Nickel and Tin for Advanced Packaging Applications
Nickel and tin are critical deposits for advanced packaging platforms. Technic’s range of products are formulated to maximize the performance of the package and are designed for ease of use in high volume production.
Elevate® Ni 5910
All purpose nickel sulfamate bath that provides a low stress and ductile deposit. Low maintenance and long bath life are prominent attributes of this process.
Elevate® Ni 5950
Elevate® Ni 5950 eliminates concerns related to toxicity with a boric acid free nickel deposit. Technic’s Elevate® Ni 5950 is capable of running at a wide current density range of 1–10 ASD. Deposit properties such as stress, ductility, tensile strength, elongation, grain structure and corrosion resistance are all similar to or better than a standard nickel solution. In addition, Elevate® Ni 5950 uses all liquid components making the process very fab friendly.
Elevate® Tin 5011
A high-speed pure tin process that produces a deposit that is fine-grained with low organic impurities and is whisker resistant. The process is formulated to provide excellent coplanarity across the wafer.