Advanced Metal Etchants for Packaging Applications
Etching is used in semiconductor fabrication and packaging to chemically remove layers from the surface of a wafer during the manufacturing process. Etching is a critically important process with every wafer undergoing many etching steps before completion.
Technic supplies a range of specialty products for each phase of production and specific application in the etch process. Technic's line of TechniEtch® products provide superior results and consistently high performance.
As with all Technic products, we offer our extensive experience and unparalleled customer service that has made Technic a respected resource for quality around the globe.
Gold and copper etchant offering minimal metal undercutting while performing an effective etching of each or both metals.
Ideal for seed layer removal, this selective gold etchant performs with a minimum of Cu sidewall erosion and is Sn and alloy compatible.
Ti/TiN/TiW etchant with low undercut and high Cu, Al, Sn compatibility.
Iodine based metal etchant for use with selective gold applications.
Copper seed layer etchant providing selective etch and high loading capacity for UBM and RDL applications. Used also for selective Cu/Ni in UBM stack because of its great etching metal selectivity.