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ShareTechnic Electrolytic Nickel and Gold processes have been specifically engineered to provide the widest operating window for tab or pattern plating of nickel and hard or soft gold. The individual products in the process have been specially formulated to provide the optimum metal distribution for improved throwing power and surface distribution. The gold plating processes exhibit excellent adhesion and have minimal attack on aqueous resists, increasing the operating window and allowing the chemistry to be operated with reduced gold concentrations without resist lifting.
Techni Nickel HT-2
Techni Nickel HT-2 is a high throw electrolytic nickel that has been designed to improve the through-hole metallization of printed circuit boards. It will improve throwing power and surface to hole distribution and is ideally suited for plating blind vias or high aspect ratio through hole. The Techni Nickel HT-2 process deposits a low stress nickel with excellent cosmetic and mechanical properties.
Orosene® 80RC
Orosene® 80RC is the industry standard colbalt brightened acid gold process. The deposit meets the requirements for type I and II, gradeC, of ASTM B488-01. The solution is compatible with aqueous dry film, has a high tolerance for metallic impurities, and provides uniform appearance over a wide current density range
Orosene® 990HS
Orosene® 990 HS is a high speed, high efficiency hard gold formulation with excellent dry film compatibility and consistent deposit performance. Orosene® 990 HS provides improved gold distribution, reducing gold consumption and lower process costs. Orosene® 990 HS has demonstrated high efficiency and a high build rate while maintaining consistent deposit thickness.
TechniGold® 434HS
TechniGold® 434 HS is ideally suited to meet the pure soft gold requirements of wire bonding. The deposit meets Mil-G-45204C, Type III, Grade A requirements. TechniGold® 434 HS deposit is 99.99+ % purity has a hardness of of 80-90 Knoop 25 and contact resistance of 0.3 milliohms/cm2.
