New Barrier Layer Coatings to Enable Reduced Gold Consumption in Electronic Applications
Cranston, RI, USA - Technic Inc. has announced the commercial release of the first products to be marketed under the Goldeneye gold reduction technology platform: Techni Nickel HT-2 and Techni NiPhos 611 barrier layer electroplating processes for connector applications.
Techni Nickel HT-2 provides a pure, ductile, low-stress nickel deposit with excellent thickness distribution. By depositing a more uniform nickel layer underneath the gold deposit, the corrosion properties of the overall coating system are improved. The Techni NiPhos 611 process produces an electrodeposited nickelphosphorous (Ni-P) alloy containing 6-11% phosphorous. The incorporation of phosphorous in the nickel deposit results in a significant improvement in the corrosion resistance.
Optimal performance is obtained through use of a duplex barrier layer system consisting of pure nickel deposit from the Techni HT-2 process, followed by nickel-phosphorous electroplated from Techni NiPhos 611.
Both Techni Nickel HT-2 and Techni NiPhos 611 barrier layer coatings can dramatically enhance the corrosion resistance of gold plated contacts, which in turn enables lower gold thicknesses to be plated without any sacrifice in functionality. No modifications are required to implement these barrier layer coatings in existing reel-to-reel plating lines and no special rectification is needed. Techni Nickel HT-2 and Techni NiPhos 611 are true “drop-in” replacements for existing nickel sulfamate solutions commonly used in the industry.
– Rob Schetty, VP, Technic Advanced Technology Division