Preparing a Copper Surface prior to a Resist or Plating Application

Preparation of the copper surface in PCB fabrication is key to adhesion of resists and any subsequent plating operation. The topography that is created provides a mechanical bond which improves as micro roughness increases. Scratches from scrubbing, cause inconsistent resist adhesion, resulting in increased opens and shorts as the line width and space goes down. To fabricators, this means a lower first pass yield and higher costs of operation due to increased scrap rates. Microetchants, such as sodium persulfate, have been replacing scrubbing operations for the past several years so that finer features can be developed with resists.

TechniEtch 1118 - Better Typography at a Lower Cost

TechniEtch 1118 is a proprietary replacement for persulfate and peroxide based microetches. It can be utilized prior to application of plating and etch resists or prior to copper and electrolytic or electroless nickel. TechniEtch 1118 is designed to produce better topography with lower etch depth and with higher copper loading levels. This translates into more panels per volume of etch solution.

  • TechniEtch 1118 calculation
    TechniEtch 1118 calculation
  • TechniEtch 1118 etch rate vs copper concentration on ED copper
    TechniEtch 1118 etch rate vs copper concentration on ED copper
  • TechniEtch 1688 Etch Depth vs Temp
    TechniEtch 1688 Etch Depth vs Temp