MP200 Installations & Applications

Over the years SFT has installed literally hundreds of systems for many varied applications. Following is a partial list of MP200 installations including type of system, specific process, and materials processed.

PROCESS	TYPE	THICKNESS RANGE in MILS	PLATING THICKNESS in MICRONS	WIDTH in INCHES	TYPE	SPEED RANGE (FPM)
Cu Seed	Roll to Roll	0.5-2.0	5/18-35/35	28	PI	2-18
Cu Pattern	Roll to Roll	1-2	18/18-35/35	28	PI-RA Flex	2-4
Strip	Sheet-Sheet	1-2		24	PI	6
Etch	Sheet-Sheet	1-2		24	PI	6
Develop	Sheet-Sheet	1-2		24	PI	6
Ni/Au Plate	Roll to Roll	1-2	5-2.5	12	PI	8
DES	Roll to Roll	1-3		12	SST	3-6
Cu Panel	Roll to Roll	2	18/18-35/35	22	PI	10
Ni/Au Plate	Roll to Roll	2	5-2.5	12	PI	8
Cu Seed	Roll to Roll	1-2	5/5-18/18	14	PI	18
Cu Seed	Roll to Roll	1-2	5/5-18/18	14	PI	12
Cu Pattern	Roll to Roll	2	18/18	14	PI	6
Ni/Au Plate	Roll to Roll	2	5-2.5	8	PI	4
Cu Seed	Roll to Roll	2	18-35	14	PI	8
Cu Seed	Roll to Roll	2	18-35	14	PI	3
Cu Seed	Roll to Roll	2	18/18-35/35	14	PI	3
EPR	Roll to Roll	2	18-35	14	PI	3
Cu Panel	Roll to Roll	2	18/18-35/35	14	PI	3