MP200 Wet Processing

Clip conveyor speed and material infeed speed must be perfectly matched. Strip tension is carefully controlled as material is transferred to plating clips and subsequently through preclean, plate, rinse, and dry stations. In the plating station, cathode contact is made direct to the plating clip by the cathode brushpack.

Material transfer to plating clips Material transfer to plating clips Floating cathode brushback Floating cathode brushback and top cover seal Soluble anode plating cell Soluble anode plating cell with top cover off

Patented plating cells are available in several different models depending on the application. For best distribution, cells featuring insoluble anodes are available with panel layout based and recipe driven reconfigurable geometry. Soluble anode types feature adjustable sloping anodes with three-dimensional shields. In both cases cathode agitation is by direct solution impingement. Agitation spargers are designed to center and flatten material, guarding against wrinkling and ensuring consistent anode cathode spacing. Many other unique cell design features contribute to superior performance and maintainability.


Fluid stop type sealPreclean and Rinse Stations feature high volume low pressure flood bars offering superior overall coverage, and reduced overspray and dragout. Process cells are sealed air wipes or other methods that reduce potential of damage to fragile materials.

Right: Fluid stop type seal with air wipe


Fluid stop type sealAs the material exits plating and rinsing processes it is released by the overhead conveyor, final rinsed, and dried. Plating clips are frequently stripped before returning to load station. Plated material continues on to rewind station where processing is completed.

Left: Clip release station

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