MP200 Features and Benefits

Total computer control	Reduces number of operators to a single operator for entire plating machine.
Moving cathode	Eliminates part-to-part current density and anode targeting variations. Facilitates high speed plating in conjunction with patented cell design. Enables smaller overall machine footprint.
Air Wipes	Reduces dragout and waste treatment up to 75%. Reduces water consumption by up to 90%. Reduces chemical usage by up to 50%.
Sealed plating cell	Reduces ventilation utility by up to 90% Reduces heating losses Dramatically reduces electrical utility cost. Allows machine to be located outside of dedicated plating area.
Computer splice tracking	Tracks individual lot and roll location. Automatically adjusts plating parameters and ramps rectifiers to achieve constant current density. Enables small lot sizes and multiple lot types to be run simultaneously.
Modular construction	Easily expandable processes No special floor preparation required. Fast installation in 2 weeks or less.
Three-dimensional plating shield	Enables super-flat plating uniformity across wide web shield widths
Low drag seals	Extremely low material drag at immersion cell entrance and exit seals Fluid stop non-roller based design Eliminates risk of marking or damaging material
Solution sparging	Unique design helps guide material through immersion cell Provides optimum uniform solution agitation
Sloped anode	Offsets potential plating non-uniformity from single edge material contact
On-line clip stripping	Provides continuous removal of metal plated onto cathode contact.
Submerged anode	Basket connection to anode buss is below solution return weir level, provide self cleaning feature and superior conductivity.
Easy anode fill access	Easy access to soluble anode baskets for replenishment of anodes. Hinged doors in process cell covers Anode baskets equipped with hoppers. Catwalks to either side of plating cell.
Rectifier control	Built-in prewired computer integrated high resolution switch mode rectifiers. Side to side and multi-zone ramped plating current control for conventional and vapor deposited substrates is available. Computer calculates real time cell area and adjusts amperage preset to maintain constant CD.
Plating cell membranes	Screen type membranes separate anode and cathode plating compartments to keep anode sludge from entering plating compartment.
Glass rod guides	Glass rod style material guidance system prevents contact with plating cell components and subsequent material marking.
Automatic fill system	Process cell fills via low pressure port until proper cell level achieved then automatically switches to high flow sparge mode preventing uncontrolled solution splashing and inadvertent damage to anode film.
Air dispersal and tortuous path	Solution return to reservoir via submerged drop tubes to prevent aeration. Reservoirs equipped with baffles to enable entrained air to settle out before being recirculated by transfer pumps.
Sloped bottom reservoirs	Enable total drainage and clean operation.
Air wipes	Each station is equipped with airwipes to reduce dragout.
Dryer	High flow low-pressure non-evaporative dryer prevents material staining.