TechniFlex LCL 1000-423


New Black Liquid Soldermask for Flexible Fine Pitch Direct Imaging


    • Ideal for demanding assembly conditions
    • No cracking – durable and flexible
    • Less than 10 microns of undercut
    • High resolution
    • Excellent chemical resistance

TechniFlex LCL 1000F/423M is ideally suited for demanding assembly conditions, including hot-bar soldering or multiple lead-free reflows. Extensive testing of TechniFlex 423M has shown no cracking after multiple 180o bends, even when processing 12-micron polyimide substrate.


TechniFlex LCL 1000F/423M provides exceptionally fine resolution in a matte black product. With less than 10 microns of undercut, TechiFlex LCL1000F/423M consistently provides high resolution on 50-micron solder dams with excellent chemical resistance to ENIG, ENEPIG, Ag and Sn finishes.


TechniFlex LCL 1000F/423M is available in two versions:

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