Different applications often demand a different equipment design approach, hence, three products are currently offered. Although different by design, the MP300, MP400, and MP500 share three key design concepts.
Concept 1 - A transport system that incorporates single piece flow. This basic design concept enables parts to move continuously through the plating process without the requirement for staging areas with large in-process inventories.
Concept 2 - A process cell design that seals the process environment from the shop environment. Sealed construction enables systems to be located anywhere in the factory improving overall flow of materials to and from the wet processing center.
Concept 3 - A plating cell design that enables plating at very high speeds. High-speed plating allows plating times to be greatly reduced. Smaller plating times results in smaller plating tanks, lower utilities costs, and faster turn-around times.

Chemistry Overview | Precious Metals | Non-Precious Metals | Pretreatment | Specialty | PWB | Semiconductor
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Bringing lean manufacturing to the plating shop |
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