New High-Performance Copper Plating Process for a wide range of feature types
Cranston, RI, USA – Technic is pleased to announce the full commercial release of Elevate Cu 6370, a versatile electrolytic copper plating process for semiconductor advanced packaging applications.
Over the past two years, Elevate Cu 6370 has been in limited release and used in a wide variety of applications. With slight modifications to the electrolyte, Elevate Cu 6370 has been highly successful in tight RDL patterns, standard pillars, 200-micron tall mega pillars, bump on passivation structures, and other advanced packaging structures. The process is ideally suited for a variety of semiconductor advanced packaging platforms, including FOWLP (Fan-Out Wafer Level Packaging) Fan-In Wafer Level Packaging, and 2.5D/3D.
Elevate Cu 6370 can be adjusted to plate at lower speeds of 1 – 2 microns per minute or very high speeds of 6 – 7 microns per minute. It can also be tuned to provide a domed, flat or dished deposit.
As the copper ECD market for advanced packaging continues to grow, customers are looking for a single solution to meet a variety of feature specifications. Elevate Cu 6370 has demonstrated consistent and proven success, offering versatility, high performance, and low Cost of Ownership (CoO).