Electrolytic Copper

• Low current density processing for improved distribution on demanding designs
• Increased production capacity on standard product
• The superior throwing power of Techni CU 2900 results in uniform deposits with good ductility and a fine-grained, equiaxed structure.
• One-component system for amp-hour based replenishment. Individual components are available for optimization of specific applications.

• Technic CU128 is a high-speed DC acid copper designed for use in high flow plating cells like Technic MP200
• Excellent throwing power with higher current density when compared to competitive processes.
• Can be used with Soluble Anodes or Technic ISA insoluble anode system

• Technic CU135 is designed to be used with Technic ISA insoluble anode system in high throw applications where lower current densities are used.
• Technic CU135 provides better throwing power at higher current density when compared to competitive processes and delivers excellent distribution.
• Higher throughput and higher first pass yields for fine pitch structures typical in advanced electronics.

Technic ISA Insoluble Anode System: The Technic ISA system eliminates high consumption of additives and utilizes copper oxide to maintain copper concentration in the plating solution. By eliminating soluble anodes, the Technic ISA system provides;

• A defect free surface by eliminating a major source of nodules
• Improved plating distribution by providing a consistent anode area
• Improved deposit performance by eliminating high breakdown of organic additives
• Technic ISA performance is guaranteed in conjunction Technic acid copper additives or with Technic plating equipment.