| System Differences | MP Series | Conventional |
|---|---|---|
| Typical Ventilation Requirement | 1000 CFM | 10,000 CFM |
| Automatic Load/Unload Option | available | unavailable |
| Maintenance Accessibility | very simple | very difficult |
| Typical Number of Operators | 1-4 | 6-12 |
| Heating/Cooling costs | 10% of conventional | very high |
| Typical Cycle Time | under 20 minutes | over 2 hours |
| Typical Floor Space | 30-50% of conventional | large footprint |
| Utilities Cost | 10-20% of conventional | very high |
| Part-to-Part Plating Uniformity | Less than 10% | Greater than 100% |
| Install Time | 2 weeks | 3 months |
| Facilities Preparation | low | very high |
In proportion to the amount of quality product produced, conventional rack plating systems typically consume gross amounts of plant resources and materials. Unreasonable amounts of scrap and rework frequently result.
Conventional rack plating systems utilize large open-air chemical tanks that consume huge quantities of electricity, steam, and chilled water for solution temperature control and ventilation. It is difficult to contain or enclose these large open plating tanks so special plating rooms are required.
Tremendous volumes of cleaning and plating solutions are dragged from process to rinse, creating the need for large waste treat facilities to handle the corresponding high volumes of rinse water.
Because of the difficulty in automating loading and unloading of racks and flight bars, large amounts of labor are consumed. Working in a plating room is an unpleasant, physically demanding, sometimes dangerous experience. Repetitive motion injuries are everyday concerns.
The MP Series is the antithesis of the conventional rack plater. The MP Series is packed with features that address the limitations of conventional systems. Besides offering tremendous cost savings opportunities, the MP Series offers advantages in repeatability and flexibility as well.

Chemistry Overview | Precious Metals | Non-Precious Metals | Pretreatment | Specialty | PWB | Semiconductor
|
Bringing lean manufacturing to the plating shop |
![]() |