MP200 System Overview
Superior processing uniformity is the driving force behind vertical substrate positioning in modern electroplating systems. Applying vertical plating concepts to wide web continuous flexible circuit processing presents difficult challenges. Very thin substrates can be subject to handling problems when inserted vertically into an immersion plating cell. Preventing material damage and controlling cathode current distribution are just two of the challenges. SFT answers these challenges and more by successfully combining advanced wet and web processing technologies into a single system, the MP200.
 Above: Framed cut sheet flex plating system Right: Roll-to-roll flex plating system |
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