meters of surface area per liter of concentrate.

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  • Excellent coverage and adhesion to Flex multilayer
    Excellent coverage and adhesion to Flex multilayer
  • Makes coverage of micro-blind vias possible
    Makes coverage of micro-blind vias possible
  • SEM blind via after Circuprep 4000 System
    SEM blind via after Circuprep 4000 System
  • Excellent coverage micro-through vias
    Excellent coverage micro-through vias
  • No post separation
    No post separation

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  • Applications
    • Semiconductor
      • Chemistry: Fabrication & Packaging Materials
        • Copper
        • Nickel & Tin
        • Precious Metals
        • Photoresist Strippers
        • Etchants
        • Cleaners
      • Chemistry: High Purity
      • Equipment: Research & Development
    • Components, Lead Frames, Connectors
      • ECLC Chemistry
        • Connectors
        • Lead Frames/LED Substrate Applications
        • Active & Passive Components
      • ECLC Equipment
    • Printed Circuit Boards
      • Chemistry
        • Final Finishes
          • ENIG & ENEPIG
        • Electrolytic Copper
        • Electrolytic Nickel & Precious Metals
        • Metallization
        • Microetchants
      • Imaging Products
      • Process Control - EBA
      • Equipment
    • Industrial
      • Process Chemistry
      • Equipment
      • Anodizing Chemistry
      • Anodizing Equipment
    • Solar
      • Chemistry
      • TechniSol UV-PR
      • Engineered Powder & Flake
    • Decorative
      • Cleaners & Pretreatment
      • Plating Chemistry
      • Colorings, Coatings, and Paints
      • Post Treatment
      • Equipment
    • Medical
      • Chemistry
      • Equipment
    • 3D-Printing
      • Chemistry
      • Equipment
    • Application Support
      • Application Guides
      • Application Notes
  • Chemistry
  • Equipment
    • Automated Systems
      • Hoist Systems
        • Cantilever/Sidearm
        • Rail/Rim Runner
        • Overhead Hoist
        • Hoist Automation
        • Hoist Retrofits
      • Batch Systems
        • Barrels
        • Vibratory
        • SBE Technology
      • Specialty Loose Parts
        • Single Parts (MP300)
        • Selective Pin (CDP2000)
        • Panels (MP100)
        • Cut Strip (Leadframes)
        • Finger Plater (FFP)
        • Single Piece (MP500)
      • Continuous
        • Reel to Reel
        • Roll-to-Roll (MP200)
      • Turnkey
    • Capabilities
      • Advanced Engineered Systems
    • Manual Lines
      • Wet Benches/Modules
      • Tank Lines
    • Laboratory and R&D
      • Mini Lines
      • High Speed Reel to Reel Test Cells
      • Wafer Plating Test Cells
    • Parts, Supplies & Accessories
      • Consoles, Work Stations, Hoods, Benches & Tables
      • Mazerustar Planetary Mixers
        • Demonstration Videos
      • Amp Hour Meters, Timers & Chemical Feeders
      • Anodes, Baskets, Bags & Hooks
      • Filtration
      • Precious Metal Recovery
      • Rectifiers
      • Tanks & Auxiliary Equipment
      • Ultrasonic and Aqueous Cleaners & Dryers
      • Selective Plating
    • Process
      • Anodizing
      • Electropolishing
  • Engineered Powders
    • Applications
    • Products
    • Global Representatives
    • Equipment
      • Conductivity Test Apparatus
        • Tape Application Jig
    • Engineered Powders Support
    • Engineered Powders News
    • Engineered Powders Resources
  • Analytical Controls
    • Capabilities
      • Electroanalytical Methods
      • Data Analysis
      • Volumetric Analysis
    • Process Control Products
      • Real Time Analyzer (RTA)
        • RTA 3D
        • RTA Classic
        • ACE
        • SSF RTA 3D
        • PHD Option
      • EBA
        • EBA 3D
        • EBA 3D: Plus Option
        • EBA Classic
        • Technic Elevate Analyzer
      • Automatic Process Titrator
        • Maestro
        • NextChem Analyzer Support
    • Electrochemical Research Instrumentation
  • About
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      • Project Engineer/Mechanical Designer
    • Global Facilities
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